IC MCU 32BIT ROMLESS 256MAPBGA
10 Weeks
表面贴装
256-LBGA
YES
83
-40°C~85°C TA
Tray
MCF5301x
2005
e1
Obsolete
3 (168 Hours)
256
5A992
Tin/Silver/Copper (Sn/Ag/Cu)
8542.31.00.01
BOTTOM
BALL
260
40
MCF53014
S-PBGA-B256
不合格
1.32V
1.08V
Internal
240MHz
128K x 8
1.08V~3.6V
MICROPROCESSOR
Coldfire V3
DMA, PWM, WDT
80MHz
ROMless
32-Bit
EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG
32
24
YES
YES
32
固定点
YES
ROHS3 Compliant
-
-
-
-
-
MPU MCF53xx RISC 32-Bit 240MHz 196-Pin MAP-BGA Tray
12 Weeks
表面贴装
196-LBGA
YES
62
-40°C~85°C TA
Tray
MCF537x
2005
e1
不用于新设计
3 (168 Hours)
196
3A991.A.1
Tin/Silver/Copper (Sn/Ag/Cu)
8542.31.00.01
BOTTOM
BALL
260
40
MCF5372L
S-PBGA-B196
不合格
1.6V
1.4V
External
240MHz
32K x 8
1.4V~3.6V
MICROPROCESSOR, RISC
Coldfire V3
DMA, POR, PWM, WDT
80MHz
ROMless
32-Bit
EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
32
24
YES
YES
32
固定点
YES
ROHS3 Compliant
1.5V
1mm
15mm
15mm
1.75mm