GSI Technology GS8128418GB-250I

包装/外壳

BGA-119

安装类型

表面贴装

引脚数

119

供应商器件包装

119-FPBGA (22x14)

Maximum Clock Rate

153.8@Flow-Through/250@Pipelined MHz

Supplier Package

FBGA

Data Rate Architecture

SDR

Typical Operating Supply Voltage

2.5, 3.3 V

Minimum Operating Supply Voltage

2.3, 3 V

Timing Type

Synchronous

Number of Words

8 MWords

Number of I/O Lines

18 Bit

Maximum Operating Supply Voltage

2.7, 3.6 V

Mounting

表面贴装

Moisture Sensitive

有

Maximum Clock Frequency

250 MHz

Maximum Operating Temperature

+ 85 C

Supply Voltage-Max

3.6 V

Minimum Operating Temperature

- 40 C

Factory Pack QuantityFactory Pack Quantity

10

Supply Voltage-Min

2.3 V

Mounting Styles

SMD/SMT

Interface Type

Parallel

Manufacturer

GSI技术

Brand

GSI技术

Tradename

SyncBurst

RoHS

Details

Memory Types

SDR

Package

Tray

Base Product Number

GS8128418

厂商

GSI Technology Inc.

Product Status

活跃

Usage Level

Industrial grade

操作温度

-40 to 85 °C

系列

GS8128418GB

包装

Tray

类型

SCD/DCD Pipeline/Flow Through

子类别

Memory & Data Storage

技术

SRAM - Synchronous, Standard

电压 - 供电

2.3V ~ 2.7V, 3V ~ 3.6V

内存大小

144 Mbit

端口的数量

2

时钟频率

250 MHz

电源电流-最大值

390 mA, 490 mA

访问时间

6.5 ns

内存格式

SRAM

内存接口

Parallel

建筑学

Flow-Through/Pipelined

组织结构

8 M x 18

写入周期时间 - 字符、页面

-

地址总线宽度

23 Bit

产品类别

SRAM

密度

144 Mbit

筛选水平

Industrial

产品类别

SRAM

组织的记忆

8M x 18