263 In Stock

-

表面贴装

表面贴装

356-LBGA

YES

356

356-BGA (35x35)

356

SQUARE

Transferred

274

ALTERA CORP

3.6 V

3.77

BGA

1/4 NPT

2

LPG3-D0042N

0-10 psi

Dwyer Instruments

无

274

BGA-356

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA356,26X26,50

3.3 V

30

3 V

70 °C

无

LBGA

0°C ~ 70°C (TA)

FLEX-10K®

e0

无

Obsolete

3A991

Tin/Lead (Sn63Pb37)

70 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

3 V ~ 3.6 V

BOTTOM

BALL

220

1.27 mm

not_compliant

250 MHz

EPF10K50

356

S-PBGA-B356

310

不合格

3.3 V

3.3 V

COMMERCIAL

3.6 V

3 V

2.5 kB

10 mA

2.5 kB

0.4 ns

310

4 DEDICATED INPUTS, 274 I/O

1.63 mm

可加载 PLD

2880

20480

116000

360

360

REGISTERED

2880

4

35 mm

35 mm

N/A

-

表面贴装

表面贴装

672-BBGA, FCBGA

YES

672

672-FBGA (27x27)

不锈钢

672

无

BGA

SQUARE

Obsolete

492

INTEL CORP

1.575 V

5.25

74 mm

58 mm

Straight

ADE2N3002SSNK2

Round

Crouse-Hinds Industrial Products

电缆接线盒

无

492

BGA, BGA672,26X26,40

网格排列

4

PLASTIC/EPOXY

BGA672,26X26,40

1.5 V

30

1.425 V

85 °C

0°C ~ 85°C (TJ)

APEX II

e0

Obsolete

3A001.A.7.A

Tin/Lead (Sn/Pb)

85 °C

0 °C

Metallic

8542.39.00.01

现场可编程门阵列

CMOS

1.425 V ~ 1.575 V

BOTTOM

BALL

220

1 mm

compliant

376 MHz

EP2A40

S-PBGA-B672

480

不合格

1.5 V

1.5,1.5/3.3 V

OTHER

1.575 V

1.425 V

80 kB

80 kB

1.94 ns

480

492 I/O

2.1 mm

可加载 PLD

38400

655360

3000000

3840

3840

MACROCELL

38400

27 mm

27 mm

N/A

-

YES

1932

840

Compliant

BGA, BGA1932,44X44,40

网格排列

PLASTIC/EPOXY

BGA1932,44X44,40

无

5SGXMABN3F45I3

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

5.3

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1932

840

不合格

850 mV

0.85,1.5,2.5,2.5/3,1.2/3 V

100 mA

14.1 Gbps

840

现场可编程门阵列

952000

359200

48

952000

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

1.89 V

7.85

QFP

92

TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

1.8 V

30

1.71 V

85 °C

无

EP20K30ETC144-2X

160 MHz

LFQFP

SQUARE

Altera Corporation

Transferred

92

ALTERA CORP

0°C ~ 85°C (TJ)

APEX-20KE®

e0

无

Obsolete

EAR99

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

1.71 V ~ 1.89 V

QUAD

鸥翼

220

0.5 mm

unknown

EP20K30

144

S-PQFP-G144

84

不合格

1.8,1.8/3.3 V

OTHER

2.69 ns

84

4 DEDICATED INPUTS, 92 I/O

1.6 mm

可加载 PLD

1200

24576

113000

120

MACROCELL

1200

4

20 mm

20 mm

1 In Stock

-

表面贴装

1508-BBGA, FCBGA

YES

1508-FBGA (30x30)

1508

734

BGA, BGA1508,39X39,40

网格排列

3

PLASTIC/EPOXY

BGA1508,39X39,40

1.2 V

40

1.15 V

85 °C

有

EP2SGX130GF1508C5N

640 MHz

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.25 V

5.24

0°C ~ 85°C (TJ)

