440 In Stock

-

表面贴装

44-TQFP

44-TQFP (10x10)

36

32

-40°C ~ 85°C (TA)

Tray

MAX® 7000A

活跃

EPM7032

系统内可编程

600

3 V ~ 3.6 V

7.5ns

2

N/A

-

表面贴装

256-BGA

YES

256-FBGA (17x17)

256

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

40

2.375 V

85 °C

有

EPM1270F256C4N

BGA

SQUARE

Intel Corporation

活跃

212

CPLD, MAX II

INTEL CORP

2.625 V

1.19

212

980

BGA, BGA256,16X16,40

网格排列

0°C ~ 85°C (TJ)

Tray

MAX® II

e1

活跃

锡银铜

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

260

1 mm

compliant

EPM1270

S-PBGA-B256

不合格

1.5/3.3,2.5/3.3 V

OTHER

系统内可编程

8.1 ns

0 DEDICATED INPUTS, 212 I/O

2.2 mm

闪存 PLD

MACROCELL

980

YES

2.5V, 3.3V

6.2ns

1270

YES

17 mm

17 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

PLASTIC/EPOXY

QFP144,.87SQ,20

2.5 V

40

2.375 V

85 °C

有

EPM1270T144C4N

LFQFP

SQUARE

Intel Corporation

活跃

116

INTEL CORP

2.625 V

1.19

116

980

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

0°C ~ 85°C (TJ)

Tray

MAX® II

e3

活跃

Matte Tin (Sn)

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

EPM1270

S-PQFP-G144

不合格

1.5/3.3,2.5/3.3 V

OTHER

系统内可编程

8.1 ns

0 DEDICATED INPUTS, 116 I/O

1.6 mm

闪存 PLD

MACROCELL

980

YES

2.5V, 3.3V

6.2ns

1270

YES

20 mm

20 mm

N/A

-

表面贴装

100-TFBGA

YES

100-MBGA (6x6)

100

BGA100,11X11,20

2.5 V

40

2.375 V

有

EPM570M100I5N

BGA

SQUARE

Intel Corporation

活跃

76

INTEL CORP

2.625 V

1.34

76

440

BGA, BGA100,11X11,20

网格排列

3

PLASTIC/EPOXY

-40°C ~ 100°C (TJ)

Tray

MAX® II

e1

活跃

EAR99

锡银铜

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

260

0.5 mm

compliant

EPM570

S-PBGA-B100

不合格

1.5/3.3,2.5/3.3 V

系统内可编程

8.7 ns

0 DEDICATED INPUTS, 76 I/O

闪存 PLD

MACROCELL

440

YES

2.5V, 3.3V

5.4ns

570

YES

513 In Stock

-

表面贴装

100-LBGA

YES

100-FBGA (11x11)

100

PLASTIC/EPOXY

BGA100,10X10,40

2.5 V

40

2.375 V

85 °C

有

EPM570F100C5N

LBGA

SQUARE

Intel Corporation

活跃

76

INTEL CORP

2.625 V

0.75

76

440

LBGA, BGA100,10X10,40

GRID ARRAY, LOW PROFILE

3

0°C ~ 85°C (TJ)

Tray

MAX® II

e1

活跃

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

260

1 mm

compliant

EPM570

S-PBGA-B100

不合格

1.5/3.3,2.5/3.3 V

OTHER

系统内可编程

8.7 ns

0 DEDICATED INPUTS, 76 I/O

1.7 mm

闪存 PLD

MACROCELL

440

YES

2.5V, 3.3V

5.4ns

570

YES

11 mm

11 mm

881 In Stock

-

表面贴装

100-LBGA

YES

100-FBGA (11x11)

100

PLASTIC/EPOXY

BGA100,10X10,40

2.5 V

30

2.375 V

85 °C

有

EPM240F100C5N

LBGA

SQUARE

Intel Corporation

活跃

80

INTEL CORP

2.625 V

1.36

80

192

LBGA, BGA100,10X10,40

GRID ARRAY, LOW PROFILE

3

0°C ~ 85°C (TJ)

