对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

表面安装

终端数量

JESD-609代码

ECCN 代码

端子表面处理

附加功能

HTS代码

包装方式

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

输出的数量

资历状况

温度等级

传播延迟

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

筛选水平

输出功能

宏细胞数

JTAG BST

专用输入数量

系统内可编程

产品条款数量

长度

宽度

XA2C128-7VQG100Q
XA2C128-7VQG100Q
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Obsolete

ADVANCED MICRO DEVICES INC

3

e3

哑光锡

260

compliant

30

PZ5064N10A44
PZ5064N10A44
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

ADVANCED MICRO DEVICES INC

80 MHz

3

32

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

活跃

e0

锡铅

YES

QUAD

J BEND

225

1.27 mm

not_compliant

30

S-PQCC-J44

32

不合格

INDUSTRIAL

12.5 ns

PAL/PLA-TYPE

36

2 DEDICATED INPUTS, 32 I/O

EE PLD

64

YES

2

YES

16.585 mm

16.585 mm

XH95216-10HQG208I
XH95216-10HQG208I
AMD 数据表

91 In Stock

-

最小起订量: 1

最小包装量: 1

YES

208

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5 V

Obsolete

ADVANCED MICRO DEVICES INC

HEAT SINK, QFP-208

3

168

PLASTIC/EPOXY

e3

哑光锡

QUAD

鸥翼

245

0.5 mm

compliant

30

S-PQFP-G208

不合格

0 DEDICATED INPUTS, 168 I/O

4.1 mm

MASK PLD

MACROCELL

28 mm

28 mm

PAL16R4DMJ/883B
PAL16R4DMJ/883B
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

20

Obsolete

ADVANCED MICRO DEVICES INC

DIP

DIP, DIP20,.3

37 MHz

4

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

DIP20,.3

RECTANGULAR

IN-LINE

5.5 V

4.5 V

5 V

e0

3A001.A.2.C

锡铅

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

20

R-GDIP-T20

8

不合格

MILITARY

17 ns

PAL-TYPE

12

8 DEDICATED INPUTS, 4 I/O

OT PLD

38535Q/M;38534H;883B

MIXED

8

64

PZ5064C7A84
PZ5064C7A84
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

84

3

70 °C

PLASTIC/EPOXY

QCCJ

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

活跃

ADVANCED MICRO DEVICES INC

105 MHz

e0

锡铅

YES

QUAD

J BEND

225

1.27 mm

compliant

30

S-PQCC-J84

不合格

COMMERCIAL

9.5 ns

PAL/PLA-TYPE

EE PLD

64

YES

YES

PALCE16V8H
PALCE16V8H
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

XH95216-10HQ208C
XH95216-10HQ208C
AMD 数据表

110 In Stock

-

最小起订量: 1

最小包装量: 1

YES

208

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5 V

Obsolete

ADVANCED MICRO DEVICES INC

HEAT SINK, QFP-208

3

168

PLASTIC/EPOXY

e0

锡铅

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G208

不合格

0 DEDICATED INPUTS, 168 I/O

4.1 mm

MASK PLD

MACROCELL

28 mm

28 mm

PZ5064NS10BC-S
PZ5064NS10BC-S
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

