品牌是'ALTERA' (8847)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 内存大小 | 内存大小 | 传播延迟 | 数据率 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 收发器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 专用输入数量 | 产品类别 | 高度 | 长度 | 宽度 | 辐射硬化 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | EP2C8T144C8N | ALTERA | 数据表 | 6250 In Stock |
- | 最小起订量: 1 最小包装量: 1 | YES | 144 | 85 °C | 有 | EP2C8T144C8N | 402.5 MHz | LFQFP | SQUARE | Intel Corporation | 活跃 | CYCLONE II FPGA | INTEL CORP | 1.25 V | 1.38 | 1.15 V | 40 | 1.2 V | QFP144,.87SQ,20 | PLASTIC/EPOXY | 3 | FLATPACK, LOW PROFILE, FINE PITCH | LFQFP, QFP144,.87SQ,20 | e3 | EAR99 | 哑光锡 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G144 | 77 | 不合格 | 1.2,1.5/3.3,3.3 V | OTHER | 85 | 516 CLBS | 1.6 mm | 现场可编程门阵列 | 516 | 8256 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP3C25F324C7 | ALTERA | 数据表 | 2899 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 324-BGA | YES | 324-FBGA (19x19) | 324 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | 1.2 V | 30 | 1.15 V | 85 °C | 无 | EP3C25F324C7 | 472.5 MHz | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 5.22 | 215 | BGA, BGA324,18X18,40 | 网格排列 | 0°C ~ 85°C (TJ) | Cyclone® III | e0 | 活跃 | 3A991 | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP3C25 | S-PBGA-B324 | 215 | 不合格 | OTHER | 215 | 24624 CLBS | 1.9 mm | 现场可编程门阵列 | 24624 | 608256 | 1539 | 24624 | 24624 | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP2C5Q208C8N | ALTERA | 数据表 | 144 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 1.2 V | 40 | 1.15 V | 85 °C | 有 | EP2C5Q208C8N | 402.5 MHz | FQFP | SQUARE | Intel Corporation | 活跃 | Cyclone Devices | INTEL CORP | 1.25 V | 1.38 | 142 | -- | Cyclone II | 28 x 28 x 3.4mm | 1.15 V | PQFP | +85 °C | 0 °C | 13 (18 x 18) | 1.25 V | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 0°C ~ 85°C (TJ) | Cyclone® II | e3 | 活跃 | -- | EAR99 | MATTE TIN (472) OVER COPPER | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | EP2C5 | 208 | S-PQFP-G208 | 134 | 不合格 | 1.2,1.5/3.3,3.3 V | OTHER | 142 | 288 CLBS | 4.1 mm | 现场可编程门阵列 | 4608 | 119808 | 288 | 288 | 4608 | 3.4mm | 28mm | 28mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP3C16F484C6 | ALTERA | 数据表 | 2924 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FBGA (23x23) | 484 | -- | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.15 V | 85 °C | 无 | EP3C16F484C6 | 472.5 MHz | BGA | RECTANGULAR | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 1.71 | 346 | 0°C ~ 85°C (TJ) | Cyclone® III | e0 | 活跃 | -- | 3A991 | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP3C16 | R-PBGA-B484 | 346 | 不合格 | OTHER | 346 | 15408 CLBS | 2.6 mm | 现场可编程门阵列 | 15408 | 516096 | 963 | 15408 | 15408 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP2C8F256I8N | ALTERA | 数据表 | 5468 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FBGA (17x17) | 256 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.2 V | 40 | 1.15 V | 有 | EP2C8F256I8N | 402.5 MHz | LBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 1.39 | 182 | -- | LBGA, BGA256,16X16,40 | -40°C ~ 100°C (TJ) | Cyclone® II | e1 | 活跃 | -- | EAR99 | 锡银铜 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 260 | 1 mm | compliant | EP2C8 | S-PBGA-B256 | 174 | 不合格 | 1.2,1.5/3.3,3.3 V | 182 | 516 CLBS | 1.55 mm | 现场可编程门阵列 | 8256 | 165888 | 516 | 516 | 8256 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1C4F324C6N | ALTERA | 数据表 | 141 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 324-BGA | YES | 324-FBGA (19x19) | 