AMD的应用特定微控制器_正品采购_价格信息

品牌是'AMD' (158)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量			厂商																		系列	JESD-609代码	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况	温度等级	电源电流-最大值	座位高度-最大	地址总线宽度	主时钟/晶体频率-名	边界扫描	低功率模式	外部数据总线宽度	输出时钟频率-最大值	内存(字)	串行I/O数	总线兼容性	最大数据传输率	DMA通道数	通信协议
AM29C10API	AMD	数据表	125 In Stock	1: ¥251.406867 10: ¥237.176286 100: ¥223.751215 500: ¥211.086056 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Advanced Micro Devices		Bulk	活跃		*
XCZU27DR-2FFVE1156I	AMD	数据表	870 In Stock	-	最小起订量: 1 最小包装量: 1	YES	1156	BGA	RECTANGULAR	网格排列	0.876 V	0.825 V	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	100 °C	-40 °C	PLASTIC/EPOXY		e1		锡银铜			BOTTOM	BALL	245		compliant	30		R-PBGA-B1156		INDUSTRIAL	RFSOC															4
XCZU5EG-1LSFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-784	4		e1		锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL	PROGRAMMABLE SoC		3.32 mm								CAN, I2C, SPI, UART						23 mm	23 mm
XCZU9CG-2FBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	BGA-900	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.876 V	0.825 V	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC		e1		锡银铜			BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		INDUSTRIAL	PROGRAMMABLE SoC		2.88 mm								I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)						31 mm	31 mm
XCZU3EG-2LSFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-625	100 °C	-40 °C							BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B625		INDUSTRIAL	PROGRAMMABLE SoC		3.43 mm								CAN, I2C, SPI, UART						21 mm	21 mm
XCZU6CG-1LFFVC900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	PLASTIC/EPOXY	-40 °C	100 °C	4	FCBGA-900	ADVANCED MICRO DEVICES INC	活跃	有	0.85 V	网格排列		SQUARE	BGA900,30X30,40	BGA		e1		锡银铜			BOTTOM	BALL		1 mm	compliant			S-PBGA-B900		INDUSTRIAL	PROGRAMMABLE SoC		3.42 mm								CAN, I2C, SPI, UART						31 mm	31 mm
XCZU6CG-1SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	BGA-784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA78428X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC		e1		锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL	PROGRAMMABLE SoC		3.32 mm								I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)						23 mm	23 mm
XCZU6CG-L1SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	BGA-784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA78428X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.742 V	0.698 V	0.72 V	有	活跃		ADVANCED MICRO DEVICES INC		e1		锡银铜	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL	PROGRAMMABLE SoC		3.32 mm								I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)						23 mm	23 mm
XCZU5EV-3SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	-40 °C	PLASTIC/EPOXY	FBGA	SQUARE	GRID ARRAY, FINE PITCH	0.9 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-784	4	100 °C		e1		锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL	PROGRAMMABLE SoC		3.32 mm														23 mm	23 mm
XCZU6CG-1FBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	BGA-900	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.876 V	0.825 V	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC		e1		锡银铜			BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		INDUSTRIAL	PROGRAMMABLE SoC		2.88 mm								I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)						31 mm	31 mm
XCZU5CG-1LSFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-784	4		e1		锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL	PROGRAMMABLE SoC		3.32 mm								CAN, I2C, SPI, UART						23 mm	23 mm
XCZU5CG-1LFBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-900	4		e1		锡银铜			BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		INDUSTRIAL	PROGRAMMABLE SoC		2.88 mm								CAN, I2C, SPI, UART						31 mm	31 mm
