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TSW-113-08-L-S备选型号: 68000-113HLF

TSW-113-08-L-S

Samtec Inc.

SAMTEC TSW-113-08-L-S Board-To-Board Connector, Vertical, TSW Series, 13 Contacts, Header, 2.54 mm, Through Hole, 1 Rows

0 Weeks
通孔
通孔
Square
Plastic
Gold
-55°C~125°C
Bulk
TSW
2005
e3
yes
Discontinued
1 (Unlimited)
Solder
Header
13
1
Male
Push-Pull
NO
NO
NO
NO
公母针
NO
GENERAL PURPOSE
Straight
0.100 2.54mm
板对板或电缆
All
0.100 2.54mm
0.200 5.08mm
Unshrouded
2.54mm
Tin
Black
0.530 13.46mm
550V
7.6A
2.54mm
33mm
2.54mm
10.0μin 0.25μm
UL94 V-0
无SVHC
ROHS3 Compliant
无铅
-
-
-
-
-
-
-
-
-
-
-
-
-
-
68000-113HLF

Amphenol ICC (FCI)

Headers & Wire Housings 13P SR UNSHRD HRD .76 GOLD OVER NI

8 Weeks
通孔
通孔
Square
Thermoplastic
Gold or Gold, GXT™
-
Bulk
BERGSTIK® II
-
-
-
活跃
1 (Unlimited)
Solder
Header
13
1
Male
Push-Pull
-
-
-
-
公母针
-
-
Straight
0.100 2.54mm
板对板
All
0.100 2.54mm
0.095 2.41mm
Unshrouded
2.54mm
-
Black
0.425 10.80mm
1.5kV
-
-
33.02mm
-
30.0μin 0.76μm
UL94 V-0
-
符合RoHS标准
-
GXT, Gold
125°C
-65°C
Black
2.54mm
2.41mm
3A
Black
13
Male
2.41mm
5GOhm
5.84mm
UL94 V-0
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图片	产品型号	品牌	分类	封装	描述	对比
	68000-113HLF	Amphenol ICC (FCI)	矩形连接器 - 针座，公插针		Headers & Wire Housings 13P SR UNSHRD HRD .76 GOLD OVER NI	对比