Stratix® II GX

e1

活跃

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

1.15 V ~ 1.25 V

BOTTOM

BALL

245

1 mm

compliant

EP2SGX130

S-PBGA-B1508

734

不合格

1.2,1.2/3.3,3.3 V

OTHER

734

132540 CLBS

3.5 mm

现场可编程门阵列

132540

6747840

6627

5.962 ns

132540

132540

40 mm

40 mm

5537 In Stock

-

表面贴装

表面贴装

400-BGA

YES

400

400-FBGA (21x21)

400

SQUARE

Intel Corporation

Obsolete

Cyclone Devices

INTEL CORP

1.575 V

7.18

301

--

8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000

4000

Compliant

BGA, BGA400,20X20,40

网格排列

3

PLASTIC/EPOXY

BGA400,20X20,40

1.5 V

40

1.425 V

85 °C

有

EP1C4F400C8N

275 MHz

BGA

0°C ~ 85°C (TJ)

Cyclone®

e1

活跃

--

SMD/SMT

3A991

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.425 V ~ 1.575 V

BOTTOM

BALL

260

1 mm

compliant

275.03 MHz

EP1C4

S-PBGA-B400

301

不合格

1.5 V

1.5,1.5/3.3 V

OTHER

1.575 V

1.425 V

9.6 kB

9.6 kB

301

4000 CLBS

2.2 mm

现场可编程门阵列

4000

78336

250 MHz

400

400

4000

4000

21 mm

21 mm

无

无SVHC

无铅

587 In Stock

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

5.18

171

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

3.3 V

30

3 V

85 °C

无

EPF6024AQC208-1

172 MHz

FQFP

SQUARE

Intel Corporation

Obsolete

171

INTEL CORP

3.6 V

0°C ~ 85°C (TJ)

FLEX 6000

e0

Obsolete

3A991

Tin/Lead (Sn/Pb)

CAN ALSO BE USED 24000 LOGIC GATES

8542.39.00.01

现场可编程门阵列

CMOS

3 V ~ 3.6 V

QUAD

鸥翼

220

0.5 mm

compliant

EPF6024

S-PQFP-G208

171

不合格

2.5/3.3,3.3 V

OTHER

171

4 DEDICATED INPUTS, 171 I/O

4.1 mm

可加载 PLD

1960

24000

196

MACROCELL

1960

4

28 mm

28 mm

48 In Stock

-

表面贴装

324-BGA

YES

324-FBGA (19x19)

324

5.14

196

BGA, BGA324,18X18,40

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

1.8 V

30

1.71 V

85 °C

无

EP20K60EFC324-3

160 MHz

BGA

SQUARE

Intel Corporation

Obsolete

196

INTEL CORP

1.89 V

0°C ~ 85°C (TJ)

APEX-20KE®

e0

Obsolete

EAR99

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

1.71 V ~ 1.89 V

BOTTOM

BALL

220

1 mm

compliant

EP20K60

S-PBGA-B324

188

不合格

1.8,1.8/3.3 V

OTHER

3.56 ns

188

4 DEDICATED INPUTS, 196 I/O

3.5 mm

可加载 PLD

2560

32768

162000

2560

MACROCELL

2560

4

19 mm

19 mm

250 In Stock

-

表面贴装

208-BFQFP

208-PQFP (28x28)

171

-40°C ~ 100°C (TJ)

FLEX 6000

Obsolete

3 V ~ 3.6 V

EPF6024

1960

24000

196

500 In Stock

-

表面贴装

1152-BBGA, FCBGA Exposed Pad

YES

1152

1152-FBGA (35x35)

1152

544

Compliant

BGA, BGA1152,34X34,40

网格排列

3

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

1.1 V

未说明

1.07 V

100 °C

有

5.29

1.13 V

INTEL CORP

Obsolete

Intel Corporation

SQUARE

BGA

5AGXFA5H4F35I5N

-40°C ~ 100°C (TJ)

Arria V GX

e1

活跃

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

1.07 V ~ 1.13 V

BOTTOM

BALL

未说明

1 mm

compliant

5AGXFA5

S-PBGA-B1152

544

不合格

1.13 V

1.1,1.2/3.3,2.5 V

INDUSTRIAL

1.6 MB

1.6 MB

6.5536 Gbps

544

7170 CLBS

2.7 mm

现场可编程门阵列

190000

13284352

800 MHz

8962

8962

5

24

7170

190000

544

35 mm

35 mm

无铅

N/A

-

表面贴装

1932-BBGA, FCBGA

YES

1932

1932-FBGA, FC (45x45)

