对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

底架

安装类型

包装/外壳

表面安装

越来越多的功能

外壳材料

供应商器件包装

质量

终端数量

厂商

操作温度

包装

系列

尺寸/尺寸

容差

JESD-609代码

零件状态

湿度敏感性等级(MSL)

终止次数

终端

温度系数

连接器类型

电阻

端子表面处理

最高工作温度

最小工作温度

组成

颜色

功率(瓦特)

附加功能

HTS代码

紧固类型

子类别

技术

电压 - 供电

端子位置

方向

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

外壳完成

外壳尺寸-插入

JESD-30代码

输出的数量

资历状况

失败率

电源

温度等级

电感,电感

速度

内存大小

反向泄漏电流@ Vr

不同 If 时电压 - 正向 (Vf)

核心处理器

周边设备

连接方式

功率 - 最大

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

电压 - 齐纳(标准值)(Vz)

逻辑元件/单元数

产品类别

总 RAM 位数

LABs数量/ CLBs数量

逻辑块数(LABs)

主要属性

变压器类型

逻辑块数量

逻辑单元数

转速比--初级:中级

闪光大小

ET(电压时间)

特征

产品类别

座位高度(最大)

长度

宽度

评级结果

10M50DCF256I6G
10M50DCF256I6G
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

256-LBGA

YES

256-FBGA (17x17)

256

PEI-Genesis

10M50DCF256I6G

450 MHz

LBGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.25 V

5.26

Bulk

活跃

178

LBGA, BGA256,16X16,40

GRID ARRAY, LOW PROFILE

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.2 V

未说明

1.15 V

100 °C

-40°C ~ 100°C (TJ)

*

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

OPERATES AT 2.5V NOMINAL VCC

1.15 V ~ 1.25 V

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B256

178

INDUSTRIAL

178

3125, CLBS

1.55 mm

现场可编程门阵列

50000

1677312

3125

3125

50000

17 mm

17 mm

10M50DAF672I6G
10M50DAF672I6G
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

672-BGA

YES

672-FBGA (27x27)

-

672

Pulse Electronics

10M50DAF672I6G

450 MHz

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.25 V

5.26

Tape & Reel (TR)

活跃

500

BGA, BGA672,26X26,40

网格排列

PLASTIC/EPOXY

BGA672,26X26,40

-40 °C

1.2 V

未说明

1.15 V

100 °C

0°C ~ 70°C

-

0.495 L x 0.280 W (12.57mm x 7.11mm)

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

OPERATES AT 2.5V NOMINAL VCC

1.15 V ~ 1.25 V

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B672

500

INDUSTRIAL

15µH

500

3125, CLBS

2 mm

现场可编程门阵列

50000

1677312

3125

-

3125

50000

1:1

-

0.200 (5.08mm)

27 mm

27 mm

10AX032H2F35E1SG
10AX032H2F35E1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

1152-BBGA, FCBGA

1152-FBGA (35x35)

Glenair

384

零售包装

活跃

0°C ~ 100°C (TJ)

*

Discontinued at Digi-Key

0.87 V ~ 0.98 V

320000

21040128

119900

10M40DAF484I6G
10M40DAF484I6G
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

0402 (1005 Metric)

YES

402

484

Kamaya Inc.

10M40DAF484I6G

450 MHz

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.25 V

5.26

Tape & Reel (TR)

活跃

360

BGA, BGA484,22X22,40

网格排列

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

未说明

1.15 V

100 °C

-55°C ~ 155°C

RMC

0.039 L x 0.020 W (1.00mm x 0.50mm)

±0.5%

e1

活跃

2

±100ppm/°C

523 kOhms

Tin/Silver/Copper (Sn/Ag/Cu)

厚膜

0.1W, 1/10W

OPERATES AT 2.5V NOMINAL VCC

1.15 V ~ 1.25 V

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B484

360

-

INDUSTRIAL

360

2500 CLBS

2 mm

现场可编程门阵列

40000

1290240

2500

2500

40000

-

0.016 (0.40mm)

