品牌是'AMD' (1092)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 越来越多的功能 | 触点形状 | 外壳材料 | 供应商器件包装 | 插入材料 | 厂商 | 操作温度 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 终止次数 | 温度系数 | 连接器类型 | 类型 | 电阻 | 定位的数量 | 组成 | 功率(瓦特) | 紧固类型 | 触点类型 | 方向 | 屏蔽/屏蔽 | 入口保护 | 额定电流 | 外壳完成 | 引脚数量 | 外壳尺寸-插入 | 接头数量 | 房屋颜色 | 输出类型 | 工作电源电压 | 失败率 | 注意 | 界面 | 速度 | 内存大小 | 外壳尺寸,MIL | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 数据总线宽度 | 大小 | 包括 | 最高频率 | 筛选水平 | 速度等级 | 转换自(适配器端) | 转换(适配器端) | 主要属性 | 闪光大小 | 断开类型 | 连接类型 | 特征 | 输入电压(交流电) | 温度 | 电源类型 | 设备核心 | 知识产权评级 | 直径 | 座位高度(最大) | 材料可燃性等级 | 评级结果 | ||||||||||||||||||||
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![]() | XAZU2EG-1SFVA625I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | 31004 | Greenlee | 128 | Tray | XAZU2 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 1.2GHz | 1.2MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XAZU3EG-1SFVA625I | AMD | 数据表 | 577 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | 0.892 V | 128 | Tray | XAZU3 | 活跃 | AMD | E57LBL30A2SP | 10 mm | Cutler Hammer, Div of Eaton Co | 0.8500 V | 0.808 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | Shielded | 625 | NC | 500MHz, 1.2GHz | 1.8MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | 3 Pin Micro Pigtail | AC | 30 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU11EG-3FFVB1517E | AMD | 数据表 | 723 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | TCHI-24 | CE, cURus | ILME | 488 | Tray | XCZU11 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | Non-Metallic | None (Housing Only) | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 104mm x 27mm | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | -40-90 °C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EV-1SFVC784I | AMD | 数据表 | 990 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | Tray | XCZU4 | 活跃 | AMD | 31008805000 | Pfannenberg | 0.892 V | 0.808 V | 0.8500 V | 252 | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU17EG-2FFVE1924I | AMD | 数据表 | 626 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1924-BBGA, FCBGA | 1924-FCBGA (45x45) | Tray | XCZU17 | 活跃 | AMD | 313902 | PILZ | 0.85 V | 0.808 V | 0.892 V | 668 | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 1924 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5CG-2FBVB900E | AMD | 数据表 | 656 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 活跃 | AMD | PDG53K0800E2NM | CE, CSA, UL | Cutler Hammer, Div of Eaton Corp | Panel | 204 | Tray | XCZU5 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 800 A | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE1752-1LLIVSVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 500 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2CG-2SFVA625E | AMD | 数据表 | 61 In Stock | - | 最小起订量: 1 最小包装量: 1 | Panel Mount, Bulkhead | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | 180 | Tray | XCZU2 | 活跃 | 0°C ~ 100°C (TJ) | USBF电视 | 活跃 | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | USB - A, Receptacle | USB - A, Receptacle | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4CG-1SFVC784E | AMD | 数据表 | 826 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | XCZU4 | 活跃 | 252 | Tray | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EG-2SFVC784E | AMD | 数据表 | 574 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | XCZU5 | 活跃 | 252 | Tray | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU17EG-3FFVB1517E | AMD | 数据表 | 575 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | XCZU17 | 活跃 | 644 | Tray | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EG-L2SFVC784E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | XCZU4 | 活跃 | 252 | Tray | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-2LSEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | ACH550-BCR-032A-6+B058 | ABB | Panel, Wall | 726 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 60 Hz | Versal™ Prime FPGA, 1.9M Logic Cells | - | 断路器 | 575 VAC | IP58 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU47DR-1FFVE1156E | AMD | 数据表 | 617 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU43DR-2FFVG1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 表面贴装 | 561 | Tray | 活跃 | Industrial grade | AMD | RISC | 1.8/2.5/3.3 V | FCBGA | 6 | 有 | -40 to 100 °C | Zynq® UltraScale+™ RFSoC | 1517 | 3.3 V | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 64 Bit | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ARM Cortex-A53/ARM Cortex-R5 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU47DR-2FFVE1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU46DR-1FFVH1760E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | PEI-Genesis | Bulk | 活跃 | 574 | 0°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU43DR-L1FFVG1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 561 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU43DR-2FFVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | 表面贴装 | 366 | Tray | 活跃 | Industrial grade | AMD | RISC | 1.8/2.5/3.3 V | 6 | CAN/Serial I2C/SPI/UART/USB | 有 | -40 to 100 °C | Zynq® UltraScale+™ RFSoC | 1156 | 0.85 V | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 64 Bit | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ARM Cortex-A53/ARM Cortex-R5 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-2FFVG1517E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | KYOCERA AVX | Tape & Reel (TR) | 活跃 | 561 | 0°C ~ 100°C (TJ) | * | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-2FSVE1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1210 (3225 Metric) | 1210 | KOA Speer Electronics, Inc. | 活跃 | 366 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | RN73H2E | -55°C ~ 155°C | RN73H | 0.126 L x 0.098 W (3.20mm x 2.50mm) | ±1% | 2 | ±50ppm/°C | 191 kOhms | Metal Film | 0.25W, 1/4W | - | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Automotive AEC-Q200, Moisture Resistant | 0.028 (0.70mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU47DR-L1FSVG1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | ITT Cannon, LLC | 活跃 | 561 | Bulk | KPT06 | -40°C ~ 100°C (TJ) | KPT | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1502-2MLIVSVA1596 | AMD | 数据表 | 831 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 面板安装 | 1596-BFBGA, FCBGA | Flange | Circular | Composite | - | Amphenol Aerospace Operations | 22D (97), 8 Twinax (2) | 活跃 | 478 | Bulk | CTVPS00RF | -65°C ~ 200°C | MIL-DTL-38999 Series III, Tri-Start™ TV | 插座外壳 | 用于公引脚 | 99 (97 + 2 Twinax) | Threaded | Crimp | D | Shielded | 抗环境干扰 | 化学镍 | 25-7 | Silver | 不包括触点 | 600MHz, 1.4GHz | 256KB | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | Versal™ AI Core FPGA, 800k Logic Cells | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-2MLINSVF1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 424 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE1752-2LSEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 608 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - |
XAZU2EG-1SFVA625I
AMD
分类:Embedded - System On Chip (SoC)
XAZU3EG-1SFVA625I
AMD
分类:Embedded - System On Chip (SoC)
4,947.266563
XCZU11EG-3FFVB1517E
AMD
分类:Embedded - System On Chip (SoC)
55,012.379831
XCZU4EV-1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
12,405.408858
XCZU17EG-2FFVE1924I
AMD
分类:Embedded - System On Chip (SoC)
66,314.525381
XCZU5CG-2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
20,682.120941
XCVE1752-1LLIVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
XCZU2CG-2SFVA625E
AMD
分类:Embedded - System On Chip (SoC)
XCZU4CG-1SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
6,961.386764
XCZU5EG-2SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
14,876.492133
XCZU17EG-3FFVB1517E
AMD
分类:Embedded - System On Chip (SoC)
66,956.301574
XCZU4EG-L2SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
XCVM1802-2LSEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
XCZU47DR-1FFVE1156E
AMD
分类:Embedded - System On Chip (SoC)
112,875.573337
XCZU43DR-2FFVG1517I
AMD
分类:Embedded - System On Chip (SoC)
XCZU47DR-2FFVE1156E
AMD
分类:Embedded - System On Chip (SoC)
XCZU46DR-1FFVH1760E
AMD
分类:Embedded - System On Chip (SoC)
XCZU43DR-L1FFVG1517I
AMD
分类:Embedded - System On Chip (SoC)
XCZU43DR-2FFVE1156I
AMD
分类:Embedded - System On Chip (SoC)
XCZU48DR-2FFVG1517E
AMD
分类:Embedded - System On Chip (SoC)
XCZU48DR-2FSVE1156E
AMD
分类:Embedded - System On Chip (SoC)
XCZU47DR-L1FSVG1517I
AMD
分类:Embedded - System On Chip (SoC)
XCVC1502-2MLIVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
177,561.264343
XCVM1402-2MLINSVF1369
AMD
分类:Embedded - System On Chip (SoC)
XCVE1752-2LSEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