活跃

ADVANCED MICRO DEVICES INC

TQFP-44

80 MHz

3

32

85 °C

-40 °C

PLASTIC

QFP

TQFP44,.47SQ,32

SQUARE

FLATPACK

5.5 V

4.5 V

5 V

YES

TRAY

QUAD

鸥翼

240

0.8 mm

compliant

30

S-PQFP-G44

32

不合格

INDUSTRIAL

12 ns

PAL/PLA-TYPE

36

2 DEDICATED INPUTS, 32 I/O

EE PLD

64

YES

2

YES

10 mm

10 mm

PZ5064N12BP
PZ5064N12BP
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

ADVANCED MICRO DEVICES INC

67 MHz

3

64

85 °C

-40 °C

PLASTIC/EPOXY

QFP

TQFP100,.63SQ

SQUARE

FLATPACK

5.5 V

4.5 V

5 V

活跃

e0

锡铅

YES

QUAD

鸥翼

240

0.5 mm

not_compliant

30

S-PQFP-G100

64

不合格

INDUSTRIAL

14.5 ns

PAL/PLA-TYPE

68

2 DEDICATED INPUTS, 64 I/O

EE PLD

64

YES

2

YES

14 mm

14 mm

PZ5064C10A44
PZ5064C10A44
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

80 MHz

3

32

70 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

活跃

ADVANCED MICRO DEVICES INC

e0

锡铅

YES

QUAD

J BEND

225

1.27 mm

not_compliant

30

S-PQCC-J44

32

不合格

COMMERCIAL

12.5 ns

PAL/PLA-TYPE

36

2 DEDICATED INPUTS, 32 I/O

EE PLD

64

YES

2

YES

16.585 mm

16.585 mm

PAL20L10ACJS
PAL20L10ACJS
AMD 数据表

788 In Stock

-

最小起订量: 1

最小包装量: 1

NO

24

DIP

DIP, DIP24,.3

8

75 °C

CERAMIC, GLASS-SEALED

DIP

DIP24,.3

RECTANGULAR

IN-LINE

5.25 V

4.75 V

5 V

Obsolete

ADVANCED MICRO DEVICES INC

e0

锡铅

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

24

R-GDIP-T24

10

不合格

商业扩展

30 ns

PAL-TYPE

20

12 DEDICATED INPUTS, 8 I/O

OT PLD

COMBINATORIAL

12

40

PZ5064N12A44
PZ5064N12A44
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

ADVANCED MICRO DEVICES INC

67 MHz

3

32

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

活跃

e0

锡铅

YES

QUAD

J BEND

225

1.27 mm

not_compliant

30

S-PQCC-J44

32

不合格

INDUSTRIAL

14.5 ns

PAL/PLA-TYPE

36

2 DEDICATED INPUTS, 32 I/O

EE PLD

64

YES

2

YES

16.585 mm

16.585 mm

XH95180-7HQG208C
XH95180-7HQG208C
AMD 数据表

630 In Stock

-

最小起订量: 1

最小包装量: 1

YES

208

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5 V

Obsolete

ADVANCED MICRO DEVICES INC

HEAT SINK, QFP-208

3

168

PLASTIC/EPOXY

e3

哑光锡

QUAD

鸥翼

245

0.5 mm

compliant

30

S-PQFP-G208

不合格

0 DEDICATED INPUTS, 168 I/O

4.1 mm

MASK PLD

MACROCELL

28 mm

28 mm

XCR3064XL-10VQG44Q
XCR3064XL-10VQG44Q
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

3.6 V

FLATPACK, THIN PROFILE

SQUARE

TQFP

PLASTIC/EPOXY

-40 °C

125 °C

36

3

95 MHz

VQFP-44

ADVANCED MICRO DEVICES INC

Obsolete

3.3 V

3 V

e3

哑光锡

QUAD

鸥翼

260

0.8 mm

compliant

30

S-PQFP-G44

不合格

AUTOMOTIVE

10 ns

0 DEDICATED INPUTS, 36 I/O

1.2 mm

EE PLD

MACROCELL

10 mm

10 mm

XH95576-10HQ304I
XH95576-10HQ304I
AMD 数据表

27 In Stock

-

最小起订量: 1

最小包装量: 1

YES

304

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5 V

Obsolete

ADVANCED MICRO DEVICES INC

HEAT SINK, QFP-304

3

232

PLASTIC/EPOXY

e0

锡铅

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G304

不合格

0 DEDICATED INPUTS, 232 I/O

4.5 mm

MASK PLD

MACROCELL

40 mm

40 mm

XCR3384XL-7.5CS280I
XCR3384XL-7.5CS280I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

280

ADVANCED MICRO DEVICES INC

CHIP SCALE, BGA-280

3

216

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA280,19X19,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

