N/A

-

表面贴装

1508-BBGA, FCBGA

YES

1508-FBGA (30x30)

1508

Molex

717 MHz

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.25 V

5.23

Bulk

121050

活跃

650

Lead free / RoHS Compliant

544-1773 EP2SGX90FF40C4N EP2SGX90FF40C4NES

BGA, BGA1508,39X39,40

网格排列

3

PLASTIC/EPOXY

BGA1508,39X39,40

1.2 V

40

1.15 V

85 °C

有

EP2SGX90FF1508C4N

0°C ~ 85°C (TJ)

Brad 121050 mPm

e1

活跃

3 (168 Hours)

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

1.15 V ~ 1.25 V

BOTTOM

BALL

245

1 mm

compliant

EP2SGX90

S-PBGA-B1508

650

不合格

1.2,1.2/3.3,3.3 V

OTHER

650

90960 CLBS

3.5 mm

现场可编程门阵列

90960

4520448

4548

5.117 ns

90960

90960

40 mm

40 mm

N/A

-

Surface Mount, MLCC

0603 (1608 Metric)

YES

1152-FBGA (35x35)

1152

Vishay Vitramon

Tape & Reel (TR)

活跃

50V

552

Contains lead / RoHS Compliant

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.85 V

0.82 V

85 °C

无

5SGXEA7H2F35C3

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0.88 V

5.27

-55°C ~ 150°C

GA

0.063 L x 0.031 W (1.60mm x 0.80mm)

±5%

活跃

3 (168 Hours)

X7R

汽车

5600 pF

现场可编程门阵列

CMOS

0.82 V ~ 0.88 V

BOTTOM

BALL

1 mm

compliant

5SGXEA7

S-PBGA-B1152

552

不合格

-

-

0.85,1.5,2.5,2.5/3,1.2/3 V

OTHER

-

552

23472 CLBS

3.6 mm

现场可编程门阵列

622000

59939840

234720

23472

622000

-

-

35 mm

35 mm

0.038 (0.97mm)

AEC-Q200

N/A

-

表面贴装

1206 (3216 Metric)

YES

1206

896

Stackpole Electronics Inc

Obsolete

INTEL CORP

1.13 V

5.29

Tape & Reel (TR)

活跃

384

Lead free / RoHS Compliant

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.1 V

未说明

1.07 V

100 °C

有

5AGXBA7D4F31I5N

BGA

SQUARE

Intel Corporation

-55°C ~ 155°C

CSR

0.120 L x 0.061 W (3.05mm x 1.55mm)

±5%

e1

活跃

3 (168 Hours)

2

±100ppm/°C

85 mOhms

Tin/Silver/Copper (Sn/Ag/Cu)

厚膜

0.5W, 1/2W

8542.39.00.01

现场可编程门阵列

1.07 V ~ 1.13 V

BOTTOM

BALL

未说明

1 mm

compliant

5AGXBA7

S-PBGA-B896

384

不合格

-

1.1,1.2/3.3,2.5 V

INDUSTRIAL

384

9168 CLBS

2.7 mm

现场可编程门阵列

242000

15470592

11460

9168

242000

电流感应

0.026 (0.65mm)

31 mm

31 mm

N/A

-

Surface Mount, MLCC

1206 (3216 Metric)

672-FBGA, FC (27x27)

Vishay Vitramon

Tape & Reel (TR)

CDR32

活跃

100V

240

Lead free / RoHS Compliant

有

This product may require additional documentation to export from the United States.

270000 LE

930 mV

40

870 mV

SMD/SMT

12702.5 LAB

967156

Intel

Intel / Altera

Arria 10 FPGA

Details

-55°C ~ 125°C

Tray

Military, MIL-PRF-55681, CDR32

0.126 L x 0.063 W (3.20mm x 1.60mm)

±10%

活跃

3 (168 Hours)

BP

高可靠性

47 pF

可编程逻辑集成电路

0.87 V ~ 0.98 V

P (0.1%)

-

-

270000

FPGA - Field Programmable Gate Array

17870848

101620

-

FPGA - Field Programmable Gate Array

-

0.051 (1.30mm)

-

N/A

-

表面贴装

484-BBGA

484-FBGA (23x23)

Free Hanging (In-Line)

