品牌是'AMD' (1092)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

底架

安装类型

包装/外壳

供应商器件包装

材料

厂商

Voltage-Input

操作温度

包装

系列

尺寸/尺寸

容差

零件状态

终端

类型

电阻

最高工作温度

最小工作温度

颜色

引脚数量

终端样式

输出电压

输出类型

工作电源电压

电路

界面

速度

内存大小

核心处理器

周边设备

连接方式

家人

建筑学

数据总线宽度

电压-负荷

筛选水平

速度等级

负载电流

主要属性

寄存器数量

闪光大小

特征

输入电压

轴承

知识产权评级

辐射硬化

XC7Z045-3FBG676E
XC7Z045-3FBG676E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

Plastic, ABS/PC Blend

AMD

--

DMB-4774

Thumb-2

1.2, 3.3 V

2

130

Tray

XC7Z045

活跃

0 to 100 °C

DMB

--

活跃

Cover, Lid

Clear

676

5.25, 4.75, 5 V

1GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

Kintex™-7 FPGA, 350K Logic Cells

-

--

XCZU9CG-1FFVC900I
XCZU9CG-1FFVC900I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

DIN Rail

Module

--

AMD

Tray

XCZU9

活跃

0.8500 V

0.808 V

0.892 V

204

18 ~ 36VAC

-40 to 100 °C

Bulk

DR

活跃

螺旋端子

AC

SPST-NO (1 Form A)

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

24V ~ 280V

1

3A

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCVM1402-1MSINSVF1369
XCVM1402-1MSINSVF1369
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

1369-BFBGA

1369-BGA (35x35)

AMD

Non-Compliant

424

Tray

活跃

-40°C ~ 100°C (TJ)

Tape & Reel

Versal™ Prime

20 %

1 kΩ

125 °C

-55 °C

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

无

XCVM1402-1MSIVSVD1760
XCVM1402-1MSIVSVD1760
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

726

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCZU1CG-1SBVA484E
XCZU1CG-1SBVA484E
AMD 数据表

2900 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

-

Tray

活跃

Non-Compliant

0°C ~ 100°C (TJ)

Zynq® UltraScale+™

CAN/Serial I2C/SPI/U

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

MPU, FPGA

-

-

XCZU1CG-1SFVA625I
XCZU1CG-1SFVA625I
AMD 数据表

2720 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

-

Tray

活跃

Non-Compliant

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

CAN/Serial I2C/SPI/U

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

MPU, FPGA

-

-

XCVM1802-1MSEVFVC1760
XCVM1802-1MSEVFVC1760
AMD 数据表

762 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

500

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVC1902-1MSIVSVD1760
XCVC1902-1MSIVSVD1760
AMD 数据表

961 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

692

Tray

活跃

-40°C ~ 100°C (TJ)

*

Obsolete

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCZU1CG-2SFVA625E
XCZU1CG-2SFVA625E
AMD 数据表

2873 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

-

Tray

活跃

0°C ~ 100°C (TJ)

*

活跃

CAN/Serial I2C/SPI/U

533MHz, 1.333GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

MPU, FPGA

-

-

XCVM1302-1MSEVFVC1596
XCVM1302-1MSEVFVC1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

AMD

532

Tray

活跃

0°C ~ 100°C (TJ)

*

活跃

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVC1502-1LSIVSVA2197
XCVC1502-1LSIVSVA2197
AMD 数据表

967 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

586

Tray

活跃

-40°C ~ 100°C (TJ)

*

活跃

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 80k Logic Cells

-

XCVM1402-1MLIVFVC1596
XCVM1402-1MLIVFVC1596
AMD 数据表

854 In Stock

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

AMD

748

Tray

活跃

-40°C ~ 100°C (TJ)

*

活跃

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCZU4CG-2SFVC784I
XCZU4CG-2SFVC784I
AMD 数据表

555 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

Miscellaneous

252

Tray

XCZU4

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XCZU49DR-2FFVF1760I
XCZU49DR-2FFVF1760I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

622

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU46DR-L2FFVH1760I
XCZU46DR-L2FFVH1760I
AMD 数据表

816 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

574

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU4EV-1FBVB900E
XCZU4EV-1FBVB900E
AMD 数据表

671 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

活跃

AMD

HS35R05009141

CE

Hollowshaft

Hollow

Dynapar

有

204

Tray

XCZU4

-40 to 85 Degrees C

Zynq® UltraScale+™ MPSoC EV

7 Pin Connector

5~26 VDC

Differential

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

5~26 VDC

有

IP67

XCZU9CG-2FFVC900E
XCZU9CG-2FFVC900E
AMD 数据表

555 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

0.892 V

204

Tray

XCZU9

活跃

0.8500 V

0.808 V

0 to 100 °C

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCZU9CG-2FFVB1156E
XCZU9CG-2FFVB1156E
AMD 数据表

973 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

0.892 V

328

Tray

XCZU9

活跃

0.8500 V

0.808 V

0 to 100 °C

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCZU3CG-1SFVA625I
XCZU3CG-1SFVA625I
AMD 数据表

2445 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

XCZU3

活跃

Industrial grade

AMD

154,350

FCBGA

0.8500 V

0.808 V

180

0.892 V

180

Bulk

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

625

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

1

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

141,120

-

XCZU9EG-3FFVC900E
XCZU9EG-3FFVC900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

599,550

FCBGA

1.0000 V

0.97 V

1.03 V

204

Tray

XCZU9

活跃

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

900

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

3

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

548,160

-

XCZU15EG-L2FFVB1156E
XCZU15EG-L2FFVB1156E
AMD 数据表

868 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

0.742, 0.892 V

328

Tray

XCZU15

活跃

0.72, 0.85 V

0.698, 0.808 V

0 to 110 °C

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2L

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

XCZU11EG-1FFVF1517E
XCZU11EG-1FFVF1517E
AMD 数据表

657 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

653,100

0.9500 V

0.922 V

464

0.979 V

464

Tray

XCZU11

活跃

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

XCZU11EG

MCU, FPGA

扩展工业

1

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

597,120

-

XCZU2EG-L2SFVC784E
XCZU2EG-L2SFVC784E
AMD 数据表

2004 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

XCZU7CG-2FBVB900E
XCZU7CG-2FBVB900E
AMD 数据表

867 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

0.892 V

204

Tray

XCZU7

活跃

0.8500 V

0.808 V

0 to 100 °C

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU9EG-1FFVB1156E
XCZU9EG-1FFVB1156E
AMD 数据表

591 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

599,550

0.9500 V

0.922 V

328

0.979 V

328

Tray

XCZU9

活跃

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

XCZU9EG

MCU, FPGA

扩展工业

1

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

548,160

-