1932

840

Compliant

BGA, BGA1932,44X44,40

网格排列

PLASTIC/EPOXY

BGA1932,44X44,40

-40 °C

0.85 V

0.82 V

100 °C

无

5SGSED6N3F45I3L

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0.88 V

5.3

-40°C ~ 100°C (TJ)

Stratix® V GS

活跃

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

0.82 V ~ 0.88 V

BOTTOM

BALL

1 mm

compliant

5SGSED6

S-PBGA-B1932

840

不合格

880 mV

0.85,1.5,2.5,2.5/3,1.2/3 V

INDUSTRIAL

6.5 MB

14.1 Gbps

840

22000 CLBS

3.9 mm

现场可编程门阵列

583000

54553600

220000

220000

3

48

22000

583000

840

45 mm

45 mm

含铅

2945 In Stock

• 1: ¥1,040.241569
• 10: ¥981.359965
• 100: ¥925.811291
• 500: ¥873.406879
查看所有的价格

-

表面贴装

表面贴装

164-TFBGA

164

164-MBGA (8x8)

92

--

Compliant

-40°C ~ 100°C (TJ)

Cyclone® III

活跃

--

100 °C

-40 °C

1.15 V ~ 1.25 V

437.5 MHz

EP3C16

1.2 V

1.25 V

1.15 V

63 kB

63 kB

15408

516096

315 MHz

963

963

7

无铅

649 In Stock

• 1: ¥4,875.949285
• 10: ¥4,599.952157
• 100: ¥4,339.577507
• 500: ¥4,093.941044
查看所有的价格

-

表面贴装

240-BFQFP Exposed Pad

YES

240-RQFP (32x32)

240

Altera

182

INTEL CORP

2.625 V

5.09

182

Bulk

EPF10K200

活跃

FQFP, QFP240,1.3SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP240,1.3SQ,20

2.5 V

30

2.375 V

70 °C

无

EPF10K200SRC240-1X

FQFP

SQUARE

Intel Corporation

Obsolete

0°C ~ 70°C (TA)

FLEX-10KS®

e0

Obsolete

3A991

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

2.375 V ~ 2.625 V

QUAD

鸥翼

220

0.5 mm

compliant

EPF10K200

S-PQFP-G240

182

不合格

2.5,2.5/3.3 V

COMMERCIAL

0.3 ns

182

182 I/O

4.1 mm

可加载 PLD

9984

98304

513000

1248

MIXED

9984

32 mm

32 mm

535 In Stock

• 1: ¥74,748.356669
• 10: ¥72,290.480339
• 25: ¥71,787.964582
• 50: ¥71,288.941994
查看所有的价格

-

表面贴装

表面贴装

1206 (3216 Metric)

YES

1206

1932

KOA Speer Electronics, Inc.

INTEL CORP

0.93 V

5.38

Tape & Reel (TR)

SG73P2

活跃

480

Compliant

BGA, BGA1932,44X44,40

网格排列

PLASTIC/EPOXY

BGA1932,44X44,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AX115U4F45I3SG

BGA

SQUARE

Intel Corporation

活跃

-55°C ~ 155°C

SG73P-RT

0.126 L x 0.063 W (3.20mm x 1.60mm)

±1%

活跃

2

±200ppm/°C

732 kOhms

100 °C

-40 °C

厚膜

0.333W, 1/3W

8542.39.00.01

现场可编程门阵列

CMOS

0.87 V ~ 0.93 V

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1932

480

不合格

-

0.9 V

INDUSTRIAL

8.2 MB

480

3.65 mm

现场可编程门阵列

1150000

68857856

427200

427200

1150000

Anti-Sulfur, Automotive AEC-Q200, Pulse Withstanding

0.028 (0.70mm)

45 mm

45 mm

AEC-Q200

N/A

-

表面贴装

1517-BBGA, FCBGA

1517

1517-FBGA (40x40)