面板安装

Amphenol Custom Cable

246

Lead free / RoHS Compliant

Male

Bag

50 Ohms

Q-0I03K0

-

活跃

Female

4 GHz

Bulkhead - Front Side Nut

RG-178

-

-

Obsolete

3 (168 Hours)

Copper

3 V ~ 3.6 V

-

BNC 转 SMB

EPF10K30

1728

BNC Plug

SMB Jack

12288

69000

216

Shielded

48.0 (1.2m) 4.0

N/A

-

表面贴装

Axial

Axial

Vishay Dale

Tape & Reel (TR)

RNC50

活跃

271

Lead free / RoHS Compliant

-65°C ~ 175°C

Military, MIL-PRF-55182/07, RNC50

0.070 Dia x 0.150 L (1.78mm x 3.81mm)

±1%

Obsolete

3 (168 Hours)

2

±50ppm/°C

590 Ohms

Metal Film

0.1W, 1/10W

1.71 V ~ 1.89 V

S (0.001%)

8320

106496

526000

832

Military, Moisture Resistant, Weldable

-

N/A

-

表面贴装

0805 (2012 Metric)

YES

0805

1152

KOA Speer Electronics, Inc.

生命周期结束

INTEL CORP

0.93 V

5.22

Tape & Reel (TR)

RN732A

Obsolete

564

Lead free / RoHS Compliant

LEAD FREE, FBGA-1152

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

40

0.87 V

85 °C

有

EP4SGX360HF35C4N

717 MHz

BGA

SQUARE

Intel Corporation

-55°C ~ 155°C

RN73

0.079 L x 0.049 W (2.00mm x 1.25mm)

±0.05%

e1

活跃

3 (168 Hours)

2

3A001.A.7.A

±25ppm/°C

27 kOhms

Tin/Silver/Copper (Sn/Ag/Cu)

Thin Film

0.1W, 1/10W

8542.39.00.01

现场可编程门阵列

CMOS

0.87 V ~ 0.93 V

BOTTOM

BALL

245

1 mm

compliant

EP4SGX360

S-PBGA-B1152

564

不合格

0.9,1.2/3,1.5,2.5 V

OTHER

564

141440 CLBS

3.6 mm

现场可编程门阵列

353600

23105536

14144

141440

353600

Moisture Resistant

0.024 (0.60mm)

35 mm

35 mm

N/A

-

表面贴装

表面贴装

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Amphenol Custom Cable

Compliant

Male

Bag

50 Ohms

Q-2G0190

活跃

Male

6 GHz

RG-142

432

Lead free / RoHS Compliant

-

-

2A (4 Weeks)

100 °C

-40 °C

Copper

0.82 V ~ 0.88 V

-

MCX to N-Type

5.8 MB

490000

MCX Plug, Right Angle

N-Type Plug, Right Angle

48927744

185000

185000

Shielded

9.843 (250.00mm)

N/A

-

表面贴装

0402 (1005 Metric)

402

Vishay Beyschlag/Draloric/BC Components

Tape & Reel (TR)

MCS0402

活跃

92

Lead free / RoHS Compliant

-55°C ~ 155°C

MCS - Professional

0.039 L x 0.020 W (1.00mm x 0.50mm)

±1%

Obsolete

3 (168 Hours)

2

±50ppm/°C

681 Ohms

Thin Film

0.063W, 1/16W

1.71 V ~ 1.89 V

EP20K60

-

2560

32768

162000

2560

Anti-Sulfur

0.015 (0.37mm)

-

N/A

-

Surface Mount, MLCC

0603 (1608 Metric)

YES

208-PQFP (28x28)

208

Vishay Vitramon

FQFP

SQUARE

Intel Corporation

活跃

Cyclone Devices

INTEL CORP

1.25 V

1.58

Tape & Reel (TR)

VJ0603

活跃

50V

142

Contains lead / RoHS non-compliant

544-2134

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.2 V

30

1.15 V

无

EP2C5Q208I8

-55°C ~ 125°C

VJ HIFREQ

0.063 L x 0.031 W (1.60mm x 0.80mm)

±10%

e0

活跃

3 (168 Hours)

EAR99

C0G, NP0

Tin/Lead (Sn/Pb)

