-
IC BUF NON-INVERT 5.5V 8DSBGA
6 Weeks
表面贴装
表面贴装
8-XFBGA, DSBGA
8
-40°C~125°C TA
Cut Tape (CT)
74LVC
e1
yes
ACTIVE (Last Updated: 2 days ago)
1 (Unlimited)
8
EAR99
Tin/Silver/Copper (Sn/Ag/Cu)
TR
1.8V
BOTTOM
BALL
260
2
0.5mm
74LVC2G241
3-State
Non-Inverting
3.3V
2
2
4.3 ns
10μA
12.5 ns
LVC/LCX/Z
Buffer, Inverting
Buffer, Non-Inverting
1
ENABLE LOW/HIGH
0.5mA
2
UNIDIRECTIONAL
N/A
5.5V
500μm
1.25mm
2.25mm
310μm
无
ROHS3 Compliant
无铅
-
-
-
-
-
-
-
-
-
IC BUF NON-INVERT 5.5V 8DSBGA
6 Weeks
表面贴装
表面贴装
8-XFBGA, DSBGA
8
-40°C~85°C TA
Cut Tape (CT)
74LVC
e1
yes
ACTIVE (Last Updated: 1 day ago)
1 (Unlimited)
8
EAR99
Tin/Silver/Copper (Sn/Ag/Cu)
TR
3.3V
BOTTOM
BALL
260
3
0.5mm
74LVC3G34
Push-Pull
Non-Inverting
-
3
-
3.2 ns
10μA
7.9 ns
LVC/LCX/Z
Buffer, Inverting
Buffer, Non-Inverting
1
-
-
-
-
-
5.5V
500μm
1.25mm
2.25mm
310μm
无
ROHS3 Compliant
无铅
Copper, Silver, Tin
SMD/SMT
32mA
50pF
32mA
3
NO
无SVHC
-
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