Panduit Corp

Bulk

Obsolete

696

Compliant

FBGA-1517

有

5SGSMD8K3F40I3LN

生命周期结束

INTEL CORP

-40°C ~ 100°C (TJ)

-

活跃

100 °C

-40 °C

0.82 V ~ 0.88 V

5SGSMD8

880 mV

7.3 MB

14.1 Gbps

695000

60968960

262400

262400

3

36

696

无铅

N/A

-

表面贴装

1517-BBGA, FCBGA

YES

1517

1517-FBGA (40x40)

1517

696

Compliant

BGA, BGA1517,39X39,40

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

0.9 V

0.87 V

85 °C

有

5SGXMA3K2F40C2N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0.93 V

5.25

0°C ~ 85°C (TJ)

Stratix® V GX

活跃

3A001.A.7.A

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

0.87 V ~ 0.93 V

BOTTOM

BALL

1 mm

compliant

5SGXMA3

S-PBGA-B1517

696

不合格

930 mV

0.85,1.5,2.5,2.5/3,1.2/3 V

OTHER

2.8 MB

14.1 Gbps

696

12830 CLBS

3.5 mm

现场可编程门阵列

340000

23704576

128300

128300

2

36

12830

340000

696

40 mm

40 mm

无

无铅

736 In Stock

• 1: ¥231.419830
• 10: ¥218.320595
• 100: ¥205.962827
• 500: ¥194.304552
查看所有的价格

-

表面贴装

表面贴装

256-LBGA

YES

256

256-FBGA (17x17)

256

INTEL CORP

1.25 V

1.33

178

--

Compliant

LBGA, BGA256,16X16,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.2 V

未说明

1.15 V

100 °C

有

10M04DAF256I7G

416 MHz

LBGA

SQUARE

Intel Corporation

活跃

-40°C ~ 100°C (TJ)

MAX® 10

e1

活跃

--

Tin/Silver/Copper (Sn/Ag/Cu)

100 °C

-40 °C

OPERATES AT 2.5V NOMINAL VCC

8542.39.00.01

现场可编程门阵列

1.15 V ~ 1.25 V

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B256

178

不合格

1.2 V

INDUSTRIAL

23.6 kB

178

250 CLBS

1.55 mm

现场可编程门阵列

4000

193536

250

250

250

4000

17 mm

17 mm

N/A

-

表面贴装

表面贴装

1517-BBGA, FCBGA

YES

1517-FCBGA (40x40)

1517

588

Compliant

40 X 40 MM, ROHS COMPLIANT, FBGA-1517

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

0.9 V

未说明

0.87 V

100 °C

有

10AX057N1F40E1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.63

0°C ~ 100°C (TJ)

Arria 10 GX

Discontinued at Digi-Key

100 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

0.87 V ~ 0.98 V

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1517

588

不合格

0.9 V

OTHER

5 MB

588

3.5 mm

现场可编程门阵列

570000

42082304

217080

217080

570000

40 mm

40 mm

N/A

-

表面贴装

1932-BBGA, FCBGA

YES

1932

1932-FBGA, FC (45x45)

1932

840

Compliant

BGA, BGA1932,44X44,40

网格排列

PLASTIC/EPOXY

BGA1932,44X44,40

-40 °C

0.85 V

0.82 V

100 °C

无

5SGSED6N2F45I3L

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0.88 V

5.29

-40°C ~ 100°C (TJ)

Stratix® V GS

活跃

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

0.82 V ~ 0.88 V

BOTTOM

BALL

1 mm

compliant

5SGSED6

S-PBGA-B1932

840

不合格

880 mV

0.85,1.5,2.5,2.5/3,1.2/3 V

INDUSTRIAL

6.5 MB

14.1 Gbps

840

22000 CLBS

3.9 mm

现场可编程门阵列

583000

54553600

220000

220000

3

48

22000

583000

840

45 mm

45 mm

含铅

N/A

-

表面贴装

面板安装

572-BGA, FCBGA

YES

Bulkhead - Front Side Nut

572

Circular

铝合金

572-FBGA, FC (25x25)

