品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 数据率 | 内存接口 | 建筑学 | 数据总线宽度 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 组织的记忆 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS816132DGT-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | Tray | GS816132DGT | 同步突发 | Memory & Data Storage | 18 Mbit | 245 mA, 265 mA | 5.5 ns | 512 k x 32 | SRAM | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816136DD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Compliant | 有 | 200 MHz | + 70 C | 3.6 V | 0 C | 36 | Bulk | GS816136DD | Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 18 Mbit | 4 | 210 mA | 6.5 ns | 512 k x 36 | 19 b | SRAM | 18 Mb | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673ET36BK-550I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-260 | 1.25 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-IIIe | DDR | Non-Compliant | 有 | 550 MHz | + 100 C | 1.4 V | - 40 C | 8 | Tray | GS8673ET36BK | SigmaDDR-IIIe B2 | Memory & Data Storage | 72 Mbit | 2.03 A | 2 M x 36 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342Q18BGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | DDR | Details | SigmaQuad-II | GSI技术 | GSI技术 | Parallel | SMD/SMT | 1.7 V | 15 | 0 C | 1.9 V | + 70 C | 300 MHz | 有 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 有 | GS8342Q18BGD-300 | 300 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.88 | BGA | Commercial grade | 300 MHz | FBGA | QDR | 0 to 85 °C | Tray | GS8342Q18BGD | 3A991.B.2.B | SigmaQuad-II | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 775 mA | 450 ps | Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 20 Bit | SRAM | 36 Mbit | 0.225 A | 37748736 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||||||||
![]() | GS840Z18CGT-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-100 | 100-TQFP (20x14) | GSI Technology Inc. | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Tray | GS840Z | 活跃 | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 72 | -40°C ~ 100°C (TJ) | Tray | GS840Z18CGT | NBT Pipeline/Flow Through | Memory & Data Storage | SRAM - Synchronous, ZBT | 2.3V ~ 2.7V, 3V ~ 3.6V | 4 Mbit | 250 MHz | 165 mA, 200 mA | 5.5 ns | SRAM | Parallel | 256 k x 18 | - | SRAM | SRAM | 256K x 18 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81284Z36B-167 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | Commercial grade | 125@Flow-Through/167@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 4 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 167 MHz | + 70 C | 3.6 V | 0 C | 10 | 2.3 V | 0 to 70 °C | Tray | GS81284Z36B | NBT Pipeline/Flow Through | Memory & Data Storage | 144 Mbit | 4 | 340 mA, 395 mA | 8 ns | Flow-Through/Pipelined | 4 M x 36 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81284Z18B-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-119 | YES | 119 | 119 | Synchronous | 8 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 70 C | 3.6 V | 0 C | 10 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | 70 °C | 无 | GS81284Z18B-200V | 1.8 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.03 | BGA | 7.5 ns | 未说明 | PLASTIC/EPOXY | 8000000 | 网格排列 | BGA, | Commercial grade | 200 MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | 0 to 70 °C | Tray | GS81284Z18B | e0 | 无 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Lead (Sn/Pb) | PIPELINE AND FLOW THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | COMMERCIAL | 144 Mbit | 2 | SYNCHRONOUS | 325 mA, 400 mA | 7.5 ns | Flow-Through/Pipelined | 8 M x 18 | 1.99 mm | 18 | 22 Bit | SRAM | 144 Mbit | 150994944 bit | Commercial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | |||||||||||||||||||||||||||||