324 | 网格排列 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | 1.5 V | 40 | 1.425 V | 85 °C | 有 | EP1C4F324C6N | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 1.575 V | 7.76 | -- | 249 | BGA, BGA324,18X18,40 | 0°C ~ 85°C (TJ) | Cyclone® | e1 | 活跃 | -- | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425 V ~ 1.575 V | BOTTOM | BALL | 260 | 1 mm | compliant | EP1C4 | S-PBGA-B324 | 301 | 不合格 | 1.5,1.5/3.3 V | OTHER | 301 | 442 CLBS | 3.5 mm | 现场可编程门阵列 | 4000 | 78336 | 400 | 442 | 4000 | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP2C5F256C8N | ALTERA | 数据表 | 1500 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FBGA (17x17) | 256 | SMD/SMT | 288 LAB | 969718 | Intel | Intel / Altera | 260 MHz | Cyclone II | Details | LBGA, BGA256,16X16,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.2 V | 40 | 85 °C | 有 | EP2C5F256C8N | 402.5 MHz | LBGA | SQUARE | 活跃 | INTEL CORP | 1.38 | 158 | -- | 有 | 4608 LE | 119808 bit | + 70 C | 1.25 V | 0.052911 oz | 0 C | 90 | 1.15 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® II | e1 | 活跃 | -- | EAR99 | 锡银铜 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 260 | 1 mm | compliant | EP2C5 | S-PBGA-B256 | 150 | 不合格 | 1.15 V to 1.25 V | 1.2,1.5/3.3,3.3 V | OTHER | - | 158 | 288 CLBS | 1.55 mm | 现场可编程门阵列 | 4608 | FPGA - Field Programmable Gate Array | 119808 | 288 | - | 288 | 4608 | FPGA - Field Programmable Gate Array | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||
![]() | EP2C8F256C8N | ALTERA | 数据表 | 664 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FBGA (17x17) | 256 | -- | LBGA, BGA256,16X16,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.2 V | 40 | 1.15 V | 85 °C | 有 | EP2C8F256C8N | 402.5 MHz | LBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 1.38 | 182 | 0°C ~ 85°C (TJ) | Cyclone® II | e1 | 活跃 | -- | EAR99 | 锡银铜 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 260 | 1 mm | compliant | EP2C8 | S-PBGA-B256 | 174 | 不合格 | 1.2,1.5/3.3,3.3 V | OTHER | 182 | 516 CLBS | 1.55 mm | 现场可编程门阵列 | 8256 | 165888 | 516 | 516 | 8256 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1S40F780C7 | ALTERA | 数据表 | 852 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | 网格排列 | 3 | PLASTIC/EPOXY | BGA780,28X28,40 | 1.5 V | 30 | 1.425 V | 85 °C | 无 | EP1S40F780C7 | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 1.575 V | 5.21 | BGA, BGA780,28X28,40 | e0 | 3A001.A.7.A | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 220 | 1 mm | compliant | S-PBGA-B780 | 822 | 不合格 | 1.5,1.5/3.3 V | 商业扩展 | 822 | 4697 CLBS | 3.5 mm | 现场可编程门阵列 | 4697 | 41250 | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP2C35U484C6 | ALTERA | 数据表 | 2800 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-FBGA | YES | 484-UBGA (19x19) | 484 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.15 V | 85 °C | 无 | EP2C35U484C6 | 500 MHz | FBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 5.23 | 322 | FBGA, BGA484,22X22,40 | GRID ARRAY, FINE PITCH | 0°C ~ 85°C (TJ) | Cyclone® II | e0 | 活跃 | 3A991 | 锡铅 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 0.8 mm | compliant | EP2C35 | S-PBGA-B484 | 306 | 不合格 | 1.2,1.5/3.3,3.3 V | OTHER | 322 | 2076 CLBS | 2.2 mm | 现场可编程门阵列 | 33216 | 483840 | 2076 | 2076 | 33216 | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP2S30F672C3 | ALTERA | 数据表 | 590 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | 3 | PLASTIC/EPOXY | BGA672,26X26,40 | 1.2 V | 30 | 1.15 V | 85 °C | 无 | EP2S30F672C3 | 717 MHz | BGA | SQUARE | Intel Corporation | 不推荐 | INTEL CORP | 1.25 V | 5.28 | 500 | BGA, BGA672,26X26,40 | 网格排列 | 0°C ~ 85°C (TJ) | Stratix® II | e0 | 活跃 | 3A001.A.7.A | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1.27 mm | compliant | EP2S30 | S-PBGA-B672 | 492 | 不合格 | 1.2,1.5/3.3,3.3 V | OTHER | 500 | 13552 CLBS | 2.6 mm | 现场可编程门阵列 | 33880 | 1369728 | 1694 | 4.45 ns | 13552 | 33880 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP3C40F484C8 | ALTERA | 数据表 | 2404 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FBGA (23x23) | 484 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.15 V | 85 °C | 无 | EP3C40F484C8 | 472.5 MHz | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 5.25 | 331 | BGA, BGA484,22X22,40 | 网格排列 | 0°C ~ 85°C (TJ) | Cyclone® III | e0 | 活跃 | 3A991 | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP3C40 | S-PBGA-B484 | 331 | 不合格 | OTHER | 331 | 39600 CLBS | 2.4 mm | 现场可编程门阵列 | 39600 | 1161216 | 2475 | 39600 | 39600 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP3C55F780C7 | ALTERA | 数据表 | 2194 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 780-BGA | YES | 780-FBGA (29x29) | 780 | 3 | PLASTIC/EPOXY | BGA780,28X28,40 | 1.2 V | 30 | 1.15 V | 85 °C | 无 | EP3C55F780C7 | 472.5 MHz | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 5.26 | 377 | BGA, BGA780,28X28,40 | 网格排列 | 0°C ~ 85°C (TJ) | Cyclone® III | e0 | 活跃 | 3A991 | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP3C55 | S-PBGA-B780 | 377 | 不合格 | OTHER | 377 | 55856 CLBS | 2.4 mm | 现场可编程门阵列 | 55856 | 2396160 | 3491 | 55856 | 55856 | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP3C25F324I7 | ALTERA | 数据表 | 2188 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 324-BGA | YES | 324 | 324-FBGA (19x19) | 324 | 网格排列 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | -40 °C | 1.2 V | 30 | 1.15 V | 100 °C | 无 | EP3C25F324I7 | 472.5 MHz | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 1.56 | 215 | Non-Compliant | BGA, BGA324,18X18,40 | -40°C ~ 100°C (TJ) | Cyclone® III | e0 | 活跃 | 3A991 | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1 mm | compliant | 437.5 MHz | EP3C25 | S-PBGA-B324 | 215 | 不合格 | INDUSTRIAL | 1.25 V | 1.15 V | 74.3 kB | 74.3 kB | 215 | 24624 CLBS | 1.9 mm | 现场可编程门阵列 | 24624 | 608256 | 315 MHz | 1539 | 1539 | 24624 | 24624 | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP4CE22F17C7 | ALTERA | 数据表 | 40 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FBGA (17x17) | 256 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.2 V | 30 | 1.15 V | 85 °C | 无 | EP4CE22F17C7 | 472.5 MHz | LBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 5.23 | 153 | LBGA, BGA256,16X16,40 | GRID ARRAY, LOW PROFILE | 0°C ~ 85°C (TJ) | Cyclone® IV E | e0 | 活跃 | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP4CE22 | S-PBGA-B256 | 153 | 不合格 | 1.2,1.2/3.3,2.5 V | OTHER | 153 | 1395 CLBS | 1.55 mm | 现场可编程门阵列 | 22320 | 608256 | 1395 | 1395 | 22320 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP2C5F256C8 | ALTERA | 数据表 | 80 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FBGA (17x17) | 256 | LBGA, BGA256,16X16,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.2 V | 30 | 1.15 V | 85 °C | 无 | EP2C5F256C8 | 402.5 MHz | LBGA | SQUARE | Intel Corporation | 活跃 | Cyclone Devices | INTEL CORP | 1.25 V | 1.59 | 158 | 0°C ~ 85°C (TJ) | Cyclone® II | e0 | 活跃 | EAR99 | 锡铅 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP2C5 | S-PBGA-B256 | 150 | 不合格 | 1.2,1.5/3.3,3.3 V | OTHER | 158 | 288 CLBS | 1.55 mm | 现场可编程门阵列 | 4608 | 119808 | 288 | 288 | 4608 