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W978H6KBQX2I备选型号: 71V35761S166BGGI

W978H6KBQX2I

Winbond Electronics

IC SDRAM 256MBIT 400MHZ 168WFBGA

表面贴装
168-WFBGA
168
168-WFBGA (12x12)
Volatile
-40°C~85°C TA
Tray
2016
Obsolete
3 (168 Hours)
85°C
-40°C
1.14V~1.95V
400MHz
Parallel
256Mb 16M x 16
400MHz
DRAM
Parallel
15ns
ROHS3 Compliant
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
71V35761S166BGGI

Integrated Device Technology (IDT)

SRAM 128Kx36 SYNC 3.3V PIPELINED BURST SRAM

-
BGA
119
-
166MHz
-
-
2009
Discontinued
3 (168 Hours)
85°C
-40°C
-
166MHz
Parallel
512kB
-
-
-
-
符合RoHS标准
表面贴装
e1
yes
119
Tin/Silver/Copper (Sn/Ag/Cu)
流水线结构
BOTTOM
BALL
260
1
3.3V
30
119
3.3V
INDUSTRIAL
3.465V
3.135V
1
330mA
3.5 ns
3-STATE
17b
4.5 Mb
0.035A
COMMON
Synchronous
36b
14mm
2.36mm
22mm
2.15mm
无
无铅
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	71V35761S200BGG	Integrated Device Technology (IDT)	存储器	BGA	SRAM 128Kx36 SYNC 3.3V PIPELINED BURST SRAM	对比