品牌是'Cypress' (55)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | Gross weight | Transport packaging size/quantity | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 功能 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 通道数量 | 界面 | 电路数量 | 最大电源电压 | 最小电源电压 | 电源电流 | 电流源 | 数据率 | 座位高度-最大 | 通信IC类型 | 收发器数量 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | CYP15G0401TB-BGC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA Exposed Pad | 256 | 0°C~70°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | 30 | CY*15G04 | Driver | 3.3V | LVTTL | 4 | 770mA | 590mA | 电信电路 | 27mm | 27mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
![]() | CYV15G0403DXB-BGI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA Exposed Pad | 256 | -40°C~85°C | Tray | 2003 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | 收发器 | 不合格 | 3.3V | LVTTL | 4 | 1.32A | 900mA | 1500000 Mbps | 4 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
![]() | CYV15G0401DXB-BGC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA Exposed Pad | 256 | 0°C~70°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 5 (48 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | 收发器 | 不合格 | 3.3V | LVTTL | 4 | 1.06A | 870mA | 1500000 Mbps | 4 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
![]() | CYV15G0404RB-BGXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA Exposed Pad | 0°C~70°C | Tray | 2005 | HOTlink II™ | e1 | Obsolete | 5 (48 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1.27mm | not_compliant | 20 | CY*15G04 | S-PBGA-B256 | Deserializer | 不合格 | 3.465V | LVTTL | 4 | 1.27A | 900mA | 电信电路 | 27mm | 27mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||
![]() | CYP15G0402DXB-BGC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA Exposed Pad | 256 | 0°C~70°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 1 | 3.3V | 1.27mm | unknown | 30 | CY*15G04 | 256 | 不合格 | 3.3V | LVTTL | 4 | 1.06A | 830mA | 1.5 Gbps | 电信电路 | 4 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
![]() | BCM4330FKUBG | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 133 | 8.12 | Transferred | CYPRESS SEMICONDUCTOR CORP | WLBGA-133 | 85 °C | -30 °C | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 1.2 V | 45*38*20/500 | 8542.39.00.01 | BOTTOM | BALL | 1 | 0.4 mm | compliant | R-PBGA-B133 | OTHER | 0.55 mm | 电信电路 | 5.33 mm | 4.89 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | BCM20736A0KML2G | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | 有 | Transferred | CYPRESS SEMICONDUCTOR CORP | QFN-32 | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.2 V | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | compliant | S-XQCC-N32 | OTHER | 1 mm | 电信电路 | 5 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | CYW15G0401DXB-BGXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA Exposed Pad | 256 | 0°C~70°C | Tray | 2003 | HOTlink II™ | e1 | Obsolete | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1.27mm | not_compliant | 20 | CY*15G04 | 收发器 | 不合格 | 3.3V | LVTTL | 4 | 1.06A | 830mA | 1500000 Mbps | 电信电路 | 4 | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
![]() | CYP15G0401RB-BGI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA Exposed Pad | 256 | -40°C~85°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | Receiver | 不合格 | LVTTL | 4 | 740mA | 640mA | 电信电路 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
![]() | CYP15G0403DXB-BGI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA Exposed Pad | 256 | -40°C~85°C | Tray | 2003 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | 收发器 | 不合格 | 3.3V | LVTTL | 4 | 1.32A | 900mA | 1500000 Mbps | 4 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
![]() | CYW15G0401DXB-BGC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA Exposed Pad | 256 | 0°C~70°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | 收发器 | 不合格 | 3.3V | LVTTL | 4 | 1.06A | 830mA | 1500000 Mbps | 4 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
![]() | CYW15G0401DXB-BGI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA Exposed Pad | 256 | -40°C~85°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | 收发器 | 不合格 | 3.3V | LVTTL | 4 | 1.1A | 830mA | 1500000 Mbps | 4 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
CYW15G0201DXB-BBI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 196-LBGA | 196 | -40°C~85°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 196 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 240 | 3.3V | 1mm | 30 | CY*15G02 | 收发器 | 3.3V | LVTTL | 2 | 710mA | 570mA | 1500000 Mbps | 电信电路 | 2 | 1.5mm | 15mm | 15mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
![]() | CYV15G0402DXB-BGC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA Exposed Pad | 256 | 0°C~70°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 5 (48 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 1 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | 256 | 不合格 | 3.3V | LVTTL | 4 | 1.06A | 830mA | 1.5 Gbps | 电信电路 | 4 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
