29 In Stock

-

表面贴装

表面贴装

144-BGA

YES

144

144-FBGA (13x13)

144

15°C/W

SQUARE

Intel Corporation

Obsolete

93

INTEL CORP

1.89 V

5.02

--

93

FINE LINE, BGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

Compliant

BGA144,12X12,40

1.8 V

30

1.71 V

25°C

无

EP20K100EFI144-2X

LBGA

-40°C ~ 100°C (TJ)

Bulk

欧司朗 OSTAR

e0

活跃

--

3A991

Tin/Lead (Sn/Pb)

100 °C

-40 °C

Amber

8542.39.00.01

现场可编程门阵列

CMOS

1.71 V ~ 1.89 V

BOTTOM

BALL

235

1 mm

compliant

250 MHz

EP20K100

S-PBGA-B144

85

不合格

1.8,1.8/3.3 V

1.89 V

1.71 V

6.5 kB

6.5 kB

2.5V

120°

2.02 ns

700mA

53 lm/W

85

4 DEDICATED INPUTS, 93 I/O

1.7 mm

可加载 PLD

1A

4160

92 lm (71 lm ~ 112 lm)

53248

263000

170 MHz

416

617nm (Typ)

416

MACROCELL

4160

4

13 mm

13 mm

含铅

365 In Stock

-

表面贴装

表面贴装

6-CLCC

YES

780

6-CLCC (7x5)

780

SQUARE

Intel Corporation

Obsolete

INTEL CORP

1.575 V

5.21

586

Compliant

BGA, BGA780,28X28,40

网格排列

3

PLASTIC/EPOXY

BGA780,28X28,40

1.5 V

40

1.425 V

85 °C

有

EP1S20F780C5N

BGA

-40°C ~ 85°C

Tray

FemtoClock® NG

e1

活跃

3A001.A.7.A

VCXO

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

3.135 V ~ 3.465 V

BOTTOM

BALL

245

1 mm

compliant

24.576MHz, 200MHz

IDT8N3DV85AC

S-PBGA-B780

586

不合格

1.5 V

1.5,1.5/3.3 V

商业扩展

1.575 V

1.425 V

203.8 kB

65 mA

203.8 kB

130mA

586

2132 CLBS

3.5 mm

现场可编程门阵列

18460

1669248

133 MHz

1846

1846

2132

18460

--

29 mm

29 mm

无铅

2400 In Stock

• 1: ¥874.996039
• 10: ¥825.467960
• 100: ¥778.743357
• 500: ¥734.663541
查看所有的价格

-

表面贴装

324-LFBGA

324

324-UBGA (15x15)

TE Connectivity Deutsch 连接器

Bag

DTS24Z11

活跃

176

--

Compliant

0°C ~ 85°C (TJ)

*

活跃

--

85 °C

0 °C

1.07 V ~ 1.13 V

5CEBA4

1.13 V

422.9 kB

422.9 kB

49000

3464192

800 MHz

18480

48000

7

176

无

无铅

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152

1152-FBGA (35x35)

1152

Free Hanging (In-Line)

Free Hanging (In-Line)

Hirose Electric Co Ltd

Bulk

50 Ohms

NFL-2LPHF

-

活跃

Female

6 GHz

-

0.81mm OD Coaxial Cable

552

Compliant

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.85 V

0.82 V

85 °C

有

5SGSMD5H1F35C2LN

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0.88 V

5.29

Female

-40°C ~ 90°C

N.FL

活跃

85 °C

0 °C

Black

8542.39.00.01

现场可编程门阵列

CMOS

0.82 V ~ 0.88 V

BOTTOM

BALL

-

1 mm

U.FL (UMCC) to U.FL (UMCC)

compliant

5SGSMD5

S-PBGA-B1152

552

不合格

880 mV

0.85,1.5,2.5,2.5/3,1.2/3 V

OTHER

5.6 MB

14.1 Gbps

552

17260 CLBS

3.6 mm

现场可编程门阵列

457000

U.FL (UMCC) Plug, Right Angle

U.FL (UMCC) Plug, Right Angle

46769152

172600

172600

2

24

17260

457000

552

-

19.69 (500.00mm)

35 mm

无铅

962 In Stock

• 1: ¥21,002.451442
• 10: ¥20,311.848586
• 25: ¥20,170.654010
• 50: ¥20,030.440927
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-

