品牌是'AMD' (1092)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

安装类型

包装/外壳

越来越多的功能

触点形状

外壳材料

供应商器件包装

插入材料

厂商

操作温度

系列

连接器类型

类型

定位的数量

紧固类型

触点类型

方向

屏蔽/屏蔽

入口保护

外壳完成

引脚数量

外壳尺寸-插入

房屋颜色

注意

速度

内存大小

外壳尺寸,MIL

核心处理器

周边设备

连接方式

建筑学

包括

筛选水平

速度等级

主要属性

寄存器数量

闪光大小

特征

材料可燃性等级

XCVM1302-2LLEVSVD1760
XCVM1302-2LLEVSVD1760
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

402

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVM1402-2MSEVSVD1760
XCVM1402-2MSEVSVD1760
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

726

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCVM1402-1LSENBVB1024
XCVM1402-1LSENBVB1024
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

AMD

424

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCVC1802-2HSIVIVA1596
XCVC1802-2HSIVIVA1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

1596-FCBGA (40x40)

AMD

500

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ AI Core

800MHz, 1.65GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XCVC1902-2MLEVSVA2197
XCVC1902-2MLEVSVA2197
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

770

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XAZU3EG-1SFVC784I
XAZU3EG-1SFVC784I
AMD 数据表

966 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

128

Tray

活跃

XAZU3

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 1.2GHz

1.8MB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XCZU7EG-3FFVC1156E
XCZU7EG-3FFVC1156E
AMD 数据表

763 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

0.927 V

360

Tray

XCZU7

AMD

活跃

0.9000 V

0.873 V

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU4EV-L1SFVC784I
XCZU4EV-L1SFVC784I
AMD 数据表

842 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

192,150

FCBGA

0.9000 V

0.88 V

0.92 V

252

AMD

Tray

XCZU4

活跃

Industrial grade

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EV

784

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

1L

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

175,680

-

XCZU2CG-L1SBVA484I
XCZU2CG-L1SBVA484I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

82

Tray

XCZU2

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

XAZU5EV-L1SFVC784I
XAZU5EV-L1SFVC784I
AMD 数据表

662 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

0.742 V

252

Tray

XAZU5

AMD

活跃

0.7200 V

0.698 V

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EV

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1L

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XCZU7CG-1FFVF1517E
XCZU7CG-1FFVF1517E
AMD 数据表

693 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

0.892 V

464

Tray

XCZU7

AMD

活跃

0.8500 V

0.808 V

0 to 100 °C

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU5EV-3SFVC784E
XCZU5EV-3SFVC784E
AMD 数据表

309 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

0.927 V

252

Tray

XCZU5

AMD

活跃

0.9000 V

0.873 V

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XCZU4EV-2SFVC784E
XCZU4EV-2SFVC784E
AMD 数据表

743 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

0.8500 V

252

表面贴装

252

Tray

AMD

XCZU4

活跃

192,150

0 to 100 °C

Zynq® UltraScale+™ MPSoC EV

784

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

2

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

175,680

-

XCZU11EG-3FFVC1760E
XCZU11EG-3FFVC1760E
AMD 数据表

788 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

512

512

Tray

XCZU11

AMD

活跃

653100

0.9000 V

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

1760

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

3

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

597120

-

XCZU19EG-2FFVE1924E
XCZU19EG-2FFVE1924E
AMD 数据表

535 In Stock

-

最小起订量: 1

最小包装量: 1

1924-BBGA, FCBGA

1924-FCBGA (45x45)

AMD

668

Tray

XCZU19

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

XCVC1802-2MLEVSVA2197
XCVC1802-2MLEVSVA2197
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

770

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XCZU17EG-1FFVD1760I
XCZU17EG-1FFVD1760I
AMD 数据表

887 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

308

Tray

XCZU17

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

XCVC1702-2MLIVSVA2197
XCVC1702-2MLIVSVA2197
AMD 数据表

609 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

608

Tray

活跃

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1M Logic Cells

-

XCZU6CG-1FFVB1156I
XCZU6CG-1FFVB1156I
AMD 数据表

518 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

0.892 V

328

Bulk

XCZU6

AMD

活跃

0.8500 V

0.808 V

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

XCZU19EG-2FFVB1517E
XCZU19EG-2FFVB1517E
AMD 数据表

788 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

活跃

XCZU19

Tray

644

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

XC7Z020-2CLG484CES
XC7Z020-2CLG484CES
AMD 数据表

561 In Stock

-

最小起订量: 1

最小包装量: 1

484-LFBGA, CSPBGA

484-CSPBGA (19x19)

AMD

130

Tray

XC7Z020

Obsolete

0°C ~ 85°C (TJ)

Zynq®-7000

766MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 85K Logic Cells

-

XC7Z010-2CLG400I
XC7Z010-2CLG400I
AMD 数据表

130 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA, CSPBGA

400-CSPBGA (17x17)

AMD

130

Tray

XC7Z010

活跃

-40°C ~ 100°C (TJ)

Zynq®-7000

766MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 28K Logic Cells

-

XCVM1302-2LLEVFVC1596
XCVM1302-2LLEVFVC1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

AMD

532

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCZU2CG-2SFVC784I
XCZU2CG-2SFVC784I
AMD 数据表

2045 In Stock

-

最小起订量: 1

最小包装量: 1

面板安装

784-BFBGA, FCBGA

Flange

Circular

Aluminum

784-FCBGA (23x23)

-

Amphenol Aerospace Operations

252

Bulk

TVP00RW

20

活跃

-65°C ~ 175°C

MIL-DTL-38999 Series III, Tri-Start™ TV

插座外壳

用于公引脚

41

Threaded

Crimp

A

Shielded

抗环境干扰

Cadmium

21-41

橄榄色

不包括触点

533MHz, 1.3GHz

256KB

-

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

2

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

-

-

XCZU6EG-1FFVC900E
XCZU6EG-1FFVC900E
AMD 数据表

533 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

活跃

AMD

Acme Electric

204

Tray

XCZU6

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-