品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 数据率 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS81302D36E-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | QDR-II | Compliant | Industrial grade | 表面贴装 | 1.9 V | 36 Bit | 4 MWords | Synchronous | 1.7 V | 1.8000 V | QDR | FBGA | 300 MHz | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS81302D36E | SigmaQuad-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 925 mA | Pipelined | 4 M x 36 | 20 Bit | SRAM | 144 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT11GE-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | Commercial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | 0 to 85 °C | Tray | GS81302DT11GE | SigmaQuad-II+ | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 1.055 A | Pipelined | 16 M x 9 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS78132AB-12I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 25 Weeks, 5 Days | BGA-119 | YES | 119 | 119 | 3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | N | SDR | BGA, | 网格排列 | 3 | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 12 ns | 85 °C | 无 | GS78132AB-12I | 3.3 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.23 | BGA | Industrial grade | FBGA | 3.3000 V | Asynchronous | 256 kWords | 32 Bit | 表面贴装 | + 85 C | 3.6 V | - 40 C | 21 | -40 to 85 °C | GS78132AB | e0 | 无 | 3A991.B.2.B | Asynchronous | 锡铅 | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT. | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 8 Mbit | 4 | ASYNCHRONOUS | 200 mA | 12 ns | 256 k x 32 | 1.99 mm | 32 | 18 Bit | SRAM | 8 Mbit | 8388608 bit | Industrial | PARALLEL | 标准SRAM | 3.6 V | 3 V | SRAM | 22 mm | 14 mm | ||||||||||||||||||||||||
![]() | GS71116AGP-7IT | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | YES | 44 | 44 | 3.3 V | TSOP2 | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.33 | TSOP2 | Industrial grade | 3.3000 V | 3 V | Asynchronous | 16 Bit | 3.6 V | TSOP2, TSOP44,.46,32 | SMALL OUTLINE, THIN PROFILE | 3 | 64000 | PLASTIC/EPOXY | TSOP44,.46,32 | -40 °C | 未说明 | 7 ns | 85 °C | 有 | GS71116AGP-7IT | 65536 words | -40 to 85 °C | e3 | 有 | 3A991.B.2.B | 纯哑光锡 | 8542.32.00.41 | SRAMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 0.8 mm | compliant | R-PDSO-G44 | 不合格 | 3.3 V | INDUSTRIAL | ASYNCHRONOUS | 0.15 mA | 7 | 64KX16 | 3-STATE | 1.2 mm | 16 | 0.005 A | 1 | Industrial | PARALLEL | COMMON | 标准SRAM | 3 V | 3.6 V | 3 V | 18.41 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||
![]() | GS74108AGX-8 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | YES | 48 | 48 | 8 ns | 70 °C | 有 | GS74108AGX-8 | 524288 words | 3.3 V | TFBGA | RECTANGULAR | GSI技术 | 不推荐 | GSI TECHNOLOGY | 5.18 | BGA | TFBGA, | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | 512000 | PLASTIC/EPOXY | 未说明 | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.32.00.41 | CMOS | BOTTOM | BALL | 260 | 1 | 0.75 mm | compliant | R-PBGA-B48 | 不合格 | COMMERCIAL | ASYNCHRONOUS | 512KX8 | 1.2 mm | 8 | 4194304 bit | PARALLEL | 标准SRAM | 3.6 V | 3 V | 10 mm | 6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS74116ATP-8 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T18BD-167 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E32CD-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | 150 MHz | + 70 C | 9 Mbit | 130 mA, 140 mA | 7.5 ns | 256 k x 32 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E18CD-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | 150 MHz | + 85 C | GS881E18CD | 9 Mbit | 140 mA, 150 mA | 7.5 ns | 512 k x 18 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E18CGD-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | GSI技术 | SyncBurst | Details | SDR | 有 | 150 MHz | + 85 C | 3.6 V | - 40 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | Tray | GS881E18CGD | DCD Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | 9 Mbit | 2 | 140 mA, 150 mA | 7.5 ns | 512 k x 18 | 18 b | SRAM | 9 Mb | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT37GE-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | 0 to 85 °C | Tray | GS81302TT37GE | SigmaDDR-II+ B2 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 