表面贴装

1152-BBGA, FCBGA

1152-FBGA (35x35)

Non-Compliant

384

有

320000 LE

+ 100 C

930 mV

- 40 C

24

870 mV

SMD/SMT

14987.5 LAB

965491

Intel

Intel / Altera

Arria 10 FPGA

-40°C ~ 100°C (TJ)

Tray

Arria 10 GX

活跃

可编程逻辑集成电路

0.87 V ~ 0.98 V

950 mV

320000

FPGA - Field Programmable Gate Array

21040128

119900

FPGA - Field Programmable Gate Array

528 In Stock

• 1: ¥627.293522
• 10: ¥591.786338
• 100: ¥558.289001
• 500: ¥526.687739
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-

表面贴装

324-LBGA

324

324-FBGA (19x19)

Glenair

零售包装

活跃

8542390000

150

Compliant

--

-40°C ~ 100°C (TJ)

*

活跃

--

100 °C

-40 °C

1.16 V ~ 1.24 V

EP4CGX22

1.2 V

1.24 V

1.16 V

94.5 kB

94.5 kB

2.5 Gbps

21280

774144

200 MHz

1330

1330

7

4

150

无

无铅

729 In Stock

• 1: ¥93,632.743741
• 10: ¥90,553.910778
• 25: ¥89,924.439693
• 50: ¥89,299.344283
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-

表面贴装

表面贴装

1517-BBGA, FCBGA

YES

1517-FCBGA (40x40)

1517

Intel Corporation

活跃

INTEL CORP

0.93 V

5.38

342

Compliant

BGA, BGA1517,39X39,40

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

0.9 V

未说明

0.87 V

100 °C

有

10AX115R1F40E1SG

BGA

SQUARE

0°C ~ 100°C (TJ)

*

活跃

100 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

0.87 V ~ 0.98 V

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1517

342

不合格

0.9 V

OTHER

8.2 MB

342

3.5 mm

现场可编程门阵列

1150000

68857856

427200

427200

1150000

40 mm

40 mm

N/A

-

表面贴装

表面贴装

780-BBGA, FCBGA

YES

780

780-FBGA (29x29)

780

EP4SE230F29C2

无

85 °C

0.87 V

30

0.9 V

488

Non-Compliant

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

5.29

0.93 V

INTEL CORP

生命周期结束

Intel Corporation

SQUARE

BGA

800 MHz

0°C ~ 85°C (TJ)

STRATIX® IV E

e0

活跃

锡铅

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

0.87 V ~ 0.93 V

BOTTOM

BALL

220

1 mm

compliant

EP4SE230

S-PBGA-B780

488

不合格

900 mV

0.9,1.2/3,1.5,2.5 V

OTHER

2.1 MB

2.1 MB

488

9120 CLBS

3.4 mm

现场可编程门阵列

228000

17544192

600 MHz

9120

9120

9120

228000

29 mm

29 mm

230 In Stock

-

表面贴装

表面贴装

0402

YES

1152

1152-FBGA (35x35)

2

有

EP4SGX360HF35C3N

717 MHz

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0.93 V

5.22

0402

NO

Not Required(mm)

SMD

0.5(mm)

NO

-55C to 155C

Epoxy

Not Required(mm)

70 TO 155

NO

0.1%

0.1 (1/10)(W)

564

Compliant

BGA, BGA1152,34X34,40

网格排列

4

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

40

0.87 V

85 °C

0°C ~ 85°C (TJ)

卷带

Stratix® IV GX

e1

活跃

3A001.A.7.A

±25(ppm/°C)

Thin Film

11.8(ohm)

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

0.87 V ~ 0.93 V

BOTTOM

BALL

245

1 mm

Rectangular

compliant

EP4SGX360

不需要

PAD

S-PBGA-B1152

564

不合格

900 mV

不需要

0.9,1.2/3,1.5,2.5 V

OTHER

930 mV

870 mV

2.8 MB

2.8 MB

600 Mbps

564

141440 CLBS

3.6 mm

现场可编程门阵列

353600

23105536

600 MHz

14144

14144

24

141440

353600

1(mm)

35 mm

35 mm

0.3(mm)

N/A

-

表面贴装

表面贴装

1760-BBGA, FCBGA

YES

1760-FBGA, FC (42.5x42.5)