23 mm

23 mm

-

10M16DCU324I6G
10M16DCU324I6G
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Panel Mount, Through Hole

324-LFBGA

YES

Flange

Aluminum

324-UBGA (15x15)

324

Glenair

1.2 V

未说明

1.15 V

100 °C

10M16DCU324I6G

450 MHz

LFBGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.25 V

5.25

零售包装

Metal

活跃

Copper Alloy

Gold

246

LFBGA, BGA324,18X18,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA324,18X18,32

-40 °C

-65°C ~ 175°C

806

活跃

Solder

Receptacle, Female Sockets

橄榄色

ALSO REQUIRES 2.5V OR 3.3V OR 5V SUPPLY

Threaded

1.15 V ~ 1.25 V

BOTTOM

A

BALL

未说明

0.8 mm

compliant

橄榄色镉

14-20A

S-PBGA-B324

246

INDUSTRIAL

246

1000 CLBS

1.55 mm

现场可编程门阵列

16000

562176

1000

1000

16000

15 mm

15 mm

10M25DAF256I6G
10M25DAF256I6G
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

256-LBGA

YES

256-FBGA (17x17)

256

ITT Cannon, LLC

1.15 V

100 °C

10M25DAF256I6G

450 MHz

LBGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.25 V

5.26

Bulk

CA310

活跃

178

LBGA, BGA256,16X16,40

GRID ARRAY, LOW PROFILE

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.2 V

未说明

-40°C ~ 100°C (TJ)

MIL-DTL-5015, CA-B

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

OPERATES AT 2.5V NOMINAL VCC

8542.39.00.01

1.15 V ~ 1.25 V

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B256

178

INDUSTRIAL

178

1563 CLBS

1.55 mm

现场可编程门阵列

25000

691200

1563

1563

25000

17 mm

17 mm

10AX032H2F35I1SG
10AX032H2F35I1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

0603 (1608 Metric)

YES

0603

1152

KOA Speer Electronics, Inc.

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.53

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

RN73R1J

活跃

384

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

100 °C

10AX032H2F35I1SG

BGA

-55°C ~ 155°C

RN73R

0.063 L x 0.031 W (1.60mm x 0.80mm)

±0.1%

Discontinued at Digi-Key

2

±5ppm/°C

232 Ohms

Thin Film

0.1W, 1/10W

8542.39.00.01

0.87 V ~ 0.98 V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1152

-

INDUSTRIAL

3.5 mm

现场可编程门阵列

320000

21040128

119900

Automotive AEC-Q200, Moisture Resistant

0.022 (0.55mm)

35 mm

35 mm

AEC-Q200

10AX032H1F35E1SG
10AX032H1F35E1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Panel Mount, Through Hole

1152-BBGA, FCBGA

YES

Flange

Aluminum

1152-FBGA (35x35)

1152

Glenair

100 °C

10AX032H1F35E1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.53

零售包装

Metal

活跃

Copper Alloy

Gold

384

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

-65°C ~ 175°C

806

Discontinued at Digi-Key

Solder

Receptacle, Female Sockets

橄榄色

8542.39.00.01

Threaded

现场可编程门阵列

CMOS

0.87 V ~ 0.98 V

BOTTOM

B

BALL

未说明

1 mm

compliant

橄榄色镉

22-22

S-PBGA-B1152

384

不合格

0.9 V

OTHER

384

3.5 mm

现场可编程门阵列

320000

21040128

119900

320000

Ground

35 mm

35 mm

10AX027H2F35I1SG
10AX027H2F35I1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Panel Mount, Through Hole

1152-BBGA, FCBGA

YES

Flange

不锈钢

1152-FBGA (35x35)

1152

Glenair

10AX027H2F35I1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.56

零售包装

Metal

活跃

Copper Alloy

Gold

384

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

100 °C

-65°C ~ 175°C

806

Discontinued at Digi-Key

Solder

Plug, Male Pins

Silver

8542.39.00.01

Threaded

0.87 V ~ 0.98 V

BOTTOM

F

BALL

1 mm

compliant

Passivated

33-20A

S-PBGA-B1152

INDUSTRIAL

3.5 mm

现场可编程门阵列

270000

17870848

101620

Ground

35 mm

35 mm

10AX027E2F27I1SG
10AX027E2F27I1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