Tray

MAX® II

e1

活跃

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

260

1 mm

compliant

EPM240

S-PBGA-B100

不合格

1.5/3.3,2.5/3.3 V

OTHER

系统内可编程

7.5 ns

0 DEDICATED INPUTS, 80 I/O

1.7 mm

闪存 PLD

MACROCELL

192

YES

2.5V, 3.3V

4.7ns

240

YES

11 mm

11 mm

N/A

-

表面贴装

256-BGA

256-FBGA (17x17)

212

980

0°C ~ 85°C (TJ)

Tray

MAX® II

活跃

EPM1270

系统内可编程

2.5V, 3.3V

6.2ns

1270

N/A

-

N/A

-

NO

84

40 MHz

WPGA

SQUARE

Rochester Electronics LLC

活跃

64

ROCHESTER ELECTRONICS LLC

5.73

PGA

WPGA,

GRID ARRAY, WINDOW

CERAMIC, METAL-SEALED COFIRED

-55 °C

5 V

125 °C

EPM5192GM883B-2

LABS INTERCONNECTED BY PIA; 12 LABS; 192 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK

CMOS

PERPENDICULAR

PIN/PEG

2.54 mm

unknown

84

S-CPGA-P84

MILITARY

MILITARY

45 ns

7 DEDICATED INPUTS, 64 I/O

4.96 mm

UV PLD

MACROCELL

7

28.45 mm

28.45 mm

N/A

-

表面贴装

256-BGA

256-FBGA (17x17)

164

256

0°C ~ 70°C (TA)

Tray

MAX® 7000B

Obsolete

EPM7256

系统内可编程

5000

2.375 V ~ 2.625 V

7.5ns

16

N/A

-

表面贴装

44-LCC (J-Lead)

YES

44-PLCC (16.59x16.59)

44

3

PLASTIC/EPOXY

LDCC44,.7SQ

3.3 V

40

3 V

70 °C

有

EPM3032ALC44-10N

103.1 MHz

QCCJ

SQUARE

Altera Corporation

Transferred

34

ALTERA CORP

3.6 V

3.1

LCC

34

32

PLASTIC, LCC-44

CHIP CARRIER

0°C ~ 70°C (TA)

Tray

MAX® 3000A

e3

有

Obsolete

EAR99

Matte Tin (Sn) - annealed

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

J BEND

245

1.27 mm

unknown

EPM3032

44

S-PQCC-J44

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

10 ns

0 DEDICATED INPUTS, 34 I/O

4.572 mm

EE PLD

600

MACROCELL

32

YES

3 V ~ 3.6 V

10.0ns

2

YES

16.5862 mm

16.5862 mm

N/A

-

表面贴装

144-LQFP

144-TQFP (20x20)

116

256

0°C ~ 70°C (TA)

Tray

MAX® 3000A

Obsolete

EPM3256

系统内可编程

5000

3 V ~ 3.6 V

7.5ns

16

N/A

-

表面贴装

100-TQFP

YES

100-TQFP (14x14)

100

PLASTIC/EPOXY

TQFP100,.63SQ

2.5 V

30

2.375 V

85 °C

无

EPM240T100C4

TFQFP

SQUARE

Intel Corporation

活跃

80

INTEL CORP

2.625 V

1.39

80

192

TFQFP, TQFP100,.63SQ

FLATPACK, THIN PROFILE, FINE PITCH

3

0°C ~ 85°C (TJ)

Tray

MAX® II

e0

活跃

EAR99

锡铅

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

235

0.5 mm

compliant

EPM240

S-PQFP-G100

不合格

1.5/3.3,2.5/3.3 V

商业扩展

系统内可编程

6.1 ns

0 DEDICATED INPUTS, 80 I/O

1.2 mm

闪存 PLD

MACROCELL

192

YES

2.5V, 3.3V

4.7ns

240

YES

14 mm

14 mm

N/A

-

表面贴装

100-TQFP

YES

100-TQFP (14x14)

100

Altera

TFQFP, TQFP100,.63SQ

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

2.5 V

30

2.375 V

85 °C

无

EPM570T100C3

TFQFP

SQUARE

Intel Corporation

活跃

76

INTEL CORP

2.625 V

5

76

440

Bulk

活跃

0°C ~ 85°C (TJ)

