品牌是'AMD' (1092)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 供应商器件包装 | 厂商 | 操作温度 | 系列 | 零件状态 | 组成 | 屏蔽/屏蔽 | 额定电流 | 引脚数量 | 接头数量 | 输出类型 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 大小 | 筛选水平 | 速度等级 | 主要属性 | 闪光大小 | 连接类型 | 温度 | 电源类型 | 直径 | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | XCZU7EV-L2FFVF1517E | AMD | 数据表 | 829 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 0.892 V | 464 | Tray | XCZU7 | 活跃 | 0.8500 V | 0.808 V | 0 to 110 °C | Zynq® UltraScale+™ MPSoC EV | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2L | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||
![]() | XCZU5EG-L1FBVB900I | AMD | 数据表 | 740 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 0.892 V | 204 | Tray | XCZU5 | 活跃 | 0.8500 V | 0.808 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||
![]() | XCZU7EV-3FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU7 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||
![]() | XCZU7CG-1FFVC1156E | AMD | 数据表 | 880 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 0.892 V | 360 | Tray | XCZU7 | 活跃 | 0.8500 V | 0.808 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||
![]() | XCZU7EG-3FFVF1517E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | XCZU7 | 活跃 | 0.873 V | 0.927 V | 464 | Tray | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||
![]() | XCZU7EG-2FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 0.892 V | 204 | Tray | XCZU7 | 活跃 | 0.8500 V | 0.808 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||
![]() | XCZU4EG-2FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 192,150 | 0.8500 V | 0.808 V | 0.892 V | 204 | Tray | XCZU4 | 活跃 | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 扩展工业 | 2 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | ||||||||||||||||||||||
![]() | XCZU5EV-1FBVB900I | AMD | 数据表 | 877 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 0.892 V | 204 | Tray | XCZU5 | 活跃 | 0.8500 V | 0.808 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||
![]() | XCZU17EG-2FFVE1924E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1924-BBGA, FCBGA | 1924-FCBGA (45x45) | AMD | 0.8500 V | 668 | Tray | XCZU17 | 活跃 | ACH580-BCR-088A-2+B058+F267+K452 | ABB | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 1924 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | |||||||||||||||||||||||
![]() | XCZU2EG-L1SBVA484I | AMD | 数据表 | 2708 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | XCZU2 | 活跃 | ACH580-BCR-088A-2+B058+J429+K454 | ABB | 82 | Tray | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||
![]() | XCZU7CG-2FFVC1156I | AMD | 数据表 | 906 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | PDG52P1200D3WN | CE, CSA, UL | Cutler Hammer, Div of Eaton Corp | Panel | 360 | Tray | XCZU7 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 1,200 A | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||
![]() | XCZU3CG-L1SBVA484I | AMD | 数据表 | 928 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | 82 | Tray | XCZU3 | 活跃 | Miscellaneous | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||
![]() | XCZU2CG-L1SFVC784I | AMD | 数据表 | 2092 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 0.8500 V | 252 | Tray | XCZU2 | 活跃 | DH227NRKV | Cutler Hammer, Div of Eaton Corp | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||
![]() | XCZU3CG-2SBVA484I | AMD | 数据表 | 875 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | 0.892 V | 82 | AMD | Tray | XCZU3 | 活跃 | Industrial grade | 154,350 | FCBGA | 0.8500 V | 0.808 V | 82 | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 484 | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2 | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||
![]() | XCZU11EG-2FFVF1517E | AMD | 数据表 | 876 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 464 | Tray | XCZU11 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||
![]() | XCZU11EG-1FFVF1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 0.8500 V | 464 | Tray | XCZU11 | 活跃 | 139394 | Schneider | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | Inverted Flare | |||||||||||||||||||||||