672-BBGA, FCBGA

YES

672-FBGA (27x27)

672

Glenair

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.56

零售包装

活跃

240

Lead free / RoHS Compliant

27 X 27 MM, ROHS COMPLIANT, FBGA-672

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

100 °C

10AX027E2F27I1SG

BGA

-40°C ~ 100°C (TJ)

*

Discontinued at Digi-Key

3 (168 Hours)

8542.39.00.01

0.87 V ~ 0.98 V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B672

INDUSTRIAL

3.25 mm

现场可编程门阵列

270000

17870848

101620

27 mm

27 mm

10AX022E3F27I1SG
10AX022E3F27I1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

DO-213AB, MELF (Glass)

DO-213AB (MELF, LL41)

微芯片技术

Bulk

CDLL4492

500 Ohms

活跃

240

-65°C ~ 175°C (TA)

-

±5%

Discontinued at Digi-Key

0.87 V ~ 0.93 V

250 nA @ 104 V

1 V @ 200 mA

1.5 W

130 V

220000

13752320

80330

10AX016E3F29E1SG
10AX016E3F29E1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

780-BBGA, FCBGA

YES

780-FBGA (29x29)

780

PEI-Genesis

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.56

Bulk

活跃

288

29 X 29 MM, ROHS COMPLIANT, FBGA-780

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

0.9 V

未说明

0.87 V

100 °C

10AX016E3F29E1SG

BGA

0°C ~ 100°C (TJ)

*

Discontinued at Digi-Key

8542.39.00.01

现场可编程门阵列

CMOS

0.87 V ~ 0.98 V

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

288

不合格

0.9 V

OTHER

288

3.35 mm

现场可编程门阵列

160000

10086400

61510

160000

29 mm

29 mm

10AX016E3F27I1SG
10AX016E3F27I1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

672-BBGA

YES

672-FBGA (27x27)

672

ITT Cannon, LLC

100 °C

10AX016E3F27I1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.56

Bulk

KJB6T

活跃

240

27 X 27 MM, ROHS COMPLIANT, FBGA-672

网格排列

PLASTIC/EPOXY

BGA672,26X26,40

-40 °C

0.9 V

未说明

0.87 V

-40°C ~ 100°C (TJ)

*

Discontinued at Digi-Key

8542.39.00.01

现场可编程门阵列

CMOS

0.87 V ~ 0.98 V

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B672

240

不合格

0.9 V

INDUSTRIAL

240

3.25 mm

现场可编程门阵列

160000

10086400

61510

160000

27 mm

27 mm

10AX066K2F35E1SG
10AX066K2F35E1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Panel Mount, Through Hole

1152-BBGA, FCBGA

Flange

不锈钢

1152-FCBGA (35x35)

Glenair

零售包装

Metal

活跃

Copper Alloy

Gold

492

-65°C ~ 175°C

806

Discontinued at Digi-Key

Solder

Plug, Male Pins

Silver

Threaded

0.87 V ~ 0.98 V

C

Passivated

660000

49610752

250540

10AX066N2F40I1SG
10AX066N2F40I1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

1517-BBGA, FCBGA

YES

1517-FCBGA (40x40)

1517

PEI-Genesis

Obsolete

INTEL CORP

0.93 V

5.62

Bulk

活跃

588

40 X 40 MM, ROHS COMPLIANT, FBGA-1517

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

100 °C

10AX066N2F40I1SG

BGA

SQUARE

Intel Corporation

-40°C ~ 100°C (TJ)

*

Discontinued at Digi-Key

8542.39.00.01

0.87 V ~ 0.98 V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1517

INDUSTRIAL

3.5 mm

现场可编程门阵列

660000

49610752

250540

40 mm

40 mm

10AX066N1F40E1SG
10AX066N1F40E1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