1 | 1.19 A | Pipelined | 4 M x 36 | 21 Bit | SRAM | 144 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302Q07E-300M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | QDR-II | Compliant | Military grade | 300 MHz | BGA | QDR | 1.8000 V | Synchronous | 16 MWords | 8 Bit | 表面贴装 | 有 | 300 MHz | + 125 C | 1.9 V | - 55 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Tray | GS81302Q07E | SigmaQuad-II+ B2 | Memory & Data Storage | 1.8 V | 144 Mbit | Pipelined | 16 M x 8 | 24 Bit | SRAM | 144 Mbit | Military | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D19E-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | QDR-II | Commercial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | 0 to 85 °C | Tray | GS81302D19E | SigmaQuad-II+ B4 | Memory & Data Storage | 144 Mbit | 2 | 1.175 A | Pipelined | 8 M x 18 | 21 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT19GE-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 10 | - 40 C | 1.9 V | + 85 C | 450 MHz | 有 | Industrial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | QDR-II | Details | SigmaQuad-II+ | GSI技术 | GSI技术 | Parallel | SMD/SMT | 1.7 V | -40 to 100 °C | Tray | GS81302DT19GE | SigmaQuad-II+ B4 | Memory & Data Storage | 144 Mbit | 2 | 1.185 A | Pipelined | 8 M x 18 | 21 Bit | SRAM | 144 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673ED18BGK-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-260 | YES | 260 | 260 | 500 MHz | + 85 C | 1.4 V | 0 C | 8 | 1.25 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-IIIe | Details | DDR | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 4000000 | PLASTIC/EPOXY | 未说明 | 85 °C | 有 | GS8673ED18BGK-500 | 1.3 V | HBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.73 | Commercial grade | 500 MHz | BGA | QDR | 1.3500 V | Synchronous | 4 MWords | 18 Bit | 表面贴装 | 有 | 0 to 70 °C | Tray | GS8673ED18BGK | 3A991.B.2.B | SigmaQuad-IIIe B4 | IT ALSO OPERATES AT 1.35 V TYPICAL VOLTAGE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B260 | OTHER | 72 Mbit | 1 | SYNCHRONOUS | 1.77 A | 1 Gb/s | Pipelined | 4 M x 18 | 2.3 mm | 18 | 20 Bit | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | DDR SRAM | 1.4 V | 1.25 V | SRAM | 22 mm | 14 mm | |||||||||||||||||||||||||
![]() | GS8182T09BGD-167 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673ED36BGK-625 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-260 | YES | 260 | 260 | 1.3 V | SMD/SMT | Parallel | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 2000000 | PLASTIC/EPOXY | 85 °C | 1.35 V | HBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.73 | GS8673ED36BGK-625 | 有 | Commercial grade | 625/400 MHz | BGA | QDR | 1.3500 V | 1.3 V | Synchronous | 2 MWords | 36 Bit | 1.4 V | 表面贴装 | 625 MHz | + 85 C | 1.4 V | 0 C | 0 to 70 °C | 3A991.B.2.B | 8542.32.00.41 | CMOS | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B260 | OTHER | 72 Mbit | SYNCHRONOUS | 2.97 A | Pipelined | 2 M x 36 | 2.3 mm | 36 | 19 Bit | 72 Mbit | 75497472 bit | Commercial | PARALLEL | DDR SRAM | 1.4 V | 1.3 V | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D20GE-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | 450 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | 未说明 | 0.37 ns | 有 | GS81302D20GE-450I | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 不推荐 | GSI TECHNOLOGY | 5.06 | BGA | Industrial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | -40 to 100 °C | GS81302D20GE | 3A991.B.2.B | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 144 Mbit | 2 | SYNCHRONOUS | 1.27 A | Pipelined | 8 M x 18 | 1.5 mm | 18 | 21 Bit | 144 Mbit | 150994944 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | 17 mm | 15 mm | 无 | |||||||||||||||||||||||||||||
![]() | GS81302S18E-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 375 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR-II | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS81302S18E-375I | 1.8 V | LBGA | RECTANGULAR | 不推荐 | GSI TECHNOLOGY | 5.33 | BGA | Industrial grade | 375 MHz | FBGA | DDR | 1.8000 V | -40 to 100 °C | Bulk | GS81302S18E | 无 | 3A991.B.2.B | SigmaSIO DDR-II | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 144 Mbit | 2 | SYNCHRONOUS | 1.005 A | Pipelined | 8 M x 18 | 1.5 mm | 18 | 22 Bit | SRAM | 144 Mbit | 150994944 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | 无 | |||||||||||||||