CYW15G0201DXB-BBC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 196-LBGA | 196 | 0°C~70°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 196 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 240 | 3.3V | 1mm | not_compliant | 30 | CY*15G02 | 收发器 | 不合格 | 3.3V | LVTTL | 2 | 700mA | 570mA | 1500000 Mbps | 电信电路 | 2 | 1.5mm | 15mm | 15mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
![]() | CYV15G0403DXB-BGC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA Exposed Pad | 256 | 0°C~70°C | Tray | 2003 | HOTlink II™ | e0 | Obsolete | 5 (48 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | 收发器 | 不合格 | 3.3V | LVTTL | 4 | 1.27A | 900mA | 1500000 Mbps | 4 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
![]() | CYW15G0101DXB-BBI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 100-LBGA | 100 | -40°C~85°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | CY*15G01 | 收发器 | 3.3V | 1 | LVTTL | 510mA | 390mA | 1 | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
![]() | CYW15G0403DXB-BGC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA Exposed Pad | Tray | 2012 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 70°C | 0°C | 3.135V~3.465V | BOTTOM | BALL | 225 | 1 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | 256 | S-PBGA-B256 | 不合格 | 3.3V | COMMERCIAL | 4 | 1.27A | 1500000 Mbps | 电信电路 | 4 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
CYV15G0201DXB-BBXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 196-LBGA | 196 | 0°C~70°C | Tray | 2003 | HOTlink II™ | e1 | Obsolete | 5 (48 Hours) | 196 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1mm | unknown | 20 | CY*15G02 | 收发器 | 不合格 | 3.3V | LVTTL | 2 | 700mA | 570mA | 1500000 Mbps | 2 | 1.5mm | 15mm | 15mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||
![]() | CYP15G0401TB-BGI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA Exposed Pad | -40°C~85°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | S-PBGA-B256 | Driver | 不合格 | LVTTL | 4 | 820mA | 590mA | 电信电路 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
![]() | CYP15G0401TB-BGXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA Exposed Pad | 256 | 0°C~70°C | Tray | 2005 | HOTlink II™ | e1 | Obsolete | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1.27mm | unknown | 20 | CY*15G04 | Driver | 不合格 | 3.3V | LVTTL | 4 | 770mA | 590mA | 电信电路 | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
CYV15G0201DXB-BBC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 196-LBGA | 196 | 196-FBGA (15x15) | 0°C~70°C | Tray | 2005 | HOTlink II™ | Obsolete | 5 (48 Hours) | 70°C | 0°C | 3.135V~3.465V | CY*15G02 | 收发器 | 3.3V | 2 | LVTTL | 2 | 3.465V | 3.135V | 700mA | 570mA | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
![]() | CYV15G0401DXB-BGI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA Exposed Pad | 256 | -40°C~85°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 5 (48 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | 收发器 | 不合格 | 3.3V | LVTTL | 4 | 1.1A | 830mA | 1500000 Mbps | 4 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
![]() | CYV15G0404DXB-BGC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA Exposed Pad | 256 | 0°C~70°C | Tray | 2004 | HOTlink II™ | e0 | Obsolete | 5 (48 Hours) | 256 | 锡铅 | 3.135V~3.465V | BOTTOM | BALL | 1 | 3.3V | 1.27mm | unknown | CY*15G04 | 256 | 不合格 | 3.3V | LVTTL | 4 | 1.27A | 900mA | 1500000 Mbps | 以太网收发器 | 4 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
![]() | CYW15G0101DXB-BBC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 100-LBGA | 100 | 0°C~70°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | not_compliant | 未说明 | CY*15G01 | 收发器 | 不合格 | 3.3V | 1 | LVTTL | 500mA | 390mA | 1 | Non-RoHS Compliant |
CYP15G0401TB-BGC
Cypress Semiconductor Corp
分类:Interface - Telecom
CYV15G0403DXB-BGI
Cypress Semiconductor Corp
分类:Interface - Telecom
CYV15G0401DXB-BGC
Cypress Semiconductor Corp
分类:Interface - Telecom
CYV15G0404RB-BGXC
Cypress Semiconductor Corp
分类:Interface - Telecom
CYP15G0402DXB-BGC
Cypress Semiconductor Corp
分类:Interface - Telecom
BCM4330FKUBG
Cypress Semiconductor
分类:Interface - Telecom
BCM20736A0KML2G
Cypress Semiconductor
分类:Interface - Telecom
CYW15G0401DXB-BGXC
Cypress Semiconductor Corp
分类:Interface - Telecom
CYP15G0401RB-BGI
Cypress Semiconductor Corp
分类:Interface - Telecom
CYP15G0403DXB-BGI
Cypress Semiconductor Corp
分类:Interface - Telecom
CYW15G0401DXB-BGC
Cypress Semiconductor Corp
分类:Interface - Telecom
CYW15G0401DXB-BGI
Cypress Semiconductor Corp
分类:Interface - Telecom
CYW15G0201DXB-BBI
Cypress Semiconductor Corp
分类:Interface - Telecom
CYV15G0402DXB-BGC
Cypress Semiconductor Corp
分类:Interface - Telecom
CYW15G0201DXB-BBC
Cypress Semiconductor Corp
分类:Interface - Telecom
CYV15G0403DXB-BGC
Cypress Semiconductor Corp
分类:Interface - Telecom
CYW15G0101DXB-BBI
Cypress Semiconductor Corp
分类:Interface - Telecom
CYW15G0403DXB-BGC
Cypress Semiconductor Corp
分类:Interface - Telecom
CYV15G0201DXB-BBXC
Cypress Semiconductor Corp
分类:Interface - Telecom
CYP15G0401TB-BGI
Cypress Semiconductor Corp
分类:Interface - Telecom
CYP15G0401TB-BGXC
Cypress Semiconductor Corp
分类:Interface - Telecom
CYV15G0201DXB-BBC
Cypress Semiconductor Corp
分类:Interface - Telecom
CYV15G0401DXB-BGI
Cypress Semiconductor Corp
分类:Interface - Telecom
CYV15G0404DXB-BGC
Cypress Semiconductor Corp
分类:Interface - Telecom
CYW15G0101DXB-BBC
Cypress Semiconductor Corp
分类:Interface - Telecom
