品牌是'ALTERA' (8847)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 操作温度 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 内存大小 | 内存大小 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 高度 | 长度 | 宽度 | 辐射硬化 | 达到SVHC | 无铅 | |||||||||||||||||||||||||||
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![]() | EP1S40F1020C6 | ALTERA | 数据表 | 542 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1020-BBGA | YES | 1020-FBGA (33x33) | 1020 | 1.5 V | 30 | 1.425 V | 85 °C | 无 | EP1S40F1020C6 | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 1.575 V | 7.73 | 773 | BGA, BGA1020,31X31,50 | 网格排列 | 3 | PLASTIC/EPOXY | BGA1020,31X31,50 | 0°C ~ 85°C (TJ) | Stratix® | e0 | Obsolete | 3A001.A.7.A | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425 V ~ 1.575 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP1S40 | S-PBGA-B1020 | 818 | 不合格 | 1.5,1.5/3.3 V | 商业扩展 | 818 | 4697 CLBS | 3.5 mm | 现场可编程门阵列 | 41250 | 3423744 | 4125 | 4697 | 41250 | 33 mm | 33 mm | ||||||||||||||||||||||||||||||||||
![]() | EP3C80F780C6N | ALTERA | 数据表 | 609 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 780-BGA | YES | 780-FBGA (29x29) | 780 | BGA780,28X28,40 | 1.2 V | 40 | 1.15 V | 85 °C | 有 | EP3C80F780C6N | 472.5 MHz | BGA | RECTANGULAR | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 5.27 | 429 | BGA, BGA780,28X28,40 | 网格排列 | 3 | PLASTIC/EPOXY | 0°C ~ 85°C (TJ) | Cyclone® III | e1 | 活跃 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 245 | 1 mm | compliant | EP3C80 | R-PBGA-B780 | 429 | 不合格 | OTHER | 429 | 81264 CLBS | 3.5 mm | 现场可编程门阵列 | 81264 | 2810880 | 5079 | 81264 | 81264 | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||
![]() | EP4CE10F17C8N | ALTERA | 数据表 | 540 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA | YES | 256 | 256-FBGA (17x17) | 256 | 10320 | Compliant | LBGA, BGA256,16X16,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1 V | 0.97 V | 85 °C | 有 | EP4CE10F17C8N | 472.5 MHz | LBGA | SQUARE | Intel Corporation | 活跃 | ALTERA - EP4CE10F17C8N - FPGA, CYCLONE IV, 10K LE, 256FBGA | INTEL CORP | 1.03 V | 1.57 | 179 | -- | 8542390000 | 0°C ~ 85°C (TJ) | Cyclone® IV E | e1 | 活跃 | -- | SMD/SMT | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 85 °C | 0 °C | IT CAN ASO OPERATE AT 1.2V SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | 1.15 V ~ 1.25 V | BOTTOM | BALL | 1 mm | compliant | EP4CE10 | S-PBGA-B256 | 179 | 不合格 | 1.2 V | 1.2,1.2/3.3,2.5 V | OTHER | 1.24 V | 1.16 V | 51.8 kB | 51.8 kB | 179 | 10320 CLBS | 1.55 mm | 现场可编程门阵列 | 10320 | 423936 | 200 MHz | 645 | 645 | 8 | 10320 | 10320 | 17 mm | 17 mm | 无 | Unknown | ||||||||||||||
![]() | EP2C20F484C6N | ALTERA | 数据表 | 2445 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FBGA (23x23) | 484 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.15 V | 85 °C | 有 | EP2C20F484C6N | 500 MHz | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 1.39 | -- | 315 | BGA, BGA484,22X22,40 | 网格排列 | 0°C ~ 85°C (TJ) | Cyclone® II | e1 | 活跃 | -- | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 260 | 1 mm | compliant | EP2C20 | S-PBGA-B484 | 299 | 不合格 | 1.2,1.5/3.3,3.3 V | OTHER | 315 | 1172 CLBS | 2.6 mm | 现场可编程门阵列 | 18752 | 239616 | 1172 | 1172 | 18752 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||