XCZU7CG-1LFBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-900	4		e1		锡银铜			BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		INDUSTRIAL	PROGRAMMABLE SoC		2.88 mm								CAN, I2C, SPI, UART						31 mm	31 mm
AM7990JC	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	68	ADVANCED MICRO DEVICES INC	Obsolete	无	70 °C	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	5.25 V	4.75 V	5 V	1.67 MHz	QCCJ, LDCC68,1.0SQ		LCC		e0		锡铅		8542.31.00.01	QUAD	J BEND		1.27 mm	unknown		68	S-PQCC-J68	不合格	COMMERCIAL	SERIAL IO/COMMUNICATION CONTROLLER, LAN		5.08 mm	24	NO	NO	16		0	1	8086; 68000; Z8000; LSI-11	1.25 MBps	1	ASYNC, BIT; SYNC, BYTE; ETHERNET	NRZ		24.2062 mm	24.2062 mm
XCZU2EG-2LSBVA484E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-484	4	110 °C		e1		锡银铜			BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B484		OTHER	PROGRAMMABLE SoC		2.61 mm								CAN, I2C, SPI, UART						19 mm	19 mm
XCZU3EG-2LSBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-484	100 °C	-40 °C							BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B484		INDUSTRIAL	PROGRAMMABLE SoC		2.61 mm								CAN, I2C, SPI, UART						19 mm	19 mm
XCZU6EG-1LFFVC900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-900	4		e1		锡银铜			BOTTOM	BALL		1 mm	compliant			S-PBGA-B900		INDUSTRIAL	PROGRAMMABLE SoC		3.42 mm								CAN, I2C, SPI, UART						31 mm	31 mm
XCZU3CG-2LSBVA484E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-484	4	110 °C		e1		锡银铜			BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B484		OTHER	PROGRAMMABLE SoC		2.61 mm								CAN, I2C, SPI, UART						19 mm	19 mm
XCZU2EG-1LSBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-484	4		e1		锡银铜			BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B484		INDUSTRIAL	PROGRAMMABLE SoC		2.61 mm								CAN, I2C, SPI, UART						19 mm	19 mm
XQ7Z030-1RF900Q	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	BGA	BGA900,30X30,40	SQUARE	网格排列	无	活跃		ADVANCED MICRO DEVICES INC	31 X 31 MM, 1 MM PITCH, BGA-900	125 °C	-40 °C	PLASTIC/EPOXY		e0		Tin/Lead (Sn/Pb)			BOTTOM	BALL		1 mm	compliant			S-PBGA-B900	不合格	AUTOMOTIVE	PROGRAMMABLE SoC		3.44 mm														31 mm	31 mm
XCZU4EV-2LFBVB900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-900	4	110 °C		e1		锡银铜			BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		OTHER	PROGRAMMABLE SoC		2.88 mm								CAN, I2C, SPI, UART						31 mm	31 mm
P82284	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	18	PLASTIC/EPOXY	DIP	DIP18,.3	RECTANGULAR	IN-LINE	5.5 V	4.5 V	5 V	无	Obsolete		ADVANCED MICRO DEVICES INC	DIP, DIP18,.3	70 °C		e0	EAR99	Tin/Lead (Sn/Pb)		8542.39.00.01	DUAL	THROUGH-HOLE		2.54 mm	unknown			R-PDIP-T18	不合格	COMMERCIAL	CLOCK GENERATOR, PROCESSOR SPECIFIC	145 mA			8 MHz			8 MHz
XCZU6CG-1SBVA484E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	4	100 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	BGA-484		e1		锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B484		OTHER	PROGRAMMABLE SoC		2.61 mm								I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)						19 mm	19 mm
XCZU2EG-1LSFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-625	4		e1		锡银铜			BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B625		INDUSTRIAL	PROGRAMMABLE SoC		3.43 mm								CAN, I2C, SPI, UART						21 mm	21 mm
XCZU9CG-L1SFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	BGA-625	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.742 V	0.698 V	0.72 V	有	活跃		ADVANCED MICRO DEVICES INC		e1		锡银铜	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B625		INDUSTRIAL	PROGRAMMABLE SoC		3.43 mm								I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)						21 mm	21 mm