Processors - Application Specialized i.MX6D AUTO
624-FBGA, FCBGA
YES
Automotive grade
-40°C~125°C TJ
Tray
i.MX6D
2011
e1
不用于新设计
3 (168 Hours)
624
5A992
Tin/Silver/Copper (Sn/Ag/Cu)
8542.31.00.01
BOTTOM
BALL
260
1.4V
0.8mm
40
MCIMX6
S-PBGA-B624
1.5V
1.225V
852MHz
MICROPROCESSOR
ARM® Cortex®-A9
16
YES
YES
64
固定点
YES
1.8V 2.5V 2.8V 3.3V
10/100/1000Mbps (1)
2 Core 32-Bit
有
LPDDR2, LVDDR3, DDR3
USB 2.0 + PHY (4)
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Multimedia; NEON™ SIMD
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Keypad, LCD
SATA 3Gbps (1)
21mm
2.16mm
ROHS3 Compliant
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
SOC OMAP3 ARM Cortex-A8 515-Pin POP-FCBGA
515-VFBGA, FCBGA
-
L2 Cache, ROM, SRAM
0°C~90°C TJ
Tray
OMAP-35xx
-
e1
活跃
3 (168 Hours)
515
5A992.C
Tin/Silver/Copper (Sn/Ag/Cu)
-
BOTTOM
BALL
260
1.8V
0.4mm
-
OMAP3503
-
-
-
-
DIGITAL SIGNAL PROCESSOR, OTHER
ARM® Cortex®-A8
-
YES
YES
-
浮点
YES
1.8V 3.0V
-
1 Core 32-Bit
无
LPDDR
USB 1.x (3), USB 2.0 (1)
HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
Multimedia; NEON™ SIMD
-
LCD
-
12mm
-
ROHS3 Compliant
ACTIVE (Last Updated: 6 days ago)
6 Weeks
表面贴装
515
yes
600MHz
515
1.8V
1.35V
I2C, SPI, UART, USB
1.89V
1.71V
32b
ARM
64000
3
15
MROM
NO
SINGLE
900μm
12mm
610μm
无铅