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MPC857TCZQ66B备选型号: MPC855TCZQ66D4

MPC857TCZQ66B

NXP USA Inc.

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)

357-BBGA
357-PBGA (25x25)
2004
MPC8xx
Tray
-40°C~115°C TA
Obsolete
3 (168 Hours)
MPC857
66MHz
MPC8xx
3.3V
10Mbps (1), 10/100Mbps (1)
1 Core 32-Bit
无
DRAM
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Communications; CPM
Non-RoHS Compliant
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MPC855TCZQ66D4

NXP USA Inc.

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)

357-BBGA
-
1997
MPC8xx
Tray
-40°C~95°C TA
不用于新设计
3 (168 Hours)
MPC855
66MHz
-
3.3V
10Mbps (1), 10/100Mbps (1)
1 Core 32-Bit
无
DRAM
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Communications; CPM
Non-RoHS Compliant
12 Weeks
YES
e0
357
3A991.A.2
Tin/Lead/Silver (Sn/Pb/Ag)
8542.31.00.01
BOTTOM
BALL
245
3.3V
1.27mm
30
S-PBGA-B357
3.465V
3.3V
3.135V
MICROPROCESSOR, RISC
50MHz
32
32
YES
YES
32
固定点
YES
25mm
2.52mm
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集成电路（IC）相关产品

图片	产品型号	品牌	分类	封装	描述	对比
	MPC855TCZQ66D4	NXP USA Inc.	嵌入式 - 微处理器	357-BBGA	MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)	对比
	MPC855TCVR66D4	NXP USA Inc.	嵌入式 - 微处理器	357-BBGA	MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)	对比