Tray

MAX® II

e0

活跃

EAR99

锡铅

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

235

0.5 mm

compliant

EPM570

S-PQFP-G100

不合格

1.5/3.3,2.5/3.3 V

商业扩展

系统内可编程

5.4 ns

0 DEDICATED INPUTS, 76 I/O

1.2 mm

闪存 PLD

MACROCELL

440

YES

2.5V, 3.3V

5.4ns

570

YES

14 mm

14 mm

N/A

-

表面贴装

44-TQFP

44-TQFP (10x10)

36

64

0°C ~ 70°C (TA)

Tray

MAX® 7000S

Obsolete

EPM7064

系统内可编程

1250

4.75 V ~ 5.25 V

10.0ns

4

559 In Stock

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

QFP144,.87SQ,20

2.5 V

40

2.375 V

有

EPM570T144I5N

LFQFP

SQUARE

Intel Corporation

活跃

116

INTEL CORP

2.625 V

1.17

116

440

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40°C ~ 100°C (TJ)

Tray

MAX® II

e3

活跃

EAR99

Matte Tin (Sn) - annealed

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

EPM570

S-PQFP-G144

不合格

1.5/3.3,2.5/3.3 V

系统内可编程

8.7 ns

0 DEDICATED INPUTS, 116 I/O

1.6 mm

闪存 PLD

MACROCELL

440

YES

2.5V, 3.3V

5.4ns

570

YES

20 mm

20 mm

N/A

-

表面贴装

64-TQFP Exposed Pad

64-EQFP (7x7)

54

440

-40°C ~ 100°C (TJ)

Tray

MAX® V

活跃

系统内可编程

1.71 V ~ 1.89 V

9.0ns

570

N/A

-

YES

256

EPM7256BFI256-7

3

164

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA, BGA256,16X16,40

BGA256,16X16,40

SQUARE

网格排列

Obsolete

30

8.19

无

2.625 V

2.375 V

2.5 V

188.7 MHz

INTEL CORP

Intel Corporation

e0

3A991

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

220

1 mm

compliant

S-PBGA-B256

不合格

1.8/3.3,2.5 V

INDUSTRIAL

5 ns

0 DEDICATED INPUTS, 164 I/O

3.5 mm

EE PLD

MACROCELL

256

YES

YES

17 mm

17 mm

N/A

-

表面贴装

208-BFQFP Exposed Pad

208-RQFP (28x28)

164

256

-40°C ~ 85°C (TA)

Tray

MAX® 7000

Obsolete

EPM7256

EE PLD

5000

4.5 V ~ 5.5 V

20.0ns

16

N/A

-

表面贴装

44-TQFP

44-TQFP (10x10)

36

32

0°C ~ 70°C (TA)

Tray

MAX® 7000B

Obsolete

EPM7032

系统内可编程

600

2.375 V ~ 2.625 V

7.5ns

2

N/A

-

表面贴装

44-TQFP

44-TQFP (10x10)

34

32

0°C ~ 70°C (TA)

Tray

MAX® 3000A

Obsolete

EPM3032

系统内可编程

600

3 V ~ 3.6 V

4.5ns

2

N/A

-

表面贴装

144-LQFP

144-TQFP (20x20)

116

440

0°C ~ 85°C (TJ)

Tray

MAX® II

活跃

EPM570

系统内可编程

2.5V, 3.3V

5.4ns

570

N/A

-

表面贴装

44-TQFP

44-TQFP (10x10)

36

64

0°C ~ 70°C (TA)

Tray

MAX® 7000

Obsolete

EE PLD

1250

4.75 V ~ 5.25 V

15.0ns

4

N/A

-

表面贴装

208-BFQFP Exposed Pad

208-RQFP (28x28)

153

560

0°C ~ 70°C (TA)

Tray

MAX® 9000

Obsolete

EPM9560

系统内可编程

12000

4.75 V ~ 5.25 V

15.0ns

35

N/A

-

表面贴装

240-BFQFP Exposed Pad

240-RQFP (32x32)

Altera

Obsolete

175

480

Tray

0°C ~ 70°C (TA)

Tray

MAX® 9000

Obsolete

EPM9480

系统内可编程

10000

4.75 V ~ 5.25 V

15.0ns

30