![]() | EP4CE40F23C8L | ALTERA | 数据表 | 2533 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 484 | 484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1 V | 30 | 0.97 V | 85 °C | 无 | EP4CE40F23C8L | 362 MHz | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.03 V | 5.24 | 328 | Non-Compliant | BGA, BGA484,22X22,40 | e0 | 3A001.A.7.A | 锡铅 | 85 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | BOTTOM | BALL | 220 | 1 mm | compliant | S-PBGA-B484 | 331 | 不合格 | 1.2 V | 1,1.2/3.3,2.5 V | OTHER | 141.8 kB | 141.8 kB | 331 | 2475 CLBS | 2.4 mm | 现场可编程门阵列 | 39600 | 200 MHz | 2475 | 2475 | 39600 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||
![]() | EP1C12F324C8N | ALTERA | 数据表 | 1200 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 324-BGA | YES | 324-FBGA (19x19) | 324 | 19 X 19 MM, 1.0 MM PITCH, FBGA-324 | 网格排列 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | 1.5 V | 40 | 1.425 V | 85 °C | 有 | EP1C12F324C8N | 275 MHz | BGA | SQUARE | Altera Corporation | Transferred | FPGA, CYCLONE | ALTERA CORP | 1.575 V | 3.14 | BGA | 249 | -- | 0°C ~ 85°C (TJ) | Cyclone® | e1 | 有 | 活跃 | -- | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425 V ~ 1.575 V | BOTTOM | BALL | 260 | 1 mm | unknown | EP1C12 | 324 | S-PBGA-B324 | 249 | 不合格 | 1.5,1.5/3.3 V | OTHER | 249 | 12060 CLBS | 2.2 mm | 现场可编程门阵列 | 12060 | 239616 | 1206 | 12060 | 12060 | 19 mm | 19 mm | |||||||||||||||||||||||||||
![]() | EP1C20F324C7N | ALTERA | 数据表 | 2796 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 324-BGA | YES | 324-FBGA (19x19) | 324 | 网格排列 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | 1.5 V | 40 | 1.425 V | 85 °C | 有 | EP1C20F324C7N | 320 MHz | BGA | SQUARE | Altera Corporation | Transferred | ALTERA CORP | 1.575 V | 3.56 | BGA | 233 | -- | 19 X 19 MM, 1.0 MM PITCH, FBGA-324 | 0°C ~ 85°C (TJ) | Cyclone® | e1 | 有 | 活跃 | -- | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425 V ~ 1.575 V | BOTTOM | BALL | 260 | 1 mm | unknown | EP1C20 | 324 | S-PBGA-B324 | 233 | 不合格 | 1.5,1.5/3.3 V | OTHER | 301 | 20060 CLBS | 2.2 mm | 现场可编程门阵列 | 20060 | 294912 | 2006 | 20060 | 20060 | 19 mm | 19 mm | ||||||||||||||||||||||||||||
![]() | EP4CE15F23C8L | ALTERA | 数据表 | 19 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FBGA (23x23) | 484 | BGA484,22X22,40 | 1 V | 30 | 0.97 V | 85 °C | 无 | EP4CE15F23C8L | 362 MHz | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.03 V | 5.22 | 343 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | 0°C ~ 85°C (TJ) | Cyclone® IV E | e0 | 活跃 | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | 0.97 V ~ 1.03 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP4CE15 | S-PBGA-B484 | 346 | 不合格 | 1,1.2/3.3,2.5 V | OTHER | 346 | 963 CLBS | 2.4 mm | 现场可编程门阵列 | 15408 | 516096 | 963 | 963 | 15408 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||
![]() | EP4CE30F29C8L | ALTERA | 数据表 | 19 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 780-BGA | YES | 780 | 780-FBGA (29x29) | 780 | BGA780,28X28,40 | 1 V | 30 | 0.97 V | 85 °C | 无 | EP4CE30F29C8L | 362 MHz | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.03 V | 5.23 | 532 | Compliant | BGA, BGA780,28X28,40 | 网格排列 | 3 | PLASTIC/EPOXY | 0°C ~ 85°C (TJ) | Cyclone® IV E | e0 | 活跃 | 3A001.A.7.A | 锡铅 | 85 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | 0.97 V ~ 1.03 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP4CE30 | S-PBGA-B780 | 535 | 不合格 | 1.2 V | 1,1.2/3.3,2.5 V | OTHER | 74.3 kB | 74.3 kB | 535 | 1803 CLBS | 2.4 mm | 现场可编程门阵列 | 28848 | 608256 | 200 MHz | 1803 | 1803 | 1803 | 28848 | 29 mm | 29 mm | ||||||||||||||||||||||||