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1C6T144C7 | ALTERA | 数据表 | 55 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | LFQFP, QFP144,.87SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | 1.5 V | 30 | 1.425 V | 85 °C | 无 | EP1C6T144C7 | 320 MHz | LFQFP | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 1.575 V | 5.22 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 220 | 0.5 mm | compliant | S-PQFP-G144 | 185 | 不合格 | 1.5,1.5/3.3 V | OTHER | 185 | 5980 CLBS | 1.6 mm | 现场可编程门阵列 | 5980 | 5980 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1C4F324C8 | ALTERA | 数据表 | 224 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 324-BGA | YES | 324-FBGA (19x19) | 324 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | 1.5 V | 30 | 1.425 V | 85 °C | 无 | EP1C4F324C8 | 275 MHz | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 1.575 V | 7.18 | 249 | BGA, BGA324,18X18,40 | 网格排列 | 0°C ~ 85°C (TJ) | Cyclone® | e0 | 最后一次购买 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425 V ~ 1.575 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP1C4 | S-PBGA-B324 | 301 | 不合格 | 1.5,1.5/3.3 V | OTHER | 301 | 4000 CLBS | 2.2 mm | 现场可编程门阵列 | 4000 | 78336 | 400 | 4000 | 4000 | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1C6T144I7 | ALTERA | 数据表 | 2517 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 98 | -- | LFQFP, QFP144,.87SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | -40 °C | 1.5 V | 30 | 1.425 V | 100 °C | 无 | EP1C6T144I7 | 320 MHz | LFQFP | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 1.575 V | 7.72 | -40°C ~ 100°C (TJ) | Cyclone® | e0 | 活跃 | -- | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425 V ~ 1.575 V | QUAD | 鸥翼 | 220 | 0.5 mm | compliant | EP1C6 | S-PQFP-G144 | 185 | 不合格 | 1.5,1.5/3.3 V | INDUSTRIAL | 185 | 5980 CLBS | 1.6 mm | 现场可编程门阵列 | 5980 | 92160 | 598 | 5980 | 5980 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP3C5U256I7 | ALTERA | 数据表 | 12 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LFBGA | YES | 256-UBGA (14x14) | 256 | -40 °C | 1.2 V | 1.15 V | 100 °C | 无 | EP3C5U256I7 | 472.5 MHz | LFBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 5.22 | 182 | LFBGA, BGA256,16X16,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA256,16X16,32 | -40°C ~ 100°C (TJ) | Cyclone® III | e0 | 活跃 | EAR99 | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 0.8 mm | compliant | EP3C5 | S-PBGA-B256 | 182 | 不合格 | INDUSTRIAL | 182 | 5136 CLBS | 1.5 mm | 现场可编程门阵列 | 5136 | 423936 | 321 | 5136 | 5136 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP2C5F256I8 | ALTERA | 数据表 | 43 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA | YES | 256 | 256-FBGA (17x17) | 256 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.2 V | 30 | 1.15 V | 无 | EP2C5F256I8 | 402.5 MHz | LBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 1.57 | 158 | -- | Compliant | LBGA, BGA256,16X16,40 | GRID ARRAY, LOW PROFILE | -40°C ~ 100°C (TJ) | Cyclone® II | e0 | 活跃 | -- | EAR99 | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1 mm | compliant | 402.58 MHz | EP2C5 | S-PBGA-B256 | 150 | 不合格 | 1.2 V | 1.2,1.5/3.3,3.3 V | 1.25 V | 1.15 V | 14.6 kB | 14.6 kB | 158 | 288 CLBS | 1.55 mm | 现场可编程门阵列 | 4608 | 119808 | 5000 | 260 MHz | 288 | 288 | 8 | 288 | 4608 | 17 mm | 17 mm | 无 | 含铅 | |||||||||||||||||||||||||||||||||||||||||||
