IC SOC CORTEX-A9 800MHZ 676FCBGA
10 Weeks
Copper, Silver, Tin
表面贴装
676-BBGA, FCBGA
130
0°C~100°C TJ
Tray
Zynq®-7000
2010
e1
活跃
4 (72 Hours)
676
3A991.D
Tin/Silver/Copper (Sn/Ag/Cu)
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
BOTTOM
BALL
未说明
1V
1mm
800MHz
未说明
S-PBGA-B676
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
1.05V
950mV
256KB
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
DMA
110 ps
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
MCU, FPGA
ARM
YES
2
Kintex™-7 FPGA, 275K Logic Cells
343800
3.37mm
ROHS3 Compliant
-
-
-
-
-
-
-
-
-
-
IC SOC CORTEX-A9 800MHZ 676FCBGA
10 Weeks
-
-
676-BBGA, FCBGA
130
-40°C~100°C TJ
Tray
Zynq®-7000
2010
e1
活跃
4 (72 Hours)
676
3A991.D
Tin/Silver/Copper (Sn/Ag/Cu)
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
BOTTOM
BALL
未说明
1V
1mm
-
未说明
S-PBGA-B676
-
-
-
256KB
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
DMA
-
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
MCU, FPGA
-
YES
-
Kintex™-7 FPGA, 275K Logic Cells
-
3.37mm
ROHS3 Compliant
YES
8542.39.00.01
1.05V
0.95V
800MHz
800MHz
256000
CAN; ETHERNET; I2C; SPI; UART; USB
27mm
27mm