RF, Microwave, High Frequency

ALSO REQUIRES 3.3 SUPPLY

8542.39.00.01

91 pF

现场可编程门阵列

CMOS

1.15 V ~ 1.25 V

QUAD

鸥翼

220

0.5 mm

compliant

EP2C5

S-PQFP-G208

134

不合格

-

1.2,1.5/3.3,3.3 V

-

142

288 CLBS

4.1 mm

现场可编程门阵列

4608

119808

288

288

4608

High Q, Low Loss

-

28 mm

28 mm

0.037 (0.94mm)

-

N/A

-

表面贴装

780-BBGA, FCBGA

YES

780-HBGA (33x33)

780

Corsair

生命周期结束

INTEL CORP

0.93 V

5.26

Bag

D38999/26FE

活跃

289

Lead free / RoHS Compliant

33 X 33 MM, LEAD FREE, HBGA-780

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

0.9 V

40

0.87 V

85 °C

有

EP4SGX360FH29C2XN

800 MHz

BGA

SQUARE

Intel Corporation

0°C ~ 85°C (TJ)

*

e1

3 (168 Hours)

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

0.87 V ~ 0.93 V

BOTTOM

BALL

245

1 mm

compliant

EP4SGX360

S-PBGA-B780

289

不合格

0.9,1.2/3,1.5,2.5 V

OTHER

289

14144 CLBS

3.4 mm

现场可编程门阵列

353600

23105536

14144

14144

353600

33 mm

33 mm

N/A

-

表面贴装

780-BBGA, FCBGA

YES

780-HBGA (33x33)

780

Molex

Bulk

221050

活跃

488

Lead free / RoHS Compliant

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

0.9 V

0.86 V

无

EP3SE260H780I4

717 MHz

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0.94 V

5.2

-40°C ~ 100°C (TJ)

*

活跃

3 (168 Hours)

3A001.A.7.A

IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY

8542.39.00.01

现场可编程门阵列

CMOS

0.86 V ~ 1.15 V

BOTTOM

BALL

1 mm

compliant

EP3SE260

S-PBGA-B780

488

不合格

1.2/3.3 V

488

3.5 mm

现场可编程门阵列

255000

16672768

10200

255000

33 mm

33 mm

N/A

-

通孔

Axial

YES

672-FBGA (27x27)

672

KYOCERA AVX

BGA

SQUARE

Intel Corporation

Obsolete

408

INTEL CORP

1.89 V

5.1

Tape & Reel (TR)

活跃

50V

408

Lead free / RoHS Compliant

FINE LINE, BGA-672

网格排列

3

PLASTIC/EPOXY

BGA672,26X26,40

1.8 V

30

1.71 V

85 °C

无

EP20K300EFC672-1X

160 MHz

10°C ~ 85°C

SpinGuard® SA

0.091 Dia x 0.118 L (2.30mm x 3.00mm)

-20%, +80%

e0

Obsolete

3 (168 Hours)

3A991

Z5U

Tin/Lead (Sn/Pb)

通用型

8542.39.00.01

0.047 µF

现场可编程门阵列

CMOS

1.71 V ~ 1.89 V

BOTTOM

BALL

220

1 mm

compliant

EP20K300

S-PBGA-B672

400

不合格

-

1.8,1.8/3.3 V

OTHER

Straight

1.68 ns

400

4 DEDICATED INPUTS, 408 I/O

3.5 mm

可加载 PLD

11520

147456

728000

1152

MACROCELL

11520

4

-

-

27 mm

27 mm

-

-

N/A

-

表面贴装

652-BBGA

YES

652-BGA (45x45)

652

TE Connectivity Deutsch 连接器

BGA

SQUARE

Intel Corporation

Obsolete

488

INTEL CORP

1.89 V

5.11

Bag

AFD56

活跃

488

Lead free / RoHS Compliant

BGA-652

网格排列

3

PLASTIC/EPOXY

BGA652,35X35,50

1.8 V

30

1.71 V

85 °C

无

EP20K1000EBC652-2X

160 MHz

0°C ~ 85°C (TJ)

MIL-DTL-26482 G Series II, AFD

e0

Obsolete

3 (168 Hours)

3A001.A.7.A

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

1.71 V ~ 1.89 V

BOTTOM

BALL

220

1.27 mm

compliant

EP20K1000

S-PBGA-B652

480

不合格

1.8,1.8/3.3 V

OTHER

2.13 ns

480

4 DEDICATED INPUTS, 488 I/O

3.5 mm

可加载 PLD

38400

327680

1772000

3840

MACROCELL

38400

4

45 mm

45 mm

N/A

-

表面贴装

6-SMD, No Lead

YES

1152-FCBGA (35x35)

1152

100 °C

10AX115H4F34I3SGES

Skyworks Solutions Inc.

