NXP MCF5274CVM166 IC, 32BIT MCU, COLDFIRE V2, BGA-256
10 Weeks
表面贴装
256-LBGA
YES
69
-40°C~85°C TA
Tray
MCF527x
1997
e1
不用于新设计
3 (168 Hours)
256
5A992
锡银铜
ALSO REQUIRES 3.3V SUPPLY
8542.31.00.01
BOTTOM
BALL
260
1.5V
1mm
40
MCF5274
S-PBGA-B256
不合格
1.6V
1.4V
External
166MHz
64K x 8
1.4V~1.6V
MICROPROCESSOR, RISC
Coldfire V2
DMA, WDT
83MHz
ROMless
32-Bit
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
32
24
YES
YES
32
固定点
YES
17mm
1.6mm
17mm
ROHS3 Compliant
MPU, 32BIT, DRAGONFIRE, 196MAPBGA
12 Weeks
表面贴装
196-LBGA
YES
62
-40°C~85°C TA
Tray
MCF537x
2005
e1
不用于新设计
3 (168 Hours)
196
3A991.A.1
锡银铜
-
8542.31.00.01
BOTTOM
BALL
260
1.5V
1mm
40
MCF53721
S-PBGA-B196
不合格
1.6V
1.4V
External
240MHz
32K x 8
1.4V~3.6V
MICROPROCESSOR, RISC
Coldfire V3
DMA, POR, PWM, WDT
80MHz
ROMless
32-Bit
EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
32
24
YES
YES
32
固定点
YES
15mm
1.75mm
15mm
ROHS3 Compliant
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NXP MCF5274CVM166 IC, 32BIT MCU, COLDFIRE V2, BGA-25610 Weeks表面贴装256-LBGAYES69-40°C~85°C TATrayMCF527x1997e1不用于新设计3 (168 Hours)2565A992锡银铜ALSO REQUIRES 3.3V SUPPLY8542.31.00.01BOTTOMBALL2601.5V1mm40MCF5274S-PBGA-B256不合格1.6V1.4VExternal166MHz64K x 81.4V~1.6VMICROPROCESSOR, RISCColdfire V2DMA, WDT83MHzROMless32-BitEBI/EMI, Ethernet, I2C, SPI, UART/USART, USB3224YESYES32固定点YES17mm1.6mm17mmROHS3 Compliant
MPU, 32BIT, DRAGONFIRE, 196MAPBGA12 Weeks表面贴装196-LBGAYES62-40°C~85°C TATrayMCF537x2005e1不用于新设计3 (168 Hours)1963A991.A.1锡银铜-8542.31.00.01BOTTOMBALL2601.5V1mm40MCF53721S-PBGA-B196不合格1.6V1.4VExternal240MHz32K x 81.4V~3.6VMICROPROCESSOR, RISCColdfire V3DMA, POR, PWM, WDT80MHzROMless32-BitEBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG3224YESYES32固定点YES15mm1.75mm15mmROHS3 Compliant
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