![]() | XAZU2EG-1SFVA625I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | XAZU2 | 活跃 | 31004 | Greenlee | 128 | Tray | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 1.2GHz | 1.2MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||
![]() | XAZU3EG-1SFVA625I | AMD | 数据表 | 546 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | 128 | AMD | Tray | XAZU3 | 活跃 | E57LBL30A2SP | 10 mm | Cutler Hammer, Div of Eaton Co | 0.8500 V | 0.808 V | 0.892 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | Shielded | 625 | NC | 500MHz, 1.2GHz | 1.8MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | 3 Pin Micro Pigtail | AC | 30 mm | |||||||||||||||
![]() | XCZU11EG-3FFVB1517E | AMD | 数据表 | 533 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | ILME | 488 | Tray | XCZU11 | 活跃 | TCHI-24 | CE, cURus | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | Non-Metallic | None (Housing Only) | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 104mm x 27mm | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | -40-90 °C | |||||||||||||||||||||
![]() | XCZU4EV-1SFVC784I | AMD | 数据表 | 816 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | XCZU4 | 活跃 | 31008805000 | Pfannenberg | 0.892 V | 0.808 V | 0.8500 V | 252 | Tray | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | ||||||||||||||||||||||
![]() | XCZU17EG-2FFVE1924I | AMD | 数据表 | 657 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1924-BBGA, FCBGA | 1924-FCBGA (45x45) | AMD | XCZU17 | 活跃 | 313902 | PILZ | 0.85 V | 0.808 V | 0.892 V | 668 | Tray | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 1924 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | |||||||||||||||||||||
![]() | XCZU5CG-2FBVB900E | AMD | 数据表 | 661 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | PDG53K0800E2NM | CE, CSA, UL | Cutler Hammer, Div of Eaton Corp | Panel | 204 | Tray | XCZU5 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 800 A | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||
![]() | XCZU5EG-2SFVC784E | AMD | 数据表 | 720 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | XCZU5 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||
![]() | XCZU17EG-3FFVB1517E | AMD | 数据表 | 867 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 644 | Tray | XCZU17 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||
![]() | XCZU49DR-1FFVF1760E | AMD | 数据表 | 901 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | Tray | 活跃 | 622 | 0°C ~ 100°C (TJ) | * | 活跃 | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - |
XCZU7EV-L2FFVF1517E
AMD
分类:Embedded - System On Chip (SoC)
34,574.756326
XCZU5EG-L1FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
20,448.975959
XCZU7EV-3FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
XCZU7CG-1FFVC1156E
AMD
分类:Embedded - System On Chip (SoC)
18,374.079438
XCZU7EG-3FFVF1517E
AMD
分类:Embedded - System On Chip (SoC)
XCZU7EG-2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
XCZU4EG-2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
XCZU5EV-1FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
19,772.911023
XCZU17EG-2FFVE1924E
AMD
分类:Embedded - System On Chip (SoC)
XCZU2EG-L1SBVA484I
AMD
分类:Embedded - System On Chip (SoC)
3,268.799713
XCZU7CG-2FFVC1156I
AMD
分类:Embedded - System On Chip (SoC)
32,843.045947
XCZU3CG-L1SBVA484I
AMD
分类:Embedded - System On Chip (SoC)
3,979.271707
XCZU2CG-L1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
2,477.107721
XCZU3CG-2SBVA484I
AMD
分类:Embedded - System On Chip (SoC)
5,125.695964
XCZU11EG-2FFVF1517E
AMD
分类:Embedded - System On Chip (SoC)
45,271.006990
XCZU11EG-1FFVF1517I
AMD
分类:Embedded - System On Chip (SoC)
XAZU2EG-1SFVA625I
AMD
分类:Embedded - System On Chip (SoC)
XAZU3EG-1SFVA625I
AMD
分类:Embedded - System On Chip (SoC)
4,459.100890
XCZU11EG-3FFVB1517E
AMD
分类:Embedded - System On Chip (SoC)
55,969.447188
XCZU4EV-1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
11,186.066795
XCZU17EG-2FFVE1924I
AMD
分类:Embedded - System On Chip (SoC)
59,478.386328
XCZU5CG-2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
18,618.768366
XCZU5EG-2SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
15,093.563949
XCZU17EG-3FFVB1517E
AMD
分类:Embedded - System On Chip (SoC)
60,487.927731
XCZU49DR-1FFVF1760E
AMD
分类:Embedded - System On Chip (SoC)
146,769.443121