BGA

SQUARE

INTEL CORP

不用于新设计

This product may require additional documentation to export from the United States.

930 mV

870 mV

Arria 10 FPGA

Details

0.9 V

Obsolete

5.59

Tape & Reel (TR)

504

Lead free / RoHS Compliant

有

1150000 LE

1

SMD/SMT

53400 LAB

Intel

Intel / Altera

BGA,

网格排列

PLASTIC/EPOXY

-40 °C

-40°C ~ 85°C

Tray

Ultra™ Si540

0.197 L x 0.126 W (5.00mm x 3.20mm)

Discontinued at Digi-Key

3 (168 Hours)

XO (Standard)

8542.39.00.01

可编程逻辑集成电路

2.5V, 3.3V

BOTTOM

BALL

1 mm

compliant

322.265625 MHz

±20ppm

LVPECL

S-PBGA-B1152

Enable/Disable

Crystal

132mA

INDUSTRIAL

100mA

-

3.65 mm

现场可编程门阵列

1150000

FPGA - Field Programmable Gate Array

68857856

427200

-

FPGA - Field Programmable Gate Array

0.052 (1.33mm)

35 mm

35 mm

-

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

Molex

0.93 V

5.22

Bulk

151117

活跃

564

Contains lead / RoHS non-compliant

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

30

0.87 V

无

EP4SGX290FF35I3

717 MHz

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

-40°C ~ 100°C (TJ)

*

e0

活跃

3 (168 Hours)

3A001.A.7.A

锡铅

8542.39.00.01

现场可编程门阵列

CMOS

0.87 V ~ 0.93 V

BOTTOM

BALL

220

1 mm

compliant

EP4SGX290

S-PBGA-B1152

564

不合格

0.9,1.2/3,1.5,2.5 V

564

11648 CLBS

3.4 mm

现场可编程门阵列

291200

17661952

11648

11648

291200

35 mm

35 mm

N/A

-

表面贴装

SC-74A, SOT-753

YES

SOT-25

1152

Zilog

0.88 V

5.26

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

IXD3235

活跃

Lead free / RoHS Compliant

552

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.85 V

0.82 V

100 °C

有

5SGXMA7H3F35I4N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

-40°C ~ 85°C (TA)

-

活跃

3 (168 Hours)

现场可编程门阵列

CMOS

0.82 V ~ 0.88 V

BOTTOM

BALL

1 mm

compliant

5SGXMA7

S-PBGA-B1152

Step-Down

1

不合格

6V

固定式

2V

0.85,1.5,2.5,2.5/3,1.2/3 V

INDUSTRIAL

Positive

600mA

1.2V

巴克

1.2MHz

552

23472 CLBS

3.6 mm

现场可编程门阵列

有

622000

59939840

-

234720

23472

622000

35 mm

35 mm

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

Molex

Bulk

130009

活跃

552

Contains lead / RoHS non-compliant

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

0.87 V

85 °C

无

5SGXMA4H2F35C2

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0.93 V

5.26

0°C ~ 85°C (TJ)

*

活跃

3 (168 Hours)

8542.39.00.01

现场可编程门阵列

CMOS

0.87 V ~ 0.93 V

BOTTOM

BALL

1 mm

compliant

5SGXMA4

S-PBGA-B1152

552

不合格

0.85,1.5,2.5,2.5/3,1.2/3 V

OTHER

552

15850 CLBS

3.6 mm

现场可编程门阵列

420000

43983872

158500

15850

420000

35 mm

35 mm

N/A

-

表面贴装

64-LQFP

64-LQFP (7x7)

NXP USA Inc.

