AMD的应用特定微控制器_正品采购_价格信息

品牌是'AMD' (158)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量																	JESD-609代码	端子表面处理	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况	温度等级	uPs/uCs/外围ICs类型	座位高度-最大	总线兼容性	长度
XCZU4CG-2LSFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	4	110 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	FCBGA-784	e1	锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		OTHER	PROGRAMMABLE SoC	3.32 mm	CAN, I2C, SPI, UART	23 mm	23 mm
XCZU7EV-1LFBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	FCBGA-900	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	e1	锡银铜		BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		INDUSTRIAL	PROGRAMMABLE SoC	2.88 mm	CAN, I2C, SPI, UART	31 mm	31 mm
AM29803ADC	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	16	DIP, DIP16,.3	DIP	ADVANCED MICRO DEVICES INC	Obsolete	无	5 V	4.75 V	5.25 V	IN-LINE	RECTANGULAR	DIP16,.3	DIP	70 °C	CERAMIC, METAL-SEALED COFIRED	e0	Tin/Lead (Sn/Pb)	8542.31.00.01	DUAL	THROUGH-HOLE		2.54 mm	unknown		16	R-CDIP-T16	不合格	COMMERCIAL	微处理器电路	5.08 mm		19.6215 mm	7.62 mm
XCZU3CG-1LSBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	FCBGA-484	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	e1	锡银铜		BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B484		INDUSTRIAL	PROGRAMMABLE SoC	2.61 mm	CAN, I2C, SPI, UART	19 mm	19 mm
XCZU9CG-2SFVA625E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	ADVANCED MICRO DEVICES INC	BGA-625	4	100 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有	活跃	e1	锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B625		OTHER	PROGRAMMABLE SoC	3.43 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	21 mm	21 mm
XCZU6EG-2LFFVC900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	4	110 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	FCBGA-900	e1	锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B900		OTHER	PROGRAMMABLE SoC	3.42 mm	CAN, I2C, SPI, UART	31 mm	31 mm
XCZU6CG-1SFVA625E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	100 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	ADVANCED MICRO DEVICES INC	活跃	有	BGA-625	4	e1	锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B625		OTHER	PROGRAMMABLE SoC	3.43 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	21 mm	21 mm
XCZU6CG-2SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	活跃	ADVANCED MICRO DEVICES INC	BGA-784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA78428X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有	e1	锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	23 mm	23 mm
XQ7Z030-1RF900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	SQUARE	网格排列	无	活跃	ADVANCED MICRO DEVICES INC	31 X 31 MM, 1 MM PITCH, BGA-900	PLASTIC/EPOXY	BGA	BGA900,30X30,40	e0	Tin/Lead (Sn/Pb)		BOTTOM	BALL		1 mm	compliant			S-PBGA-B900	不合格		PROGRAMMABLE SoC	3.44 mm		31 mm	31 mm
XCZU9CG-2SBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	活跃	ADVANCED MICRO DEVICES INC	BGA-484	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有	e1	锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B484		INDUSTRIAL	PROGRAMMABLE SoC	2.61 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	19 mm	19 mm
XCZU4CG-1LSFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	BGA784,28X28,32	FBGA	PLASTIC/EPOXY	-40 °C	100 °C	4	FCBGA-784	ADVANCED MICRO DEVICES INC	活跃	有	0.85 V	GRID ARRAY, FINE PITCH	SQUARE	e1	锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm	CAN, I2C, SPI, UART	23 mm	23 mm
XCZU7CG-2LFBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	FCBGA-900	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	e1	锡银铜		BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		INDUSTRIAL	PROGRAMMABLE SoC	2.88 mm	CAN, I2C, SPI, UART	31 mm	31 mm
XCZU9CG-1SBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	活跃	ADVANCED MICRO DEVICES INC	BGA-484	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有	e1	锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B484		INDUSTRIAL	PROGRAMMABLE SoC	2.61 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	19 mm	19 mm
XCZU7EV-3FFVF1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1517	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列	0.9 V	有	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1517	e1	锡银铜		BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B1517		INDUSTRIAL	PROGRAMMABLE SoC	3.51 mm		40 mm	40 mm
XCZU2CG-1LSFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	FCBGA-625	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	e1	锡银铜		BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B625		INDUSTRIAL	PROGRAMMABLE SoC	3.43 mm	CAN, I2C, SPI, UART	21 mm	21 mm
XCZU4CG-2LFBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	FCBGA-900	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	e1	锡银铜		BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		INDUSTRIAL	PROGRAMMABLE SoC	2.88 mm	CAN, I2C, SPI, UART	31 mm	31 mm
XCZU11EG-3FFVB1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1517	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列	0.9 V	有	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1517	e1	锡银铜		BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B1517		INDUSTRIAL	PROGRAMMABLE SoC	3.51 mm		40 mm	40 mm
XCZU4EG-2LSFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	4	110 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	FCBGA-784	e1	锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		OTHER	PROGRAMMABLE SoC	3.32 mm	CAN, I2C, SPI, UART	23 mm	23 mm
XCZU11EG-3FFVC1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列	0.9 V	有	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1156	e1	锡银铜		BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B1156		INDUSTRIAL	PROGRAMMABLE SoC	3.51 mm		35 mm	35 mm
XCZU3EG-2LSFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	FCBGA-784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	e1	锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm	CAN, I2C, SPI, UART	23 mm	23 mm
XCZU19EG-3FFVD1760I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1760	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列	0.9 V	有	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1760	e1	锡银铜		BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B1760		INDUSTRIAL	PROGRAMMABLE SoC	3.71 mm		42.5 mm	42.5 mm
XCZU6EG-2LFFVB1156E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	4	110 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1156	e1	锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B1156		OTHER	PROGRAMMABLE SoC	3.42 mm	CAN, I2C, SPI, UART	35 mm	35 mm
XCZU9CG-2LFFVC900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	4	110 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	FCBGA-900	e1	锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B900		OTHER	PROGRAMMABLE SoC	3.42 mm	CAN, I2C, SPI, UART	31 mm	31 mm
XCZU6CG-2SBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	活跃	ADVANCED MICRO DEVICES INC	BGA-484	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有	e1	锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B484		INDUSTRIAL	PROGRAMMABLE SoC	2.61 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	19 mm	19 mm
XCZU9CG-1SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	活跃	ADVANCED MICRO DEVICES INC	BGA-784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA78428X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有	e1	锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	23 mm	23 mm