品牌是'AMD' (1092)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

安装类型

包装/外壳

越来越多的功能

触点形状

外壳材料

供应商器件包装

插入材料

厂商

操作温度

系列

尺寸/尺寸

容差

零件状态

终止次数

温度系数

连接器类型

类型

电阻

定位的数量

组成

功率(瓦特)

紧固类型

触点类型

方向

屏蔽/屏蔽

入口保护

额定电流

外壳完成

引脚数量

外壳尺寸-插入

接头数量

房屋颜色

输出类型

工作电源电压

失败率

注意

界面

速度

内存大小

外壳尺寸,MIL

核心处理器

周边设备

连接方式

建筑学

数据总线宽度

大小

包括

最高频率

筛选水平

速度等级

转换自(适配器端)

转换(适配器端)

主要属性

闪光大小

断开类型

连接类型

特征

输入电压(交流电)

温度

电源类型

设备核心

知识产权评级

直径

座位高度(最大)

材料可燃性等级

评级结果

XAZU2EG-1SFVA625I
XAZU2EG-1SFVA625I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

31004

Greenlee

128

Tray

XAZU2

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 1.2GHz

1.2MB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

XAZU3EG-1SFVA625I
XAZU3EG-1SFVA625I
AMD 数据表

577 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

0.892 V

128

Tray

XAZU3

活跃

AMD

E57LBL30A2SP

10 mm

Cutler Hammer, Div of Eaton Co

0.8500 V

0.808 V

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EG

Shielded

625

NC

500MHz, 1.2GHz

1.8MB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

1

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

3 Pin Micro Pigtail

AC

30 mm

XCZU11EG-3FFVB1517E
XCZU11EG-3FFVB1517E
AMD 数据表

723 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

TCHI-24

CE, cURus

ILME

488

Tray

XCZU11

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

Non-Metallic

None (Housing Only)

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

104mm x 27mm

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

-40-90 °C

XCZU4EV-1SFVC784I
XCZU4EV-1SFVC784I
AMD 数据表

990 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

Tray

XCZU4

活跃

AMD

31008805000

Pfannenberg

0.892 V

0.808 V

0.8500 V

252

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EV

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XCZU17EG-2FFVE1924I
XCZU17EG-2FFVE1924I
AMD 数据表

626 In Stock

-

最小起订量: 1

最小包装量: 1

1924-BBGA, FCBGA

1924-FCBGA (45x45)

Tray

XCZU17

活跃

AMD

313902

PILZ

0.85 V

0.808 V

0.892 V

668

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EG

1924

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

XCZU5CG-2FBVB900E
XCZU5CG-2FBVB900E
AMD 数据表

656 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

活跃

AMD

PDG53K0800E2NM

CE, CSA, UL

Cutler Hammer, Div of Eaton Corp

Panel

204

Tray

XCZU5

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

800 A

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XCVE1752-1LLIVSVA1596
XCVE1752-1LLIVSVA1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

AMD

500

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1M Logic Cells

-

XCZU2CG-2SFVA625E
XCZU2CG-2SFVA625E
AMD 数据表

61 In Stock

-

最小起订量: 1

最小包装量: 1

Panel Mount, Bulkhead

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

180

Tray

XCZU2

活跃

0°C ~ 100°C (TJ)

USBF电视

活跃

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

USB - A, Receptacle

USB - A, Receptacle

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

XCZU4CG-1SFVC784E
XCZU4CG-1SFVC784E
AMD 数据表

826 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

XCZU4

活跃

252

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XCZU5EG-2SFVC784E
XCZU5EG-2SFVC784E
AMD 数据表

574 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

XCZU5

活跃

252

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XCZU17EG-3FFVB1517E
XCZU17EG-3FFVB1517E
AMD 数据表

575 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

XCZU17

活跃

644

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

XCZU4EG-L2SFVC784E
XCZU4EG-L2SFVC784E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

XCZU4

活跃

252

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XCVM1802-2LSEVSVD1760
XCVM1802-2LSEVSVD1760
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

ACH550-BCR-032A-6+B058

ABB

Panel, Wall

726

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

60 Hz

Versal™ Prime FPGA, 1.9M Logic Cells

-

断路器

575 VAC

IP58

XCZU47DR-1FFVE1156E
XCZU47DR-1FFVE1156E
AMD 数据表

617 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

366

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU43DR-2FFVG1517I
XCZU43DR-2FFVG1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

表面贴装

561

Tray

活跃

Industrial grade

AMD

RISC

1.8/2.5/3.3 V

FCBGA

6

有

-40 to 100 °C

Zynq® UltraScale+™ RFSoC

1517

3.3 V

CAN/Serial I2C/SPI/U

533MHz, 1.333GHz

256 KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

64 Bit

Industrial

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

ARM Cortex-A53/ARM Cortex-R5

XCZU47DR-2FFVE1156E
XCZU47DR-2FFVE1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

366

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU46DR-1FFVH1760E
XCZU46DR-1FFVH1760E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

PEI-Genesis

Bulk

活跃

574

0°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU43DR-L1FFVG1517I
XCZU43DR-L1FFVG1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

561

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU43DR-2FFVE1156I
XCZU43DR-2FFVE1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

表面贴装

366

Tray

活跃

Industrial grade

AMD

RISC

1.8/2.5/3.3 V

6

CAN/Serial I2C/SPI/UART/USB

有

-40 to 100 °C

Zynq® UltraScale+™ RFSoC

1156

0.85 V

CAN/Serial I2C/SPI/U

533MHz, 1.333GHz

256 KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

64 Bit

Industrial

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

ARM Cortex-A53/ARM Cortex-R5

XCZU48DR-2FFVG1517E
XCZU48DR-2FFVG1517E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

KYOCERA AVX

Tape & Reel (TR)

活跃

561

0°C ~ 100°C (TJ)

*

CAN/Serial I2C/SPI/U

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU48DR-2FSVE1156E
XCZU48DR-2FSVE1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1210 (3225 Metric)

1210

KOA Speer Electronics, Inc.

活跃

366

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

RN73H2E

-55°C ~ 155°C

RN73H

0.126 L x 0.098 W (3.20mm x 2.50mm)

±1%

2

±50ppm/°C

191 kOhms

Metal Film

0.25W, 1/4W

-

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

Automotive AEC-Q200, Moisture Resistant

0.028 (0.70mm)

AEC-Q200

XCZU47DR-L1FSVG1517I
XCZU47DR-L1FSVG1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

ITT Cannon, LLC

活跃

561

Bulk

KPT06

-40°C ~ 100°C (TJ)

KPT

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCVC1502-2MLIVSVA1596
XCVC1502-2MLIVSVA1596
AMD 数据表

831 In Stock

-

最小起订量: 1

最小包装量: 1

面板安装

1596-BFBGA, FCBGA

Flange

Circular

Composite

-

Amphenol Aerospace Operations

22D (97), 8 Twinax (2)

活跃

478

Bulk

CTVPS00RF

-65°C ~ 200°C

MIL-DTL-38999 Series III, Tri-Start™ TV

插座外壳

用于公引脚

99 (97 + 2 Twinax)

Threaded

Crimp

D

Shielded

抗环境干扰

化学镍

25-7

Silver

不包括触点

600MHz, 1.4GHz

256KB

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

-

Versal™ AI Core FPGA, 800k Logic Cells

-

-

-

XCVM1402-2MLINSVF1369
XCVM1402-2MLINSVF1369
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1369-BFBGA

1369-BGA (35x35)

AMD

424

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCVE1752-2LSEVSVA2197
XCVE1752-2LSEVSVA2197
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

608

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1M Logic Cells

-