1760

0.88 V

5.27

600

Compliant

BGA, BGA1760,42X42,40

网格排列

PLASTIC/EPOXY

BGA1760,42X42,40

0.85 V

0.82 V

85 °C

有

5SGXMB6R2F43C2LN

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0°C ~ 85°C (TJ)

Stratix® V GX

活跃

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

0.82 V ~ 0.88 V

BOTTOM

BALL

1 mm

compliant

5SGXMB6

S-PBGA-B1760

600

不合格

850 mV

0.85,1.5,2.5,2.5/3,1.2/3 V

OTHER

7.4 MB

14.1 Gbps

600

22540 CLBS

3.4 mm

现场可编程门阵列

597000

61688832

225400

225400

2

66

22540

597000

600

42.5 mm

42.5 mm

N/A

-

表面贴装

--

--

Non-Compliant

0°C ~ 85°C (TJ)

SPVQ3

Obsolete

1.71 V ~ 1.89 V

3N max

With wire (Right side)

24320

311296

1537000

2432

666 In Stock

• 1: ¥42,963.088841
• 10: ¥41,550.376052
• 25: ¥41,261.545239
• 50: ¥40,974.722184
查看所有的价格

-

表面贴装

1508-BBGA, FCBGA

1508-FBGA (30x30)

Altera

2SA476F

Miscellaneous

Bulk

EP1S80

活跃

-40°C ~ 100°C (TJ)

Stratix®

1.425V ~ 1.575V

N/A

-

表面贴装

100-LQFP

1932

100-TQFP (14x14)

840

Compliant

-40°C ~ 85°C

Tray

72V

Obsolete

Multiplexer

100 °C

-40 °C

3 V ~ 3.6 V

72V90823

880 mV

1 x 16:16

7.8 MB

14.1 Gbps

--

952000

65561600

359200

359200

3

48

单电源

1

840

无铅

6 In Stock

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

100 °C

有

10AX066H4F34I3SGES

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.62

3000K 2-Step MacAdam Ellipse

492

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

85°C

0.9 V

未说明

0.87 V

-40°C ~ 100°C (TJ)

Vero® SE 13 Array

36.20mm Diameter

e1

活跃

Chip On Board (COB)

Tin/Silver/Copper (Sn/Ag/Cu)

White, Warm

8542.39.00.01

0.87 V ~ 0.93 V

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

INDUSTRIAL

Round

30.9V

120°

500mA

145 lm/W

80

3.65 mm

现场可编程门阵列

1A

660000

Flat

2247 lm (Typ)

49610752

250540

13.40mm Diameter

--

--

3.60mm

35 mm

35 mm

N/A

-

表面贴装

1517-BBGA, FCBGA

YES

1517-FCBGA (40x40)

1517

3000K 2-Step MacAdam Ellipse

600

有

This product may require additional documentation to export from the United States.

1150000 LE

930 mV

1

870 mV

SMD/SMT

53400 LAB

967094

Intel

Intel / Altera

Arria 10 FPGA

Details

BGA,

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

100 °C

10AX115N4F40I3SGE2

BGA

SQUARE

Obsolete

INTEL CORP

85°C

5.59

-40°C ~ 100°C (TJ)

Tray

Vero® SE 13 Array

36.20mm Diameter

活跃

Chip On Board (COB)

White, Warm

8542.39.00.01

可编程逻辑集成电路

0.87 V ~ 0.93 V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1517

INDUSTRIAL

Round

33.9V

120°

450mA

121 lm/W

90

42720 CLBS

3.5 mm

现场可编程门阵列

900mA

1150000

Flat

FPGA - Field Programmable Gate Array

1846 lm (Typ)

68857856

427200

13.40mm Diameter

--

42720

--

FPGA - Field Programmable Gate Array

3.60mm

40 mm

40 mm

5000 In Stock

• 1: ¥149.111019
• 10: ¥140.670776
• 100: ¥132.708279
• 500: ¥125.196490
查看所有的价格

-

底座安装

Radial, Can - Screw Terminals

YES

169-UBGA (11x11)

169

--

6000 Hrs @ 105°C

130

LFBGA, BGA169,13X13,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA169,13X13,32