![]() | EP4CE55F23I7N | ALTERA | 数据表 | 2454 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 484-BGA | YES | 484 | 484-FBGA (23x23) | 484 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 40 | 1.15 V | 有 | EP4CE55F23I7N | 472.5 MHz | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 1.41 | 324 | -- | Compliant | BGA, BGA484,22X22,40 | 网格排列 | 3 | -40°C ~ 100°C (TJ) | Cyclone® IV E | e1 | 活跃 | -- | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | 1.15 V ~ 1.25 V | BOTTOM | BALL | 260 | 1 mm | compliant | EP4CE55 | S-PBGA-B484 | 327 | 不合格 | 1.2 V | 1.2,1.2/3.3,2.5 V | 1.24 V | 1.16 V | 292.5 kB | 292.5 kB | 327 | 3491 CLBS | 2.4 mm | 现场可编程门阵列 | 55856 | 2396160 | 200 MHz | 3491 | 3491 | 7 | 3491 | 55856 | 23 mm | 23 mm | 无 | |||||||||||||||||||||
![]() | EP4CE22F17C8N | ALTERA | 数据表 | 14 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FBGA (17x17) | 256 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.2 V | 40 | 1.15 V | 85 °C | 有 | EP4CE22F17C8N | 472.5 MHz | LBGA | SQUARE | Intel Corporation | 活跃 | ALTERA - EP4CE22F17C8N - FPGA, CYCLONE IV, 22K, 256FBGA | INTEL CORP | 1.25 V | 1.54 | 153 | -- | LBGA, BGA256,16X16,40 | 0°C ~ 85°C (TJ) | Cyclone® IV E | e1 | 活跃 | -- | 锡银铜 | 8542.39.00.01 | 现场可编程门阵列 | 1.15 V ~ 1.25 V | BOTTOM | BALL | 260 | 1 mm | compliant | EP4CE22 | S-PBGA-B256 | 153 | 不合格 | 1.2,1.2/3.3,2.5 V | OTHER | 153 | 1395 CLBS | 1.55 mm | 现场可编程门阵列 | 22320 | 608256 | 1395 | 1395 | 22320 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||
![]() | EP4CE40F23C7N | ALTERA | 数据表 | 2018 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 484-BGA | YES | 484 | 484-FBGA (23x23) | 484 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 40 | 1.15 V | 85 °C | 有 | EP4CE40F23C7N | 472.5 MHz | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 1.38 | 328 | Compliant | -- | BGA, BGA484,22X22,40 | 网格排列 | 0°C ~ 85°C (TJ) | Cyclone® IV E | e1 | 活跃 | -- | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | 1.15 V ~ 1.25 V | BOTTOM | BALL | 260 | 1 mm | compliant | EP4CE40 | S-PBGA-B484 | 331 | 不合格 | 1.2 V | 1.2,1.2/3.3,2.5 V | OTHER | 1.24 V | 1.16 V | 141.8 kB | 141.8 kB | 331 | 2475 CLBS | 2.4 mm | 现场可编程门阵列 | 39600 | 1161216 | 200 MHz | 2475 | 2475 | 2475 | 39600 | 23 mm | 23 mm | ||||||||||||||||||||
![]() | EP3C40F780C7N | ALTERA | 数据表 | 2749 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 780-BGA | YES | 780-FBGA (29x29) | 780 | RECTANGULAR | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 1.39 | EP3C40F780C7N | 有 | 85 °C | 1.15 V | 40 | 1.2 V | BGA780,28X28,40 | PLASTIC/EPOXY | 3 | 网格排列 | BGA, BGA780,28X28,40 | 535 | -- | 472.5 MHz | BGA | 0°C ~ 85°C (TJ) | Cyclone® III | e1 | 活跃 | -- | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 245 | 1 mm | compliant | EP3C40 | R-PBGA-B780 | 535 | 不合格 | OTHER | 535 | 39600 CLBS | 3.5 mm | 现场可编程门阵列 | 39600 | 1161216 | 2475 | 39600 | 39600 | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||
![]() | EP1C12Q240I7N | ALTERA | 数据表 | 1244 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 240-BFQFP | YES | 240 | 240-PQFP (32x32) | 240 | FQFP, QFP240,1.3SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP240,1.3SQ,20 | -65 °C | 1.5 V | 30 | 1.425 V | 135 °C | 有 | EP1C12Q240I7N | FQFP | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 1.575 V | 6.97 | 173 | -- | 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000 | Compliant | -40°C ~ 100°C (TJ) | Cyclone® | e3 | 活跃 | -- | 3A991 | Matte Tin (Sn) | 100 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425 V ~ 1.575 V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 320.1 MHz | EP1C12 | S-PQFP-G240 | 173 | 不合格 | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 29.3 kB | 29.3 kB | 249 | 1248 CLBS | 4.1 mm | 现场可编程门阵列 | 12060 | 239616 | -- | 250 MHz | 1206 | 1206 | 7 | 1248 | 12060 | 32 mm | 32 mm | 无 | 无铅 | |||||||||||||
