品牌是'AMD' (1092)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

安装类型

包装/外壳

供应商器件包装

厂商

Voltage Rating AC

操作温度

包装

系列

尺寸/尺寸

容差

零件状态

终止次数

温度系数

类型

电阻

定位的数量

组成

功率(瓦特)

电压 - 供电

额定电流

频率

频率稳定性

输出量

引脚数量

触点表面处理

终端样式

功能

基本谐振器

最大电流源

审批机构

执行器类型

工作电源电压

失败率

面板开孔尺寸

电流 - 电源(禁用)(最大值)

界面

速度

内存大小

核心处理器

周边设备

连接方式

家人

甲板数量

建筑学

数据总线宽度

操作力

过滤器类型

触点定时

最高频率

筛选水平

索引停止

每层电路

行数

直流电阻(DCR)(最大)

面板后深度

速度等级

最大额定电流

每个甲板的杆数

投掷角度

转换自(适配器端)

转换(适配器端)

绝对牵引范围 (APR)

主要属性

寄存器数量

闪光大小

断开类型

特征

输入电压(交流电)

设备核心

知识产权评级

座位高度(最大)

执行器长度

高度(最大)

评级结果

XCZU43DR-1FSVG1517I
XCZU43DR-1FSVG1517I
AMD 数据表

746 In Stock

-

最小起订量: 1

最小包装量: 1

面板安装

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

561

Tray

活跃

28V

115V

银合金

-40°C ~ 100°C (TJ)

44

活跃

2

5A (AC), 1A (DC)

--

焊片

Flatted (6.35mm Dia)

--

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1

MCU, FPGA

5.761 ~ 83gfm

Non-Shorting (BBM)

固定式

单刀双掷

26.04mm

1

45°

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

轴和面板密封

11.10mm

XCZU4CG-1SFVC784E
XCZU4CG-1SFVC784E
AMD 数据表

766 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

XCZU4

活跃

252

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XCZU2CG-2SFVA625E
XCZU2CG-2SFVA625E
AMD 数据表

584 In Stock

-

最小起订量: 1

最小包装量: 1

Panel Mount, Bulkhead

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

XCZU2

活跃

180

Tray

0°C ~ 100°C (TJ)

USBF电视

活跃

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

USB - A, Receptacle

USB - A, Receptacle

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

XCZU9CG-L1FFVC900I
XCZU9CG-L1FFVC900I
AMD 数据表

577 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

XCZU9

活跃

204

Bulk

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCZU48DR-2FSVE1156E
XCZU48DR-2FSVE1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1210 (3225 Metric)

1210

KOA Speer Electronics, Inc.

活跃

366

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

RN73H2E

-55°C ~ 155°C

RN73H

0.126 L x 0.098 W (3.20mm x 2.50mm)

±1%

2

±50ppm/°C

191 kOhms

Metal Film

0.25W, 1/4W

-

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

Automotive AEC-Q200, Moisture Resistant

0.028 (0.70mm)

AEC-Q200

XCZU47DR-L1FSVG1517I
XCZU47DR-L1FSVG1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

ITT Cannon, LLC

活跃

561

Bulk

KPT06

-40°C ~ 100°C (TJ)

KPT

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XC7Z030-1FBG676I
XC7Z030-1FBG676I
AMD 数据表

2312 In Stock

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

AMD

XC7Z030

活跃

130

Tray

-40°C ~ 100°C (TJ)

Zynq®-7000

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 125K Logic Cells

-

XCZU46DR-1FFVH1760E
XCZU46DR-1FFVH1760E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

PEI-Genesis

574

Bulk

活跃

0°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU43DR-L1FFVG1517I
XCZU43DR-L1FFVG1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

活跃

561

Tray

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU43DR-2FFVE1156I
XCZU43DR-2FFVE1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

RISC

1.8/2.5/3.3 V

6

CAN/Serial I2C/SPI/UART/USB

表面贴装

366

Tray

活跃

Industrial grade

-40 to 100 °C

Zynq® UltraScale+™ RFSoC

1156

0.85 V

CAN/Serial I2C/SPI/U

533MHz, 1.333GHz

256 KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

64 Bit

Industrial

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

ARM Cortex-A53/ARM Cortex-R5

XC7Z020-2CLG400E
XC7Z020-2CLG400E
AMD 数据表

2966 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA, CSPBGA

400-CSPBGA (17x17)

AMD

XC7Z020

活跃

130

Tray

0°C ~ 100°C (TJ)

Zynq®-7000

766MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 85K Logic Cells

-

XCVM1802-2LSEVSVD1760
XCVM1802-2LSEVSVD1760
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

ABB

Panel, Wall

726

Tray

活跃

ACH550-BCR-032A-6+B058

0°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

60 Hz

Versal™ Prime FPGA, 1.9M Logic Cells

-

断路器

575 VAC

IP58

XCZU48DR-L2FFVG1517I
XCZU48DR-L2FFVG1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

通孔

Vertical, No Base, 2 PC Pin

1517-FCBGA (40x40)

SCHURTER Inc.