3.6 V

2.7 V

3.3 V

活跃

e0

锡铅

BOTTOM

BALL

0.8 mm

compliant

S-PBGA-B280

不合格

INDUSTRIAL

7.5 ns

216 I/O

1.2 mm

EE PLD

MACROCELL

16 mm

16 mm

XH95216-10PQ160C
XH95216-10PQ160C
AMD 数据表

937 In Stock

-

最小起订量: 1

最小包装量: 1

YES

160

PLASTIC/EPOXY

QFP

QFP160,1.2SQ

SQUARE

FLATPACK

5 V

Obsolete

ADVANCED MICRO DEVICES INC

PLASTIC, QFP-160

3

133

e0

锡铅

QUAD

鸥翼

0.65 mm

compliant

S-PQFP-G160

不合格

0 DEDICATED INPUTS, 133 I/O

3.94 mm

MASK PLD

MACROCELL

28 mm

28 mm

PZ5064C7BP
PZ5064C7BP
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

105 MHz

3

64

70 °C

PLASTIC/EPOXY

QFP

TQFP100,.63SQ

SQUARE

FLATPACK

5.5 V

4.5 V

5 V

活跃

ADVANCED MICRO DEVICES INC

e0

锡铅

YES

QUAD

鸥翼

240

0.5 mm

not_compliant

30

S-PQFP-G100

64

不合格

COMMERCIAL

9.5 ns

PAL/PLA-TYPE

68

2 DEDICATED INPUTS, 64 I/O

EE PLD

64

YES

2

YES

14 mm

14 mm

PAL20R6-10PC
PAL20R6-10PC
AMD 数据表

653 In Stock

-

最小起订量: 1

最小包装量: 1

NO

24

ADVANCED MICRO DEVICES INC

DIP

DIP, DIP24,.3

55.5 MHz

2

75 °C

PLASTIC/EPOXY

DIP

DIP24,.3

RECTANGULAR

IN-LINE

5.25 V

4.75 V

5 V

Obsolete

e0

锡铅

POWER-UP RESET

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

24

R-PDIP-T24

8

不合格

商业扩展

10 ns

PAL-TYPE

14

12 DEDICATED INPUTS, 2 I/O

5.08 mm

OT PLD

MIXED

12

64

30.734 mm

7.62 mm

PZ5064N10A84
PZ5064N10A84
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

84

80 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

活跃

ADVANCED MICRO DEVICES INC

e0

锡铅

YES

QUAD

J BEND

225

1.27 mm

compliant

30

S-PQCC-J84

不合格

INDUSTRIAL

12.5 ns

PAL/PLA-TYPE

EE PLD

64

YES

YES

XH95180-7HQ208C
XH95180-7HQ208C
AMD 数据表

911 In Stock

-

最小起订量: 1

最小包装量: 1

YES

208

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5 V

Obsolete

ADVANCED MICRO DEVICES INC

HEAT SINK, QFP-208

3

168

PLASTIC/EPOXY

e0

锡铅

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G208

不合格

0 DEDICATED INPUTS, 168 I/O

4.1 mm

MASK PLD

MACROCELL

28 mm

28 mm

PALCE26V12H-25JC
PALCE26V12H-25JC
AMD 数据表

308 In Stock

-

最小起订量: 1

最小包装量: 1

YES

28

ADVANCED MICRO DEVICES INC

QLCC

QCCJ, LDCC28,.5SQ

33.3 MHz

12

75 °C

PLASTIC/EPOXY

QCCJ

LDCC28,.5SQ

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

Obsolete

e0

锡铅

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

28

S-PQCC-J28

12

不合格

商业扩展

25 ns

PAL-TYPE

26

12 DEDICATED INPUTS, 12 I/O

EE PLD

MACROCELL

12

136

XH95216-10HQ208I
XH95216-10HQ208I
AMD 数据表

246 In Stock

-

最小起订量: 1

最小包装量: 1

YES

208

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5 V

Obsolete

ADVANCED MICRO DEVICES INC

HEAT SINK, QFP-208

3

168

PLASTIC/EPOXY

e0

锡铅

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G208

不合格

0 DEDICATED INPUTS, 168 I/O

4.1 mm

MASK PLD

MACROCELL

28 mm

28 mm

XA9572XL-10VQG64Q
XA9572XL-10VQG64Q
AMD 数据表

402 In Stock

-

最小起订量: 1

最小包装量: 1

YES

64

ADVANCED MICRO DEVICES INC

VQFP-64

3

52

125 °C

-40 °C

PLASTIC/EPOXY

TFQFP

TQFP64,.47SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

3.6 V

3 V

3.3 V

Obsolete

e3

哑光锡

YES

QUAD

鸥翼

260

0.5 mm

compliant

30

S-PQFP-G64

不合格

AUTOMOTIVE

10 ns

0 DEDICATED INPUTS, 52 I/O

1.2 mm

闪存 PLD

AEC-Q100

MACROCELL

72

YES

YES

10 mm

10 mm

XC2C64-4CPG56C
XC2C64-4CPG56C
AMD 数据表

696 In Stock

-

最小起订量: 1

最小包装量: 1

YES

56

ADVANCED MICRO DEVICES INC

6 X 6 MM, 0.50 MM PITCH, CSP-56

213 MHz

3

45

70 °C

PLASTIC/EPOXY

LFBGA

BGA56,10X10,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.9 V

1.7 V

1.8 V

Obsolete

e1

锡银铜

FAST ZERO POWER DESIGN TECHNOLOGY

BOTTOM

BALL

260

0.5 mm

compliant

30

S-PBGA-B56

45

不合格

COMMERCIAL

4 ns

PLA-TYPE

45

0 DEDICATED INPUTS, 45 I/O

1.35 mm

闪存 PLD

MACROCELL

64

6 mm

6 mm