![]() | EP4CE10E22C7N | ALTERA | 数据表 | 5 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP Exposed Pad | YES | 144-EQFP (20x20) | 144 | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | 1.2 V | 40 | 1.15 V | 85 °C | 有 | EP4CE10E22C7N | HLFQFP | SQUARE | Intel Corporation | 活跃 | FPGA - Field Programmable Gate Array FPGA - Cyclone IV E 645 LABs 91 IOs | 1.25 V | 1.44 | 472.5 MHz | INTEL CORP | 91 | HLFQFP, QFP144,.87SQ,20 | 0°C ~ 85°C (TJ) | Cyclone® IV E | e3 | 活跃 | MATTE TIN (472) OVER COPPER | 8542.39.00.01 | 现场可编程门阵列 | 1.15 V ~ 1.25 V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | EP4CE10 | S-PQFP-G144 | 91 | 不合格 | 1.2,1.2/3.3,2.5 V | OTHER | 91 | 645 CLBS | 1.65 mm | 现场可编程门阵列 | 10320 | 423936 | 645 | 645 | 10320 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||
![]() | EP3C55F484I7N | ALTERA | 数据表 | 2474 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FBGA (23x23) | 484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -40 °C | 1.2 V | 30 | 1.15 V | 100 °C | 有 | EP3C55F484I7N | 472.5 MHz | BGA | RECTANGULAR | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 1.39 | 327 | -- | BGA, BGA484,22X22,40 | -40°C ~ 100°C (TJ) | Cyclone® III | e1 | 活跃 | -- | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 245 | 1 mm | compliant | EP3C55 | R-PBGA-B484 | 327 | 不合格 | INDUSTRIAL | 327 | 55856 CLBS | 2.6 mm | 现场可编程门阵列 | 55856 | 2396160 | 3491 | 55856 | 55856 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||
![]() | EP3C40F324A7N | ALTERA | 数据表 | 2400 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 324-BGA | YES | 324 | 324-FBGA (19x19) | 324 | 2.375 V | 125 °C | 有 | EP3C40F324A7N | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 2.625 V | 5.22 | 195 | Compliant | BGA, BGA324,18X18,40 | 网格排列 | PLASTIC/EPOXY | BGA324,18X18,40 | -40 °C | 2.5 V | -40°C ~ 125°C (TJ) | Cyclone® III | 活跃 | 3A001.A.7.A | 125 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 1 mm | compliant | 437.5 MHz | EP3C40 | S-PBGA-B324 | 195 | 不合格 | 1.2/3.3 V | AUTOMOTIVE | 1.25 V | 1.15 V | 141.8 kB | 141.8 kB | 195 | 39600 CLBS | 3.5 mm | 现场可编程门阵列 | 39600 | 1161216 | 315 MHz | 2475 | 2475 | 39600 | 39600 | 19 mm | 19 mm | ||||||||||||||||||||||||||
![]() | EP3C10F256C8N | ALTERA | 数据表 | 2800 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA | YES | 256 | 256-FBGA (17x17) | 256 | -- | 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.2 V | 30 | 1.15 V | 85 °C | 有 | EP3C10F256C8N | 472.5 MHz | LBGA | RECTANGULAR | Altera Corporation | Transferred | ALTERA CORP | 1.25 V | 3.71 | BGA | 8542390000 | 182 | Compliant | 0°C ~ 85°C (TJ) | Cyclone® III | e1 | 有 | 活跃 | -- | SMD/SMT | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 260 | 1 mm | unknown | 402 MHz | EP3C10 | 256 | R-PBGA-B256 | 182 | 不合格 | 1.2 V | OTHER | 1.25 V | 1.15 V | 51.8 kB | 51.8 kB | 182 | 10320 CLBS | 1.55 mm | 现场可编程门阵列 | 10320 | 423936 | 315 MHz | 645 | 645 | 8 | 10320 | 10320 | 1.8 mm | 17 mm | 17 mm | 无 | Unknown | 无铅 | |||||||||
