NXP MCF5373LCVM240 MPU, 32BIT, COLDFIRE V3, 196MAPBGA
12 Weeks
表面贴装
196-LBGA
YES
62
-40°C~85°C TA
Tray
MCF537x
2005
e1
不用于新设计
3 (168 Hours)
256
5A002.A.1
Tin/Silver/Copper (Sn/Ag/Cu)
8542.31.00.01
BOTTOM
BALL
260
1.5V
1mm
40
MCF5373L
S-PBGA-B256
不合格
1.6V
1.4V
External
240MHz
32K x 8
1.4V~3.6V
MICROPROCESSOR, RISC
Coldfire V3
DMA, POR, PWM, WDT
80MHz
ROMless
32-Bit
EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
32
24
YES
YES
32
固定点
YES
17mm
1.6mm
17mm
ROHS3 Compliant
-
NXP MCF5275LCVM166 IC, MPU, 32BIT, COLDFIRE V2, 196BGA
12 Weeks
表面贴装
196-LBGA
YES
61
-40°C~85°C TA
Tray
MCF527x
1997
-
不用于新设计
3 (168 Hours)
196
5A002.A.1
Tin/Silver/Copper - with Nickel barrier
8542.31.00.01
BOTTOM
BALL
260
1.5V
1mm
40
MCF5275
S-PBGA-B196
不合格
1.6V
1.4V
External
166MHz
64K x 8
1.4V~1.6V
MICROPROCESSOR, RISC
Coldfire V2
DMA, WDT
83MHz
ROMless
32-Bit
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
32
24
YES
YES
32
固定点
YES
15mm
1.6mm
15mm
ROHS3 Compliant
ALSO REQUIRES 3.3V SUPPLY