Plastic

572

ITT Cannon, LLC

EP2AGX45DF25I5

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

6.25

Bulk

KJB7T

20

活跃

252

Non-Compliant

BGA, BGA572,24X24,40

网格排列

PLASTIC

BGA572,24X24,40

无

-65°C ~ 175°C

KJB

活跃

3A991

插座外壳

用于公引脚

53

100 °C

-40 °C

8542.39.00.01

Threaded

现场可编程门阵列

Crimp

CMOS

0.87 V ~ 0.93 V

BOTTOM

D

BALL

Unshielded

抗环境干扰

1 mm

compliant

500 MHz

EP2AGX45

Cadmium over Electroless Nickel

23-53

S-PBGA-B572

252

不合格

橄榄色

900 mV

0.9,1.2/3.3,1.5,2.5 V

不包括触点

930 mV

870 mV

429.4 kB

-

600 Mbps

252

现场可编程门阵列

42959

-

3517440

390 MHz

1805

1805

8

42959

-

-

无

830 In Stock

-

底座安装

672-BBGA, FCBGA

672-FBGA (27x27)

施耐德电气

500

EP2S30

Box

活跃

250 V

240 V

5,000,000 Cycles

-25°C ~ 70°C

XC

活跃

1.5A (AC), 100mA (DC)

1.15 V ~ 1.25 V

IP66/IP67 - Dust Tight, Water Resistant, Waterproof

EP2S30

Connector

Side Rotary, Roller

单刀双掷

On-On

10,000,000 Cycles

-

33880

1369728

1694

-

-

-

-

-

-

3088 In Stock

• 1: ¥226.388249
• 10: ¥213.573820
• 100: ¥201.484738
• 500: ¥190.079938
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-

表面贴装

表面贴装

256-LBGA

256

256-FBGA (17x17)

--

Miscellaneous

179

Compliant

-40°C ~ 100°C (TJ)

Cyclone® IV E

活跃

--

100 °C

-40 °C

1.15 V ~ 1.25 V

EP4CE6

1.2 V

1.24 V

1.16 V

33.8 kB

33.8 kB

6272

276480

6272

200 MHz

392

392

7

17 mm

17 mm

1080 In Stock

• 1: ¥125.134883
• 10: ¥118.051774
• 100: ¥111.369598
• 500: ¥105.065664
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1210 (3225 Metric)

1210

KOA Speer Electronics, Inc.

Tape & Reel (TR)

活跃

162

8542390000

-55°C ~ 155°C

SG73S-RT

0.126 L x 0.102 W (3.20mm x 2.60mm)

±1%

活跃

2

±200ppm/°C

422 Ohms

厚膜

1W

1.2V

-

15408

516096

963

Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant, Pulse Withstanding

0.028 (0.70mm)

-

2930 In Stock

• 1: ¥3,078.584627
• 10: ¥2,904.325120
• 100: ¥2,739.929358
• 500: ¥2,584.839015
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896-BGA

YES

896

896-FBGA (31x31)

896

480

--

8542390000

Compliant

BGA,

网格排列

3

PLASTIC/EPOXY

1.1 V

未说明

1.07 V

85 °C

有

5CGXFC7D6F31C7N

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.13 V

2

0°C ~ 85°C (TJ)

Cyclone® V GX

e1

活跃

--

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

0 °C

8542.39.00.01

1.07 V ~ 1.13 V

BOTTOM

BALL

未说明

1 mm

compliant

5CGXFC7

S-PBGA-B896

1.13 V

OTHER

962 kB

962 kB

3.125 Gbps

2 mm

现场可编程门阵列

149500

7880704

800 MHz

56480

56480

7

9

480

31 mm

31 mm

无铅

N/A

-

表面贴装

表面贴装

1517-BBGA, FCBGA

1517-FBGA (40x40)

600

Compliant

有

This product may require additional documentation to export from the United States.

1150000 LE

1

SMD/SMT

Intel

Intel / Altera

Arria 10 FPGA

0°C ~ 100°C (TJ)

Tray

Arria 10 GT

Obsolete

100 °C

0 °C

可编程逻辑集成电路

0.87 V ~ 0.93 V

8.2 MB

1150000

FPGA - Field Programmable Gate Array

68857856

427200

427200

FPGA - Field Programmable Gate Array