1517-BBGA, FCBGA

YES

1517-FCBGA (40x40)

1517

PEI-Genesis

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.62

Bulk

活跃

588

40 X 40 MM, ROHS COMPLIANT, FBGA-1517

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

0.9 V

未说明

0.87 V

100 °C

10AX066N1F40E1SG

BGA

0°C ~ 100°C (TJ)

*

Discontinued at Digi-Key

8542.39.00.01

现场可编程门阵列

CMOS

0.87 V ~ 0.98 V

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1517

588

不合格

0.9 V

OTHER

588

3.5 mm

现场可编程门阵列

660000

49610752

250540

660000

40 mm

40 mm

10AX066K1F35E1SG
10AX066K1F35E1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

0805 (2012 Metric)

YES

0805

1152

KOA Speer Electronics, Inc.

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.62

Tape & Reel (TR)

活跃

492

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

10AX066K1F35E1SG

BGA

-55°C ~ 155°C

SG73S-RT

0.079 L x 0.049 W (2.00mm x 1.25mm)

±1%

Discontinued at Digi-Key

2

±200ppm/°C

1.02 kOhms

厚膜

0.25W, 1/4W

8542.39.00.01

现场可编程门阵列

CMOS

0.87 V ~ 0.98 V

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

-

0.9 V

OTHER

396

3.5 mm

现场可编程门阵列

660000

49610752

250540

660000

Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant, Pulse Withstanding

0.024 (0.60mm)

35 mm

35 mm

-

10AX115U2F45I2SGE2
10AX115U2F45I2SGE2
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

0603 (1608 Metric)

YES

0603

1932

930 mV

1

870 mV

SMD/SMT

53400 LAB

Stackpole Electronics Inc

967105

Intel

Intel / Altera

Arria 10 FPGA

Details

BGA,

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

100 °C

10AX115U2F45I2SGE2

BGA

SQUARE

Obsolete

INTEL CORP

5.59

Bulk

活跃

480

This product may require additional documentation to export from the United States.

1150000 LE

-55°C ~ 155°C

Tray

RMEF

0.063 L x 0.031 W (1.60mm x 0.80mm)

±1%

Discontinued at Digi-Key

2

±100ppm/°C

1.18 kOhms

厚膜

0.1W, 1/10W

8542.39.00.01

可编程逻辑集成电路

0.87 V ~ 0.98 V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1932

-

INDUSTRIAL

42720 CLBS

3.5 mm

现场可编程门阵列

1150000

FPGA - Field Programmable Gate Array

68857856

427200

42720

Automotive AEC-Q200

FPGA - Field Programmable Gate Array

0.020 (0.50mm)

45 mm

45 mm

AEC-Q200

10AX115U3F45I2SGE2
10AX115U3F45I2SGE2
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

1932-BBGA, FCBGA

YES

1932-FBGA, FC (45x45)

1932

870 mV

SMD/SMT

53400 LAB

PEI-Genesis

Intel

Intel / Altera

Arria 10 FPGA

Details

BGA,

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

100 °C

10AX115U3F45I2SGE2

BGA

SQUARE

Obsolete

INTEL CORP

5.59

Bulk

活跃

480

This product may require additional documentation to export from the United States.

1150000 LE

930 mV

1

-40°C ~ 100°C (TJ)

Tray

*

Discontinued at Digi-Key

100 °C

-40 °C

8542.39.00.01

可编程逻辑集成电路

0.87 V ~ 0.93 V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1932

INDUSTRIAL

8.2 MB

42720 CLBS

3.5 mm

现场可编程门阵列

1150000

FPGA - Field Programmable Gate Array

68857856

427200

427200

42720

FPGA - Field Programmable Gate Array

45 mm

45 mm

10AX115H3F34I2SGE2
10AX115H3F34I2SGE2
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

This product may require additional documentation to export from the United States.