![]() | GS8673EQ36BGK-675 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | YES | 260 | 1.35 V | HBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.73 | Commercial grade | 675 MHz | 1.3500 V | 1.3 V | Synchronous | 2 MWords | 36 Bit | 1.4 V | 表面贴装 | Non-Compliant | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 2000000 | PLASTIC/EPOXY | 未说明 | 0.4 ns | 85 °C | 有 | GS8673EQ36BGK-675 | 0 to 70 °C | 3A991.B.2.B | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B260 | OTHER | 2 | SYNCHRONOUS | Pipelined | 2MX36 | 2.3 mm | 36 | 20 Bit | 72 Mbit | 75497472 bit | Commercial | PARALLEL | DDR SRAM | 1.4 V | 1.3 V | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8128418GB-167IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | YES | 119 | 119 | 1.7, 2.3 V | Synchronous | 8 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 167 MHz | + 85 C | 3.6 V | - 40 C | 10 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | BGA, | 网格排列 | 3 | 8000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 8 ns | 85 °C | 有 | GS8128418GB-167IV | 1.8 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | BGA | Industrial grade | 167 MHz | SDR | 1.8, 2.5 V | -40 to 85 °C | Tray | GS8128418GB | e1 | 有 | 3A991.B.2.B | SCD/DCD Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINE AND FLOW THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 144 Mbit | 2 | SYNCHRONOUS | 350 mA, 400 mA | 8 ns | 8 M x 18 | 1.99 mm | 18 | SRAM | 144 Mbit | 150994944 bit | Industrial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | |||||||||||||||||||
![]() | GS880F18CGT-5.5 | GSI Technology | 数据表 | 21 In Stock | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | SDR | 有 | + 70 C | 3.6 V | 0 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | Tray | GS880F18CGT | 流过 | Memory & Data Storage | 9 Mbit | 145 mA | 5.5 ns | 512 k x 18 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E18CD-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | Compliant | 150 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | GS881E18CD | 70 °C | 0 °C | 9 Mbit | 2 | 120 mA, 130 mA | 7.5 ns | 512 k x 18 | 18 b | 9 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182R36BGD-167I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 165 | 165 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.5 ns | 85 °C | 有 | GS8182R36BGD-167I | 524288 words | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.18 | BGA | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 512000 | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | SYNCHRONOUS | 512KX36 | 1.4 mm | 36 | 18874368 bit | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T18BGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | 0.732199 oz | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaCIO DDR-II | Details | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8342T18BGD-333I | 333 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.86 | BGA | Industrial grade | 333 MHz | -40 to 100 °C | Tray | GS8342T18BGD | 3A991.B.2.B | SigmaDDR-II B2 | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 1 | SYNCHRONOUS | 525 mA | Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 21 Bit | SRAM | 36 Mbit | 0.205 A | 37748736 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm |
GS81302D36E-300I
GSI Technology
分类:Memory
GS81302DT11GE-400
GSI Technology
分类:Memory
GS78132AB-12I
GSI Technology
分类:Memory
GS71116AGP-7IT
GSI Technology
分类:Memory
GS74108AGX-8
GSI Technology
分类:Memory
GS74116ATP-8
GSI Technology
分类:Memory
GS8182T18BD-167
GSI Technology
分类:Memory
GS881E32CD-150
GSI Technology
分类:Memory
GS881E18CD-150I
GSI Technology
分类:Memory
GS881E18CGD-150I
GSI Technology
分类:Memory
GS81302TT37GE-450
GSI Technology
分类:Memory
GS81302Q07E-300M
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GSI Technology
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分类:Memory
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分类:Memory
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