![]() | EP3C16Q240C8N | ALTERA | 数据表 | 1920 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 240-BFQFP | YES | 240-PQFP (32x32) | 240 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP240,1.3SQ,20 | 1.2 V | 40 | 1.15 V | 85 °C | 有 | EP3C16Q240C8N | 472.5 MHz | FQFP | RECTANGULAR | Intel Corporation | 活跃 | EP3C16Q240C8N, FPGA Cyclone III 15408 Cells, 465000 Gates, 15408 Blocks, 1.15 u2192 1.25 V 240-Pin PQFP | INTEL CORP | 1.25 V | 0.94 | 160 | -- | FQFP, QFP240,1.3SQ,20 | 0°C ~ 85°C (TJ) | Cyclone® III | e3 | 活跃 | -- | 3A991 | MATTE TIN (472) OVER COPPER | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | EP3C16 | R-PQFP-G240 | 160 | 不合格 | OTHER | 160 | 15408 CLBS | 4.1 mm | 现场可编程门阵列 | 15408 | 516096 | 963 | 15408 | 15408 | 32 mm | 32 mm | |||||||||||||||||||||||||||||||
![]() | EP2S30F672C5N | ALTERA | 数据表 | 288 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | PLASTIC/EPOXY | BGA672,26X26,40 | 1.2 V | 40 | 1.15 V | 85 °C | 有 | EP2S30F672C5N | 640 MHz | BGA | SQUARE | Altera Corporation | Transferred | ALTERA CORP | 1.25 V | 3.74 | BGA | 500 | 35 X 35 MM, 1 MM PITCH, FBGA-672 | 网格排列 | 3 | 0°C ~ 85°C (TJ) | Stratix® II | e1 | 有 | 活跃 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 245 | 1.27 mm | not_compliant | EP2S30 | 672 | S-PBGA-B672 | 492 | 不合格 | 1.2,1.5/3.3,3.3 V | OTHER | 500 | 13552 CLBS | 2.6 mm | 现场可编程门阵列 | 33880 | 1369728 | 1694 | 5.962 ns | 13552 | 33880 | 35 mm | 35 mm | |||||||||||||||||||||||||||||
![]() | EP4CE22E22C7N | ALTERA | 数据表 | 953 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP Exposed Pad | YES | 144-EQFP (20x20) | 144 | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | 1.2 V | 40 | 1.15 V | 85 °C | 有 | EP4CE22E22C7N | 472.5 MHz | HLFQFP | SQUARE | Intel Corporation | 活跃 | FPGA, Cyclone IV E, 22320 cell, EQFP144 EP4CE22E22C7N, FPGA Cyclone 22320 Cells, 22320 Gates, 608256, 1395 Blocks, 1.15 u2192 1.25 V 144-Pin EQFP | INTEL CORP | 1.25 V | 1.37 | 79 | -- | HLFQFP, QFP144,.87SQ,20 | 0°C ~ 85°C (TJ) | Cyclone® IV E | e3 | 活跃 | -- | MATTE TIN (472) OVER COPPER | 8542.39.00.01 | 现场可编程门阵列 | 1.15 V ~ 1.25 V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | EP4CE22 | S-PQFP-G144 | 79 | 不合格 | 1.2,1.2/3.3,2.5 V | OTHER | 79 | 1395 CLBS | 1.65 mm | 现场可编程门阵列 | 22320 | 608256 | 1395 | 1395 | 22320 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||
![]() | EP4SE530H35I3 | ALTERA | 数据表 | 1 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 1152-BBGA, FCBGA | YES | 1152 | 1152-HBGA, FC (42.5x42.5) | 1152 | 0.87 V | 无 | EP4SE530H35I3 | 717 MHz | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 0.93 V | 5.27 | 744 | Non-Compliant | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 30 | -40°C ~ 100°C (TJ) | STRATIX® IV E | e0 | 活跃 | 3A001.A.7.A | 锡铅 | 100 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 0.87 V ~ 0.93 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP4SE530 | S-PBGA-B1152 | 744 | 不合格 | 900 mV | 0.9,1.2/3,1.5,2.5 V | 3.3 MB | 3.3 MB | 744 | 212480 CLBS | 3.7 mm | 现场可编程门阵列 | 531200 | 28033024 | 600 MHz | 21248 | 21248 | 212480 | 531200 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||||
![]() | EP2C8AF256I8N | ALTERA | 数据表 | 902 In Stock |