1150000 LE

930 mV

1

870 mV

PEI-Genesis

SMD/SMT

53400 LAB

967082

Intel

Intel / Altera

Arria 10 FPGA

BGA,

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

100 °C

10AX115H3F34I2SGE2

BGA

SQUARE

Obsolete

INTEL CORP

5.59

Bulk

活跃

504

Lead free / RoHS Compliant

Compliant

-40°C ~ 100°C (TJ)

Tray

*

Discontinued at Digi-Key

3 (168 Hours)

100 °C

-40 °C

8542.39.00.01

可编程逻辑集成电路

0.87 V ~ 0.93 V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1152

INDUSTRIAL

8.2 MB

42720 CLBS

3.35 mm

现场可编程门阵列

1150000

FPGA - Field Programmable Gate Array

68857856

427200

427200

42720

FPGA - Field Programmable Gate Array

35 mm

35 mm

10M50SCE144C7G
10M50SCE144C7G
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

144-LQFP Exposed Pad

YES

144-EQFP (20x20)

144

Sharpie

416 MHz

HLFQFP

SQUARE

Intel Corporation

Obsolete

INTEL CORP

3.15 V

5.26

Box

活跃

101

HLFQFP, QFP144,.87SQ,20

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

QFP144,.87SQ,20

3 V

未说明

2.85 V

85 °C

10M50SCE144C7G

0°C ~ 85°C (TJ)

*

Obsolete

OPERATES AT 3.3V NOMINAL VCC

8542.39.00.01

现场可编程门阵列

2.85 V ~ 3.465 V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G144

101

不合格

3/3.3 V

OTHER

101

3125, CLBS

1.65 mm

现场可编程门阵列

50000

1677312

3125

3125

50000

20 mm

20 mm

10AX115U3F45I2SGES
10AX115U3F45I2SGES
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

1932-BBGA, FCBGA

YES

1932-FBGA, FC (45x45)

1932

SMD/SMT

Details

Arria 10 FPGA

PEI-Genesis

Intel / Altera

Intel

53400 LAB

BGA,

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

100 °C

10AX115U3F45I2SGES

BGA

SQUARE

Obsolete

INTEL CORP

5.59

Bulk

活跃

480

This product may require additional documentation to export from the United States.

1150000 LE

930 mV

1

870 mV

-40°C ~ 100°C (TJ)

Tray

*

Discontinued at Digi-Key

8542.39.00.01

可编程逻辑集成电路

0.87 V ~ 0.93 V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1932

INDUSTRIAL

3.65 mm

现场可编程门阵列

1150000

FPGA - Field Programmable Gate Array

68857856

427200

FPGA - Field Programmable Gate Array

45 mm

45 mm

10AT115U3F45E2SGES
10AT115U3F45E2SGES
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

130

Tray

XC7Z045

活跃

-40°C ~ 100°C (TJ)

Zynq®-7000

Obsolete

0.87 V ~ 0.93 V

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1150000

68857856

427200

Kintex™-7 FPGA, 350K Logic Cells

-

10AT115N4F40E3SGES
10AT115N4F40E3SGES
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

1517-BBGA, FCBGA

1517-FBGA (40x40)

KEMET

600

Bulk

活跃

0°C ~ 100°C (TJ)

*

Obsolete

0.87 V ~ 0.93 V

1150000

68857856

427200

10AX115N3F45I2SGES
10AX115N3F45I2SGES
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

1932-BBGA, FCBGA

YES

1932-FBGA, FC (45x45)

1932

870 mV

SMD/SMT

53400 LAB

967561

Glenair

Intel

Intel / Altera

Arria 10 FPGA

Details

BGA,

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

100 °C

10AX115N3F45I2SGES

BGA

SQUARE

Obsolete

INTEL CORP

5.59

零售包装

活跃

768

This product may require additional documentation to export from the United States.

1150000 LE

930 mV

1

-40°C ~ 100°C (TJ)

Tray

*

Discontinued at Digi-Key

8542.39.00.01

可编程逻辑集成电路

0.87 V ~ 0.93 V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1932

INDUSTRIAL

3.65 mm

现场可编程门阵列

1150000

FPGA - Field Programmable Gate Array

68857856

427200

FPGA - Field Programmable Gate Array

45 mm

45 mm