-40 °C

3 V

未说明

2.85 V

100 °C

有

10M08SCU169I7G

416 MHz

LFBGA

SQUARE

Intel Corporation

活跃

FPGA - Field Programmable Gate Array non-volatile FPGA, 130 I/O, 169UBGA

INTEL CORP

3.15 V

0.93

--

350V

--

Bulk

B43740

3.028 Dia (76.90mm)

±20%

活跃

--

通用型

OPERATES AT 3.3V NOMINAL VCC

8542.39.00.01

4700µF

现场可编程门阵列

2.85 V ~ 3.465 V

BOTTOM

BALL

未说明

0.8 mm

compliant

S-PBGA-B169

130

不合格

25 mOhm @ 100Hz

1.248 (31.70mm)

3/3.3 V

INDUSTRIAL

Polar

30 mOhms

11.5A @ 100Hz

130

500 CLBS

1.55 mm

现场可编程门阵列

8000

387072

500

500

8000

4.201 (106.70mm)

11 mm

11 mm

--

900 In Stock

• 1: ¥39,245.024873
• 10: ¥37,954.569508
• 25: ¥37,690.734371
• 50: ¥37,428.733239
查看所有的价格

-

表面贴装

Axial

Axial

Arria 10 FPGA

Details

492

有

This product may require additional documentation to export from the United States.

57000 LE

+ 100 C

930 mV

- 40 C

24

870 mV

SMD/SMT

27135 LAB

966285

Intel

Intel / Altera

-55°C ~ 175°C

Tape & Reel (TR)

CMF

0.180 Dia x 0.562 L (4.57mm x 14.27mm)

±1%

活跃

2

±100ppm/°C

16.2 kOhms

Metal Film

1.5W

可编程逻辑集成电路

0.87 V ~ 0.98 V

950 mV

--

570000

FPGA - Field Programmable Gate Array

42082304

217080

Flame Retardant Coating, Moisture Resistant, Safety

FPGA - Field Programmable Gate Array

--

N/A

-

表面贴装

Axial

YES

Axial

256

有

10M40DCF256I6G

450 MHz

LBGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.25 V

5.26

178

LBGA, BGA256,16X16,40

GRID ARRAY, LOW PROFILE

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.2 V

未说明

1.15 V

100 °C

-55°C ~ 175°C

Tape & Reel (TR)

CMF

0.090 Dia x 0.240 L (2.29mm x 6.10mm)

±0.5%

e1

活跃

2

±50ppm/°C

2.43 kOhms

Tin/Silver/Copper (Sn/Ag/Cu)

Metal Film

0.5W, 1/2W

OPERATES AT 2.5V NOMINAL VCC

1.15 V ~ 1.25 V

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B256

178

--

INDUSTRIAL

178

2500 CLBS

1.55 mm

现场可编程门阵列

40000

1290240

2500

2500

40000

Flame Retardant Coating, Moisture Resistant, Safety

--

17 mm

17 mm

N/A

-

表面贴装

YES

1152

1152

Molex

744

Non-Compliant

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

30

0.87 V

85 °C

无

EP4SE360F35C2

800 MHz

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0.93 V

5.28

Bulk

085641

活跃

*

e0

3A001.A.7.A

锡铅

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

220

1 mm

compliant

S-PBGA-B1152

744

不合格

900 mV

0.9,1.2/3,1.5,2.5 V

OTHER

930 mV

870 mV

2.8 MB

2.8 MB

744

141440 CLBS

3.6 mm

现场可编程门阵列

353600

600 MHz

14144

141440

353600

35 mm

35 mm

7500 In Stock

-

表面贴装

Surface Mount, MLCC

1210 (3225 Metric)

YES

1152

1152-FBGA (35x35)

1152

Vishay Vitramon

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

30

0.87 V

85 °C

无

EP4SE360F35C3

717 MHz

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0.93 V

5.24

Tape & Reel (TR)