- | 最小起订量: 1 最小包装量: 1 | YES | 256 | 1.2 V | 40 | 1.15 V | 有 | EP2C8AF256I8N | LBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 5.23 | LBGA, BGA256,16X16,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | e1 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 174 | 不合格 | 1.2,1.5/3.3,3.3 V | 182 | 1.55 mm | 现场可编程门阵列 | 8256 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1C20F400C6N | ALTERA | 数据表 | 2412 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 400-BGA | YES | 400-FBGA (21x21) | 400 | PLASTIC/EPOXY | BGA400,20X20,40 | 1.5 V | 40 | 1.425 V | 85 °C | 有 | EP1C20F400C6N | 405 MHz | BGA | SQUARE | Altera Corporation | Transferred | ALTERA CORP | 1.575 V | 3.74 | BGA | 301 | 21 X 21 MM, 1.00 MM PITCH, FBGA-400 | 网格排列 | 3 | 0°C ~ 85°C (TJ) | Cyclone® | e1 | 有 | 最后一次购买 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425 V ~ 1.575 V | BOTTOM | BALL | 260 | 1 mm | unknown | EP1C20 | 400 | S-PBGA-B400 | 301 | 不合格 | 1.5,1.5/3.3 V | OTHER | 301 | 20060 CLBS | 2.2 mm | 现场可编程门阵列 | 20060 | 294912 | 2006 | 20060 | 20060 | 21 mm | 21 mm | ||||||||||||||||||||||||||||||
![]() | EP1S80F1020I7 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1020-BBGA | YES | 1020-FBGA (33x33) | 1020 | 未说明 | 1.425 V | 无 | EP1S80F1020I7 | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 1.575 V | 5.21 | 773 | BGA, BGA1020,32X32,40 | 网格排列 | 4 | PLASTIC/EPOXY | BGA1020,32X32,40 | 1.5 V | -40°C ~ 100°C (TJ) | Stratix® | e0 | Obsolete | 3A001.A.7.A | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425 V ~ 1.575 V | BOTTOM | BALL | 未说明 | 1 mm | compliant | EP1S80 | S-PBGA-B1020 | 1238 | 不合格 | 1.5,1.5/3.3 V | 1238 | 现场可编程门阵列 | 79040 | 7427520 | 7904 | 79040 |
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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EP3C80F780C6N
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241.304937
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1,217.699921
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1,030.686300
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2,798.852371
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538.894589
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分类:Embedded - FPGAs (Field Programmable Gate Array)
650.530732
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1,711.713765
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447.011973
EP4CE40F23C7N
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936.885766
EP3C40F780C7N
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分类:Embedded - FPGAs (Field Programmable Gate Array)
2,559.335947
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282.362770
EP3C55F484I7N
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分类:Embedded - FPGAs (Field Programmable Gate Array)
3,643.941556
EP3C40F324A7N
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3,514.782910
EP3C10F256C8N
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450.793730
EP3C16Q240C8N
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分类:Embedded - FPGAs (Field Programmable Gate Array)
558.731716
EP2S30F672C5N
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分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4CE22E22C7N
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分类:Embedded - FPGAs (Field Programmable Gate Array)
448.812020
EP4SE530H35I3
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C8AF256I8N
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分类:Embedded - FPGAs (Field Programmable Gate Array)
592.463909
EP1C20F400C6N
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分类:Embedded - FPGAs (Field Programmable Gate Array)
2,652.715181
EP1S80F1020I7
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