![]() | GS8128418GB-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-119 | 119 | 119-FPBGA (22x14) | GSI Technology Inc. | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Tray | GS8128418 | 活跃 | Industrial grade | 153.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 8 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 10 | 2.3 V | -40 to 85 °C | Tray | GS8128418GB | SCD/DCD Pipeline/Flow Through | Memory & Data Storage | SRAM - Synchronous, Standard | 2.3V ~ 2.7V, 3V ~ 3.6V | 144 Mbit | 2 | 250 MHz | 390 mA, 490 mA | 6.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 8 M x 18 | - | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM | 8M x 18 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D36BD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaQuad-II | N | DDR | Commercial grade | 250 MHz | FBGA | QDR | 1.8000 V | Synchronous | 2 MWords | 36 Bit | 表面贴装 | 有 | 250 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | 0 to 85 °C | Tray | GS8662D36BD | SigmaQuad-II | Memory & Data Storage | 72 Mbit | 2 | 730 mA | Pipelined | 2 M x 36 | 19 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8160Z18BGT-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 1048576 words | 2.5 V | LQFP | RECTANGULAR | Rochester Electronics LLC | 接触制造商 | ROCHESTER ELECTRONICS LLC | 5.66 | LQFP, | FLATPACK, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 5.5 ns | 70 °C | GS8160Z18BGT-250 | 3A991.B.2.A | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | CMOS | QUAD | 鸥翼 | 1 | 0.65 mm | unknown | R-PQFP-G100 | COMMERCIAL | SYNCHRONOUS | 1MX18 | 1.6 mm | 18 | 18874368 bit | PARALLEL | ZBT SRAM | 2.75 V | 2.25 V | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832032GT-133I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 100 | QFP | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 1000000 | PLASTIC/EPOXY | QFP100,.63X.87 | -40 °C | 未说明 | 8.5 ns | 85 °C | 有 | GS832032GT-133I | 133 MHz | 1048576 words | 2.5 V | LQFP | RECTANGULAR | GSI技术 | Obsolete | GSI TECHNOLOGY | 5.7 | e3 | 有 | 3A991.B.2.B | 纯哑光锡 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | SRAMs | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3 V | INDUSTRIAL | SYNCHRONOUS | 0.21 mA | 1MX32 | 3-STATE | 1.6 mm | 32 | 0.08 A | 33554432 bit | PARALLEL | COMMON | 缓存SRAM | 3.14 V | 2.7 V | 2.3 V | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864236B-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 133.3@Flow-Through/200@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 200 MHz | + 85 C | 3.6 V | - 40 C | 14 | 2.3 V | SMD/SMT | -40 to 85 °C | Tray | GS864236B | SCD/DCD Pipeline/Flow Through | Memory & Data Storage | 72 Mbit | 4 | 250 mA, 330 mA | 7.5 ns | Flow-Through/Pipelined | 2 M x 36 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS4288S09GL-24I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 144 | Compliant | 95 °C | -40 °C | 1.8 V | 9 b | 24 b | 288 Mb | 400 MHz | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS4288S09L-18I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 144 | Compliant | 95 °C | -40 °C | 1.8 V | 9 b | 24 b | 288 Mb | 533 MHz | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS4288S09GL-25I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 144 | Compliant | 95 °C | -40 °C | 1.8 V | 9 b | 24 b | 288 Mb | 400 MHz | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673ED18BK-675I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-260 | YES | 260 | 260 | 表面贴装 | 有 | 675 MHz | + 100 C | 1.4 V | - 40 C | 8 | 1.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 4000000 | PLASTIC/EPOXY | 未说明 | 无 | GS8673ED18BK-675I | 1.35 V | HBGA | RECTANGULAR | 不推荐 | GSI TECHNOLOGY | 5.8 | Industrial grade | 675/450 MHz | BGA | QDR | 1.3500 V | 1.3 V | Synchronous | 4 MWords | 18 Bit | 1.4 V | -40 to 85 °C | Tray | GS8673ED18BK | 3A991.B.2.B | SigmaQuad-IIIe B4 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B260 | 72 Mbit | SYNCHRONOUS | 2.26 A | 1.35 Gb/s | Pipelined | 4 M x 18 | 2.3 mm | 18 | 20 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | DDR SRAM | 1.4 V | 1.3 V | SRAM | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D09E-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 10 | GSI技术 | GSI技术 | SigmaQuad-II | Industrial grade | 375 MHz | FBGA | QDR | -40 to 100 °C | Tray | GS81302D09E | Memory & Data Storage | 2 | Pipelined | 22 Bit | SRAM | 144 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D38GE-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | QDR | 450 MHz | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | LBGA, | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | 未说明 | 0.37 ns | 有 | GS81302D38GE-450 | 1.8 V | LBGA | RECTANGULAR | 不推荐 | GSI TECHNOLOGY | 5.06 | BGA | Commercial grade | 表面贴装 | 1.9 V | 36 Bit | 4 MWords | Synchronous | 1.7 V | 1.8000 V | 0 to 85 °C | Tray | GS81302D38GE | 3A991.B.2.B | SigmaQuad-II+ | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 144 Mbit | 2 | SYNCHRONOUS | 1.53 A | Pipelined | 4 M x 36 | 1.5 mm | 36 | 20 Bit | SRAM | 144 Mbit | 150994944 bit | Commercial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | ||||||||||||||||||||||||||||||||||||
![]() | GS8662Q37BD-300M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | QDR-II | Military grade | 300 MHz | BGA | QDR | 1.8000 V | Synchronous | 2 MWords | 36 Bit | 表面贴装 | 有 | 300 MHz | + 125 C | 1.9 V | - 55 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Tray | GS8662Q37BD | SigmaQuad-II+ B2 | Memory & Data Storage | 72 Mbit | Pipelined | 2 M x 36 | 21 Bit | SRAM | 72 Mbit | Military | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T11GE-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | Commercial grade | 500 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302T11GE | SigmaDDR-II+ | Memory & Data Storage | 144 Mbit | 1 | 1.07 A | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673EQ36BGK-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-260 | YES | 260 | 260 | 36 Bit | 1.4 V | 表面贴装 | 有 | 500 MHz | + 100 C | 1.4 V | - 40 C | 8 | 1.25 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-IIIe | Details | QDR-III | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 2000000 | PLASTIC/EPOXY | 未说明 | 0.4 ns | 有 | GS8673EQ36BGK-500I | 1.3 V | HBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.73 | Industrial grade | 500 MHz | BGA | QDR | 1.3500 V | 1.25 V | Synchronous | 2 MWords | -40 to 85 °C | Tray | GS8673EQ36BGK | 3A991.B.2.B | SigmaQuad-IIIe B2 | IT ALSO OPERATES AT 1.35 V TYPICAL VOLTAGE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B260 | 72 Mbit | 1 | SYNCHRONOUS | 2.44 A | Pipelined | 2 M x 36 | 2.3 mm | 36 | 20 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | DDR SRAM | 1.4 V | 1.25 V | SRAM | 22 mm | 14 mm | |||||||||||||||||||||||||||||||||||||
![]() | GS81302D07GE-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | 表面贴装 | 400 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 16000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS81302D07GE-400I | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 不推荐 | GSI TECHNOLOGY | 5.33 | BGA | Industrial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | -40 to 100 °C | GS81302D07GE | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 流水线结构 | 8542.32.00.41 | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 144 Mbit | 2 | SYNCHRONOUS | 1.065 A | Pipelined | 16 M x 8 | 1.5 mm | 8 | 22 Bit | 144 Mbit | 134217728 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | 17 mm | 15 mm | |||||||||||||||||||||||||||||||||||||||
![]() | GS8182R09BGD-167 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 165 | 165 | 2000000 | PLASTIC/EPOXY | 未说明 | 0.5 ns | 70 °C | 有 | GS8182R09BGD-167 | 2097152 words | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.19 | BGA | LBGA, | GRID ARRAY, LOW PROFILE | 3 | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | SYNCHRONOUS | 2MX9 | 1.4 mm | 9 | 18874368 bit | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | 15 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT19GE-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Commercial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 10 | 0 to 85 °C | Tray | GS81302DT19GE | SigmaQuad-II+ B4 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 1.175 A | Pipelined | 8 M x 18 | 21 Bit | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS4288S09L-18 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 144 | Compliant | 95 °C | 0 °C | 1.8 V | 9 b | 24 b | 288 Mb | 533 MHz | 无 |
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