品牌是'AMD' (1092)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

安装类型

包装/外壳

越来越多的功能

外壳材料

供应商器件包装

材料

插入材料

后壳材料,电镀

包装数量

厂商

操作温度

系列

尺寸/尺寸

容差

终止次数

终端

温度系数

连接器类型

类型

电阻

定位的数量

组成

颜色

应用

功率(瓦特)

紧固类型

额定功率

额定电流

电压 - 供电

方向

屏蔽/屏蔽

入口保护

电阻器类型

频率

频率稳定性

输出量

外壳完成

引脚数量

外壳尺寸-插入

功能

基本谐振器

最大电流源

工作电源电压

失败率

电流 - 电源(禁用)(最大值)

界面

速度

内存大小

外壳尺寸,MIL

核心处理器

照明

周边设备

扩频带宽

连接方式

电缆开口

建筑学

数据总线宽度

筛选水平

总高度

速度等级

绝对牵引范围 (APR)

电阻公差

主要属性

寄存器数量

完成

闪光大小

特征

产品长度

产品宽度

设备核心

粘合剂类型

座位高度(最大)

触点表面处理厚度 - 配套

面板厚度

材料可燃性等级

评级结果

XC7Z015-L1CLG485I
XC7Z015-L1CLG485I
AMD 数据表

155 In Stock

-

最小起订量: 1

最小包装量: 1

485-LFBGA, CSPBGA

485-CSPBGA (19x19)

表面贴装

130

Tray

XC7Z015

活跃

Industrial grade

AMD

74,000

CSBGA

1.0000 V

0.95 V

130

1.05 V

-40 to 100 °C

Zynq®-7000

100 ppm/°C

3.65 kOhm

0.8 W

高可靠性

485

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

1L

1

Artix™-7 FPGA, 74K Logic Cells

92,400

-

5

2.49

XCZU47DR-L1FFVE1156I
XCZU47DR-L1FFVE1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

热塑橡胶

4000

AMD

366

Tray

活跃

135 °C

-40 °C

12.5 mm

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

孔扣眼

Black

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

6.4 mm

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

1.6 mm

XCZU46DR-1FFVH1760I
XCZU46DR-1FFVH1760I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

574

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU48DR-L1FFVE1156I
XCZU48DR-L1FFVE1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Corner Holes

1156-BBGA, FCBGA

1156-FCBGA (35x35)

Vinyl

AMD

US

EAR99

366

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

Green/Red on White

通用型

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

不发光

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

Gloss

-

Repositionable Acrylic

XC7Z014S-1CLG400I
XC7Z014S-1CLG400I
AMD 数据表

2139 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA, CSPBGA

400-CSPBGA (17x17)

活跃

Industrial grade

AMD

65000

WCBGA

1.0000 V

125

表面贴装

125

Tray

XC7Z014

-40 to 100 °C

Zynq®-7000

400

667MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

1

Artix™-7 FPGA, 65K Logic Cells

81200

-

XC7Z010-2CLG400I
XC7Z010-2CLG400I
AMD 数据表

150 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA, CSPBGA

400-CSPBGA (17x17)

AMD

活跃

130

Tray

XC7Z010

-40°C ~ 100°C (TJ)

Zynq®-7000

766MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 28K Logic Cells

-

XCVM1302-2LLEVFVC1596
XCVM1302-2LLEVFVC1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

AMD

532

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCZU4CG-L1SFVC784I
XCZU4CG-L1SFVC784I
AMD 数据表

24 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

活跃

252

Tray

XCZU4

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XC7Z020-2CLG484CES
XC7Z020-2CLG484CES
AMD 数据表

535 In Stock

-

最小起订量: 1

最小包装量: 1

484-LFBGA, CSPBGA

484-CSPBGA (19x19)

AMD

Obsolete

130

Tray

XC7Z020

0°C ~ 85°C (TJ)

Zynq®-7000

766MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 85K Logic Cells

-

XCVC1802-2MLEVSVA2197
XCVC1802-2MLEVSVA2197
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

770

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XCZU17EG-1FFVD1760I
XCZU17EG-1FFVD1760I
AMD 数据表

