品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS81302D37E-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | QDR-II | Commercial grade | 350 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 70 °C | Tray | GS81302D37E | SigmaQuad-II+ B4 | Memory & Data Storage | 144 Mbit | 2 | 1.055 A | Pipelined | 4 M x 36 | 20 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT11E-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | DDR-II | SigmaDDR-II+ | Industrial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS81302TT11E | SigmaDDR-II+ | Memory & Data Storage | 144 Mbit | 1 | 1.01 A | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8644Z36E-133 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 133 MHz | + 70 C | 3.6 V | 0 C | 15 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | BGA, BGA165,11X15,40 | 网格排列 | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | BGA | 5.15 | GSI TECHNOLOGY | 活跃 | RECTANGULAR | BGA | 2.5 V | 133 MHz | GS8644Z36E-133 | 无 | 70 °C | 8.5 ns | 未说明 | Commercial grade | 117.6@Flow-Through/133@Pipelined MHz | 0 to 70 °C | Tray | GS8644Z36E | 无 | 3A991.B.2.B | NBT | ALSO OPERATES AT 3.3V SUPPLY; PIPELINED OR FLOW-THROUGH ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | COMMERCIAL | 72 Mbit | 4 | SYNCHRONOUS | 230 mA, 270 mA | 8.5 ns | Flow-Through/Pipelined | 2 M x 36 | 3-STATE | 1.5 mm | 36 | 21 Bit | SRAM | 72 Mbit | 0.12 A | 75497472 bit | Commercial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 17 mm | 15 mm | |||||
![]() | GS8673ET36BGK-625 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-260 | 260 | 1.3500 V | 1.3 V | Synchronous | 2 MWords | 36 Bit | 1.4 V | 表面贴装 | 625 MHz | + 85 C | 1.4 V | 0 C | 1.3 V | SMD/SMT | Parallel | Commercial grade | 625/400 MHz | BGA | DDR | 0 to 70 °C | GS8673ET36BGK | 72 Mbit | 2.23 A | Pipelined | 2 M x 36 | 72 Mbit | Commercial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673EQ18BK-714I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-260 | 260 | BGA | QDR | Synchronous | 4 MWords | 18 Bit | 表面贴装 | 有 | 714 MHz | + 100 C | - 40 C | 8 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-IIIe | QDR-III | Industrial grade | 714 MHz | -40 to 85 °C | Tray | GS8673EQ18BK | SigmaQuad-IIIe B2 | Memory & Data Storage | 72 Mbit | 1 | Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS882Z36CGD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | GSI TECHNOLOGY | 活跃 | GSI技术 | RECTANGULAR | LBGA | 2.5 V | 262144 words | 200 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 70 °C | 有 | GS882Z36CGD-200 | BGA | 5.11 | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 9 Mbit | SYNCHRONOUS | 140 mA, 170 mA | 6.5 ns | 256 k x 36 | 1.4 mm | 36 | 9437184 bit | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT10GE-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 350 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 350 MHz | FBGA | QDR | -40 to 100 °C | GS81302DT10GE | 144 Mbit | 2 | 950 mA | Pipelined | 16 M x 9 | 22 Bit | 144 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88136CD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | Commercial grade | 256000 | PLASTIC/EPOXY | 未说明 | 70 °C | 无 | GS88136CD-200 | 3.3 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 200 MHz | 0 to 70 °C | 3A991.B.2.B | ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY, FLOW THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 9 Mbit | 1 | SYNCHRONOUS | 140 mA, 170 mA | 6.5 ns | Flow-Through/Pipelined | 256 k x 36 | 1.4 mm | 36 | 18 Bit | 9 Mbit | 9437184 bit | Commercial | SERIAL | 缓存SRAM | 3.6 V | 3 V | 15 mm | 13 mm | |||||||||||||||||||||||||||
![]() | GS882Z18CD-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | NBT SRAM | SDR | Industrial grade | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | -40 to 85 °C | Tray | GS882Z18CD | NBT | Memory & Data Storage | 9 Mbit | 2 | 125 mA, 160 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 18 | SRAM | 9 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832272C-166 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 5 Weeks | BGA-209 | YES | 209 | 209 | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 166 MHz | + 70 C | 3.6 V | 0 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | LBGA, BGA209,11X19,40 | GRID ARRAY, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | BGA209,11X19,40 | 未说明 | 8 ns | 70 °C | 无 | GS832272C-166 | 166 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 1.63 | BGA | Commercial grade | 125@Flow-Through/166@Pipelined MHz | 0 to 70 °C | Tray | GS832272C | 无 | 3A991.B.2.B | SCD/DCD Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B209 | 不合格 | 2.5/3.3 V | COMMERCIAL | 36 Mbit | 8 | SYNCHRONOUS | 225 mA, 280 mA | 8 ns | Flow-Through/Pipelined | 512 k x 72 | 3-STATE | 1.7 mm | 72 | 19 Bit | SRAM | 36 Mbit | 0.06 A | 37748736 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 2.38 V | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | |||||
![]() | GS81302TT38GE-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 500 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 500 MHz | FBGA | DDR | 0 to 85 °C | GS81302TT38GE | 144 Mbit | 1 | 1.3 A | Pipelined | 4 M x 36 | 21 Bit | 144 Mbit | Commercial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182R08BGD-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 375 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 8 Bit | 1.9 V | 表面贴装 | Industrial grade | -40 to 85 °C | 1 | Pipelined | 19 Bit | 18 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8320Z18AGT-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Industrial grade | 375 MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 375 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | -40 to 85 °C | Tray | GS8320Z18AGT | NBT Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 2 | 270 mA, 370 mA | 4.2 ns | Flow-Through/Pipelined | 2 M x 18 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T19GE-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | -40 to 100 °C | Tray | GS81302T19GE | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 905 mA | Pipelined | 8 M x 18 | 22 Bit | SRAM | 144 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864218B-167I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 4 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 167 MHz | + 85 C | 3.6 V | - 40 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | BGA, | 网格排列 | 3 | 4000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 8 ns | 85 °C | 无 | GS864218B-167I | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.15 | BGA | Industrial grade | 125@Flow-Through/167@Pipelined MHz | FBGA | SDR | -40 to 85 °C | Tray | GS864218B | e0 | 无 | 3A991.B.2.B | SCD/DCD Pipeline/Flow Through | Tin/Lead (Sn/Pb) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 215 mA, 260 mA | 8 ns | Flow-Through/Pipelined | 4 M x 18 | 1.99 mm | 18 | 22 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | ||||||||||
![]() | GS8662T08BD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8662T08BD-300I | 300 MHz | 1.8 V | LBGA | RECTANGULAR | BGA | 5.36 | GSI TECHNOLOGY | 活跃 | Industrial grade | 300 MHz | FBGA | -40 to 100 °C | Tray | GS8662T08BD | e0 | 无 | 3A991.B.2.B | SigmaDDR-II B2 | Tin/Lead (Sn/Pb) | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 72 Mbit | 1 | SYNCHRONOUS | 505 mA | Pipelined | 8 M x 8 | 3-STATE | 1.4 mm | 8 | 22 Bit | SRAM | 72 Mbit | 67108864 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||
![]() | GS8342T19BD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Industrial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8342T19BD | SigmaDDR-II+ B2 | Memory & Data Storage | 36 Mbit | 1 | 680 mA | Pipelined | 2 M x 18 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342Q37BGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342Q37BGD | SigmaQuad-II+ B2 | Memory & Data Storage | 36 Mbit | 2 | 895 mA | Pipelined | 1 M x 36 | 19 Bit | SRAM | 36 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT06BD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662TT06BD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 1 | 590 mA | Pipelined | 8 M x 8 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8640E36GT-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 181.8@Flow-Through/300@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 300 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | 0 to 70 °C | Tray | GS8640E36GT | Pipeline/Flow Through | Memory & Data Storage | 72 Mbit | 4 | 300 mA, 420 mA | 5.5 ns | Flow-Through/Pipelined | 2 M x 36 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816272CGC-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-209 | YES | 209 | 209 | GSI技术 | 5 ns | GSI TECHNOLOGY | 200@Flow-Through/300@Pipelined MHz | FBGA | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 300 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | GSI技术 | SyncBurst | Details | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 85 °C | 有 | GS816272CGC-300I | 2.5 V | LBGA | RECTANGULAR | 活跃 | 5.16 | BGA | Industrial grade | SDR | 21 | -40 to 85 °C | Tray | GS816272CGC | e1 | 有 | 3A991.B.2.B | Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B209 | 不合格 | INDUSTRIAL | 18 Mbit | 8 | SYNCHRONOUS | 300 mA, 375 mA | 5 ns | Flow-Through/Pipelined | 256 k x 72 | 1.7 mm | 72 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | |||||||||
![]() | GS880E32CGT-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 32 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | SDR | Details | SyncBurst | GSI技术 | GSI技术 | Parallel | SMD/SMT | 1.7 V | 66 | 0 C | 2.7 V | + 70 C | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | QFP100,.63X.87 | 未说明 | 5.5 ns | 70 °C | 有 | GS880E32CGT-250V | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.38 | QFP | Commercial grade | 181.5@Flow-Through/250@Pipelined MHz | TQFP | 0 to 70 °C | Tray | GS880E32CGT | e3 | 有 | 3A991.B.2.B | DCD | 纯哑光锡 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 1.8/2.5 V | COMMERCIAL | 9 Mbit | 2 | SYNCHRONOUS | 140 mA, 180 mA | 5.5 ns | Flow-Through/Pipelined | 256 k x 32 | 3-STATE | 1.6 mm | 32 | 18 Bit | SRAM | 8 Mbit | 0.025 A | 8388608 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 1.7 V | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | ||||
![]() | GS880F36CGT-6.5IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | QFP100,.63X.87 | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS880F36CGT-6.5IV | 153 MHz | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.37 | QFP | Industrial grade | 153.8 MHz | -40 to 85 °C | Tray | GS880F36CGT | e3 | 有 | 3A991.B.2.B | 流过 | 纯哑光锡 | FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 2.3 V TO 2.7 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 1.8/2.5 V | INDUSTRIAL | 9 Mbit | 4 | SYNCHRONOUS | 145 mA | 6.5 ns | Flow-Through | 256 k x 36 | 3-STATE | 1.6 mm | 36 | 18 Bit | SRAM | 9 Mbit | 0.045 A | 9437184 bit | Industrial | PARALLEL | COMMON | 缓存SRAM | 1.7 V | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | |||
![]() | GS8662T18BD-350M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 表面贴装 | 350 MHz | + 125 C | 1.9 V | - 55 C | 1.7 V | SMD/SMT | Parallel | Military grade | 350 MHz | FBGA | DDR | 1.8000 V | Synchronous | 4 MWords | 18 Bit | GS8662T18BD | 72 Mbit | 720 mA | Pipelined | 4 M x 18 | 22 Bit | 72 Mbit | Military | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302S36E-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR-II | Industrial grade | 250 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS81302S36E | SigmaSIO DDR-II | Memory & Data Storage | 144 Mbit | 2 | 800 mA | Pipelined | 4 M x 36 | 21 Bit | SRAM | 144 Mbit | Industrial | SRAM |
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