VJ1210

活跃

100V

744

Non-Compliant

BGA, BGA1152,34X34,40

-55°C ~ 150°C

VJ

0.126 L x 0.098 W (3.20mm x 2.50mm)

±2%

e0

活跃

3A001.A.7.A

C0G, NP0

锡铅

85 °C

0 °C

汽车

8542.39.00.01

8200 pF

现场可编程门阵列

CMOS

0.87 V ~ 0.93 V

BOTTOM

BALL

220

1 mm

compliant

EP4SE360

S-PBGA-B1152

744

不合格

900 mV

-

-

0.9,1.2/3,1.5,2.5 V

OTHER

2.8 MB

2.8 MB

-

744

141440 CLBS

3.6 mm

现场可编程门阵列

353600

23105536

600 MHz

14144

14144

141440

353600

高温

-

35 mm

35 mm

0.076 (1.94mm)

AEC-Q200

400 In Stock

• 1: ¥190.752073
• 10: ¥179.954782
• 100: ¥169.768666
• 500: ¥160.159120
查看所有的价格

-

表面贴装

表面贴装

153-VFBGA

YES

153

153-MBGA (8x8)

153

10M08SCM153C8G

402 MHz

VFBGA

SQUARE

Intel Corporation

活跃

INTEL CORP

3.15 V

5.25

112

Compliant

VFBGA, BGA153,15X15,20

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA153,15X15,20

3 V

未说明

2.85 V

85 °C

有

0°C ~ 85°C (TJ)

MAX® 10

活跃

85 °C

0 °C

OPERATES AT 3.3V NOMINAL VCC

2.85 V ~ 3.465 V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B153

112

OTHER

47.3 kB

112

500 CLBS

1 mm

现场可编程门阵列

8000

387072

500

500

8

500

8000

8 mm

8 mm

N/A

-

表面贴装

表面贴装

Axial

YES

208

Axial

208

Kamaya Inc.

1.8 V

30

1.71 V

85 °C

无

EP20K100EQC208-2

FQFP

SQUARE

Intel Corporation

Obsolete

151

INTEL CORP

1.89 V

5.04

Bulk

Obsolete

151

Compliant

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55°C ~ 125°C

Bulk

RC

0.094 Dia x 0.248 L (2.40mm x 6.30mm)

±5%

e0

Obsolete

2

-

13 Ohms

Tin/Lead (Sn/Pb)

85 °C

0 °C

碳成分

0.25W, 1/4W

8542.39.00.01

现场可编程门阵列

CMOS

1.71 V ~ 1.89 V

QUAD

鸥翼

220

0.5 mm

compliant

250 MHz

EP20K100

S-PQFP-G208

143

不合格

-

1.8,1.8/3.3 V

OTHER

1.89 V

1.71 V

6.5 kB

6.5 kB

2.02 ns

143

4 DEDICATED INPUTS, 151 I/O

4.1 mm

可加载 PLD

4160

53248

263000

170 MHz

416

416

MACROCELL

4160

4

-

-

28 mm

28 mm

含铅

N/A

-

表面贴装

1932-BBGA, FCBGA

YES

1932-FBGA, FC (45x45)

1932

生命周期结束

INTEL CORP

0.88 V

5.27

840

FBGA-1932

网格排列

PLASTIC/EPOXY

BGA1932,44X44,40

-40 °C

0.85 V

0.82 V

100 °C

有

5SGXMA5N2F45I3LN

BGA

SQUARE

Intel Corporation

-40°C ~ 100°C (TJ)

Stratix® V GX

活跃

8542.39.00.01

现场可编程门阵列

CMOS

0.82 V ~ 0.88 V

BOTTOM

BALL

1 mm

compliant

5SGXMA5

S-PBGA-B1932

840

不合格

0.85,1.5,2.5,2.5/3,1.2/3 V

INDUSTRIAL

840

18500 CLBS

3.9 mm

现场可编程门阵列

490000

53105664

185000

18500

490000

45 mm

45 mm

N/A

-

表面贴装

1517-BBGA, FCBGA

YES

1517-FBGA (40x40)

1517

生命周期结束

INTEL CORP

0.88 V

5.29

Non-Compliant

696

BGA, BGA1517,39X39,40

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

0.85 V

0.82 V

85 °C

有

5SGXEA7K1F40C2LN

BGA

SQUARE

Intel Corporation

0°C ~ 85°C (TJ)

Stratix® V GX

活跃

8542.39.00.01

现场可编程门阵列

CMOS

0.82 V ~ 0.88 V

BOTTOM

BALL

1 mm

compliant

5SGXEA7

S-PBGA-B1517

696

不合格

0.85,1.5,2.5,2.5/3,1.2/3 V

OTHER