582 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

活跃

308

Tray

XCZU17

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

XCZU6CG-1FFVB1156I
XCZU6CG-1FFVB1156I
AMD 数据表

527 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

0.8500 V

0.808 V

0.892 V

328

Bulk

XCZU6

活跃

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

XCZU19EG-2FFVB1517E
XCZU19EG-2FFVB1517E
AMD 数据表

660 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

644

活跃

XCZU19

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

XCZU43DR-L2FFVE1156I
XCZU43DR-L2FFVE1156I
AMD 数据表

865 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

366

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU48DR-1FSVG1517E
XCZU48DR-1FSVG1517E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

RISC

1.8/2.5/3.3 V

6

有

表面贴装

561

Tray

活跃

0 to 100 °C

Zynq® UltraScale+™ RFSoC

1517

110, 230 V

CAN/Serial I2C/SPI/U

500MHz, 1.2GHz

256 KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

64 Bit

Extended

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

ARM Cortex-A53/ARM Cortex-R5

XCZU11EG-L1FFVB1517I
XCZU11EG-L1FFVB1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Knowles Syfer

XCZU11

Tape & Reel (TR)

活跃

488

-40°C ~ 100°C (TJ)

*

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

XC7Z007S-1CLG400C
XC7Z007S-1CLG400C
AMD 数据表

164 In Stock

-

最小起订量: 1

最小包装量: 1

Free Hanging (In-Line)

400-LFBGA, CSPBGA

-

Thermoplastic

400-CSPBGA (17x17)

Thermoplastic

Thermoplastic

Conxall/Switchcraft

Gold

100

XC7Z007

600VAC/DC

Bulk

Plastic

活跃

Copper Alloy

-40°C ~ 85°C

Multi-Con-X®, Insta-Click™

焊杯

Plug, Male Pins

4

Black

-

卡口锁

因线规而异

Keyed

Unshielded

IP67 - Dust Tight, Waterproof

-

-

667MHz

256KB

-

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

0.280 ~ 0.290 (7.11mm ~ 7.37mm)

MCU, FPGA

Artix™-7 FPGA, 23K Logic Cells

-

Backshell, UV Resistant

-

UL94 HB

XCZU15EG-2FFVB1156I
XCZU15EG-2FFVB1156I
AMD 数据表

857 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

1156-FCBGA (35x35)

SiTime

活跃

Tape & Reel (TR)

328

XCZU15

-40°C ~ 85°C

SiT8208

0.197 L x 0.126 W (5.00mm x 3.20mm)

XO (Standard)

2.5V

66.666 MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

33mA

31mA

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

0.031 (0.80mm)

-

XCZU19EG-L2FFVC1760E
XCZU19EG-L2FFVC1760E
AMD 数据表

518 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

PEI-Genesis

XCZU19

Bulk

活跃

512

0°C ~ 100°C (TJ)

*

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

XCZU49DR-L1FSVF1760I
XCZU49DR-L1FSVF1760I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

活跃

Tray

622

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU5EV-3FBVB900E
XCZU5EV-3FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

活跃

204

Tray

XCZU5

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XC7Z030-1FF676I
XC7Z030-1FF676I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

AMD

Tray

XC7Z030

活跃

-40°C ~ 100°C (TJ)

Zynq®-7000

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 125K Logic Cells

-

XCZU46DR-2FFVH1760I
XCZU46DR-2FFVH1760I
AMD 数据表

979 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

574

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XC7Z012S-2CLG485I
XC7Z012S-2CLG485I
AMD 数据表

2930 In Stock

-

最小起订量: 1

最小包装量: 1

1206 (3216 Metric)

1206

Stackpole Electronics Inc

XC7Z012

活跃

Bulk

150

-55°C ~ 155°C

RMEF

0.120 L x 0.063 W (3.05mm x 1.60mm)

±1%

2

±100ppm/°C

22.1 Ohms

厚膜

0.25W, 1/4W

-

766MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Artix™-7 FPGA, 55K Logic Cells

-

Automotive AEC-Q200

0.028 (0.70mm)

AEC-Q200

XCZU7CG-1FFVC1156I
XCZU7CG-1FFVC1156I
AMD 数据表

627 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

PEI-Genesis

XCZU7

Bulk

活跃

360

-40°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-