![]() | EP3C5E144C8 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP Exposed Pad | YES | 144-EQFP (20x20) | 144 | -- | LFQFP, QFP144,.87SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | 1.2 V | 30 | 1.15 V | 85 °C | 无 | EP3C5E144C8 | 472.5 MHz | LFQFP | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 1.7 | 94 | 0°C ~ 85°C (TJ) | Cyclone® III | e0 | 活跃 | -- | EAR99 | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | QUAD | 鸥翼 | 220 | 0.4 mm | compliant | EP3C5 | S-PQFP-G144 | 94 | 不合格 | OTHER | 94 | 5136 CLBS | 1.65 mm | 现场可编程门阵列 | 5136 | 423936 | 321 | 5136 | 5136 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EPF10K200SFC484-1X | ALTERA | 数据表 | 930 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BBGA | YES | 484-FBGA (23x23) | 484 | Altera | 369 | Bulk | 活跃 | 23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 2.5 V | 30 | 2.375 V | 70 °C | 无 | EPF10K200SFC484-1X | BGA | SQUARE | Altera Corporation | Transferred | 369 | ALTERA CORP | 2.625 V | 5.09 | BGA | 0°C ~ 70°C (TA) | FLEX-10KS® | e0 | 无 | Obsolete | 3A991 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.375 V ~ 2.625 V | BOTTOM | BALL | 220 | 1 mm | not_compliant | EPF10K200 | 484 | S-PBGA-B484 | 369 | 不合格 | 2.5,2.5/3.3 V | COMMERCIAL | 0.3 ns | 369 | 369 I/O | 2.1 mm | 可加载 PLD | 9984 | 98304 | 513000 | 1248 | MIXED | 9984 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP20K600EBC652-3 | ALTERA | 数据表 | 125 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 652-BBGA | YES | 652 | 652-BGA (45x45) | 652 | 8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000 | Compliant | BGA, BGA652,35X35,50 | 网格排列 | 3 | PLASTIC/EPOXY | BGA652,35X35,50 | 1.8 V | 30 | 1.71 V | 85 °C | 无 | EP20K600EBC652-3 | 160 MHz | BGA | SQUARE | Intel Corporation | Obsolete | 488 | INTEL CORP | 1.89 V | 5.14 | 488 | 0°C ~ 85°C (TJ) | Bulk | APEX-20KE® | e0 | Obsolete | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.71 V ~ 1.89 V | BOTTOM | BALL | 220 | 1.27 mm | compliant | 182 MHz | EP20K600 | S-PBGA-B652 | 480 | 不合格 | 1.8 V | 1.8,1.8/3.3 V | OTHER | 1.89 V | 1.71 V | 38 kB | 38 kB | 2.92 ns | 480 | 4 DEDICATED INPUTS, 488 I/O | 3.5 mm | 可加载 PLD | 24320 | 311296 | 1537000 | 2432 | 2432 | MACROCELL | 24320 | 4 | 45 mm | 45 mm | 含铅 | ||||||||||||||||||||||||||||||||||||||||||
![]() | EP20K400EFI672-2X | ALTERA | 数据表 | 1 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 672-BBGA | YES | 672 | 672-FBGA (27x27) | 672 | 3 | PLASTIC/EPOXY | BGA672,26X26,40 | 1.8 V | 30 | 1.71 V | 无 | EP20K400EFI672-2X | BGA | SQUARE | Intel Corporation | Obsolete | 488 | INTEL CORP | 1.89 V | 7.63 | 488 | 8542390000 | Non-Compliant | FINE LINE, BGA-672 | 网格排列 | -40°C ~ 100°C (TJ) | Bulk | APEX-20KE® | e0 | Obsolete | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.71 V ~ 1.89 V | BOTTOM | BALL | 220 | 1 mm | compliant | 223 MHz | EP20K400 | S-PBGA-B672 | 480 | 不合格 | 1.8,1.8/3.3 V | 1.89 V | 1.71 V | 26 kB | 26 kB | 1.83 ns | 480 | 4 DEDICATED INPUTS, 488 I/O | 3.5 mm | 可加载 PLD | 16640 | 212992 | 1052000 | 170 MHz | 1664 | 1664 | MACROCELL | 16640 | 4 | 27 mm | 27 mm | 含铅 |
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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716.780544
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349.961042
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分类:Embedded - FPGAs (Field Programmable Gate Array)
EPF10K200SFC484-1X
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分类:Embedded - FPGAs (Field Programmable Gate Array)
5,954.241834
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分类:Embedded - FPGAs (Field Programmable Gate Array)
EP20K400EFI672-2X
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