Obsolete

SC16

Tray

488

Lead free / RoHS Compliant

-40°C ~ 100°C (TJ)

-

活跃

3 (168 Hours)

2.5V, 3.3V, 5V

EP3SL50

4, QUART

47500

-

2184192

1900

5Mbps

有

-

有

有

-

N/A

-

表面贴装

表面贴装

240-BQFP

240

240-PQFP (32x32)

Analog Devices Inc./Maxim Integrated

INTEL CORP

5.54

Tray

MAX1044

活跃

183

Contains lead / RoHS non-compliant

Compliant

,

EP20K100EQI240-2X

Intel Corporation

Obsolete

-40°C ~ 100°C (TJ)

Bulk

*

Obsolete

3 (168 Hours)

100 °C

-40 °C

1.71 V ~ 1.89 V

compliant

EP20K100

6.5 kB

4160

53248

263000

416

416

含铅

N/A

-

Surface Mount, MLCC

1206 (3216 Metric)

100-TQFP (14x14)

Vishay Vitramon

最后一次购买

10V

71

Contains lead / RoHS non-compliant

Tape & Reel (TR)

VJ1206

-25°C ~ 85°C

VJ

0.126 L x 0.063 W (3.20mm x 1.60mm)

±20%

Obsolete

3 (168 Hours)

Y5V (F)

通用型

0.15 µF

3 V ~ 3.6 V

EPF6010

-

-

-

880

10000

88

-

-

0.035 (0.90mm)

-

N/A

-

表面贴装

1932-BBGA, FCBGA

YES

1932-FBGA, FC (45x45)

1932

Panduit Corp

Bulk

Obsolete

Lead free / RoHS Compliant

840

FBGA-1932

网格排列

PLASTIC/EPOXY

BGA1932,44X44,40

-40 °C

0.85 V

0.82 V

100 °C

有

5SEE9F45I2LN

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0.88 V

5.29

-40°C ~ 100°C (TJ)

*

活跃

3 (168 Hours)

8542.39.00.01

现场可编程门阵列

CMOS

0.82 V ~ 0.88 V

BOTTOM

BALL

1 mm

compliant

5SEE9F45

S-PBGA-B1932

840

不合格

0.85,1.5,2.5,2.5/3,1.2/3 V

INDUSTRIAL

840

31700 CLBS

3.9 mm

现场可编程门阵列

840000

64210944

317000

31700

840000

45 mm

45 mm

N/A

-

表面贴装

Axial

YES

Axial

1932

Vishay Dale

Bulk

Obsolete

Lead free / RoHS Compliant

840

BGA, BGA1932,44X44,40

网格排列

PLASTIC/EPOXY

BGA1932,44X44,40

-40 °C

0.9 V

0.87 V

100 °C

有

5SGSED6N1F45I2N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0.93 V

5.3

-55°C ~ 225°C

RNX

0.140 Dia x 2.040 L (3.56mm x 51.82mm)

±1%

活跃

3 (168 Hours)

2

±200ppm/°C

100 kOhms

金属氧化膜

5W

8542.39.00.01

现场可编程门阵列

CMOS

0.87 V ~ 0.93 V

BOTTOM

BALL

1 mm

compliant

5SGSED6

S-PBGA-B1932

840

不合格

-

0.9,1.5,2.5,2.5/3,1.2/3 V

INDUSTRIAL

840

22000 CLBS

3.9 mm

现场可编程门阵列

583000

54553600

220000

22000

583000

Flame Proof, High Voltage, Safety

-

45 mm

45 mm

N/A

-

Free Hanging (In-Line)

1760-BBGA, FCBGA

YES

-

铝合金

1760-HBGA (45x45)

Plastic

1760

-

TE Connectivity Deutsch 连接器

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0.88 V

5.28

Gold

Copper Alloy

Obsolete

YAFD51

Metal

Bulk

-

600

Contains lead / RoHS Compliant

BGA, BGA1760,42X42,40

网格排列

PLASTIC/EPOXY

BGA1760,42X42,40

-40 °C

0.85 V

0.82 V

100 °C

无

5SGXEBBR3H43I3L

BGA

-55°C ~ 200°C

Military, MIL-DTL-26482 G Series II, AFD

活跃

3 (168 Hours)

Crimp

Receptacle, Male Pins

15

Black

Aviation, Automotive, Military

8542.39.00.01

卡口锁

现场可编程门阵列

7.5A, 13A

CMOS

0.82 V ~ 0.88 V

BOTTOM

Y

BALL

Unshielded

抗环境干扰

1 mm

compliant

5SGXEBB

黑色阳极氧化

14-15

S-PBGA-B1760

600

不合格

0.85,1.5,2.5,2.5/3,1.2/3 V

INDUSTRIAL

-

-

600

35920 CLBS

4 mm

现场可编程门阵列

952000

65561600

359200

35920

952000

-

45 mm

45 mm

50.0µin (1.27µm)

-