活跃

600V

561

Tape & Reel (TR)

-

DSO1

-40°C ~ 125°C

DSO

1.024 Dia (26.00mm)

IEC, UL

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

电力线

2

140mOhm

2A

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

-

1.024 (26.00mm)

-

XCZU48DR-2FFVG1517E
XCZU48DR-2FFVG1517E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

KYOCERA AVX

561

Tape & Reel (TR)

活跃

0°C ~ 100°C (TJ)

*

CAN/Serial I2C/SPI/U

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU48DR-L1FFVG1517I
XCZU48DR-L1FFVG1517I
AMD 数据表

855 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

Tray

活跃

Non-Compliant

561

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU19EG-2FFVE1924I
XCZU19EG-2FFVE1924I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1924-BBGA, FCBGA

1924-FCBGA (45x45)

AMD

XCZU19

活跃

668

Tray

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

XCZU6CG-2FFVC900E
XCZU6CG-2FFVC900E
AMD 数据表

522 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

XCZU6

活跃

204

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

XC7Z100-1FFG1156I
XC7Z100-1FFG1156I
AMD 数据表

561 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

RISC

1.5, 2, 2.5 V

FBGA

2

CAN/I2C/SPI/UART

表面贴装

250

Tray

XC7Z100

活跃

-40 to 100 °C

Zynq®-7000

1156

1, 1.8 V

CAN/I2C/SPI/UART

667MHz

256 KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

Kintex™-7 FPGA, 444K Logic Cells

-

XC7Z030-1FFG676C
XC7Z030-1FFG676C
AMD 数据表

2907 In Stock

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

AMD

130

Tray

XC7Z030

活跃

Thumb-2

1.2, 3.3 V

FCBGA

表面贴装

0 to 85 °C

Zynq®-7000

676

1 V

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

Kintex™-7 FPGA, 125K Logic Cells

-

XC7Z035-1FFG676C
XC7Z035-1FFG676C
AMD 数据表

826 In Stock

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

AMD

275,000

1.0000 V

0.95 V

130

1.05 V

130

Tray

XC7Z035

活跃

Commercial grade

0 to 85 °C

Zynq®-7000

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

XC7Z035

MCU, FPGA

Commercial

1

Kintex™-7 FPGA, 275K Logic Cells

343,800

-

XCZU19EG-L2FFVD1760E
XCZU19EG-L2FFVD1760E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

1760-FCBGA (42.5x42.5)

AMD

XCZU19

活跃

308

Tray

-40°C ~ 85°C

Tape & Reel (TR)

SiT8208

0.276 L x 0.197 W (7.00mm x 5.00mm)

活跃

XO (Standard)

2.8V

6MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

33mA

31mA

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

--

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

0.039 (1.00mm)

--

XAZU3EG-L1SFVA625I
XAZU3EG-L1SFVA625I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

625-FCBGA (21x21)

AMD

XAZU3

活跃

128

Tray

-40°C ~ 85°C

Tape & Reel (TR)

SiT8208

0.126 L x 0.098 W (3.20mm x 2.50mm)

活跃

XO (Standard)

1.8V

4MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

31mA

30mA

500MHz, 1.2GHz

1.8MB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

1L

--

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU4EV-2FBVB900E
XCZU4EV-2FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

900-FCBGA (31x31)

AMD

XCZU4

活跃

204

Tray

-40°C ~ 85°C

Tape & Reel (TR)

SiT8209

0.126 L x 0.098 W (3.20mm x 2.50mm)

活跃

XO (Standard)

1.8V

133.3333MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

33mA

30mA

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

--

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU19EG-3FFVD1760E
XCZU19EG-3FFVD1760E
AMD 数据表

784 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

1760-FCBGA (42.5x42.5)

AMD

XCZU19

活跃

308

Tray

-40°C ~ 85°C

Tape & Reel (TR)

SiT8209

0.126 L x 0.098 W (3.20mm x 2.50mm)

活跃

XO (Standard)

1.8V

125MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

33mA

30mA

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

--

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU7EG-L1FBVB900I
XCZU7EG-L1FBVB900I
AMD 数据表

517 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

900-FCBGA (31x31)

AMD

XCZU7

活跃

204

Tray

-40°C ~ 85°C

Tape & Reel (TR)

SiT8209

0.126 L x 0.098 W (3.20mm x 2.50mm)

活跃

XO (Standard)

1.8V

98.304MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

33mA

30mA

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

--

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

0.032 (0.80mm)

--