N/A

-

12 Weeks

YES

119

119

3

1000000

PLASTIC/EPOXY

-40 °C

未说明

10 ns

85 °C

有

GS78108AGB-10I

1048576 words

3.3 V

BGA

RECTANGULAR

GSI技术

生命周期结束

GSI TECHNOLOGY

5.24

BGA

BGA,

网格排列

e1

有

3A991.B.2.B

锡银铜

THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT

8542.32.00.41

CMOS

BOTTOM

BALL

260

1

1.27 mm

compliant

R-PBGA-B119

不合格

INDUSTRIAL

ASYNCHRONOUS

1MX8

1.99 mm

8

8388608 bit

PARALLEL

标准SRAM

3.6 V

3 V

22 mm

14 mm

N/A

-

12 Weeks

YES

119

119

512000

PLASTIC/EPOXY

未说明

12 ns

70 °C

无

GS78116AB-12

BGA

5.22

GSI TECHNOLOGY

生命周期结束

GSI技术

RECTANGULAR

BGA

3.3 V

524288 words

BGA,

网格排列

3

e0

无

3A991.B.2.B

锡铅

THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT.

8542.32.00.41

CMOS

BOTTOM

BALL

未说明

1

1.27 mm

compliant

R-PBGA-B119

不合格

COMMERCIAL

ASYNCHRONOUS

512KX16

1.99 mm

16

8388608 bit

PARALLEL

标准SRAM

3.6 V

3 V

22 mm

14 mm

N/A

-

Compliant

70 °C

0 °C

3.3 V

1

19 b

4 Mb

无

N/A

-

25 Weeks, 5 Days

YES

119

119

BGA,

网格排列

3

512000

PLASTIC/EPOXY

-40 °C

未说明

8 ns

85 °C

无

GS78116AB-8I

524288 words

3.3 V

BGA

RECTANGULAR

GSI技术

生命周期结束

GSI TECHNOLOGY

5.22

BGA

Compliant

e0

无

3A991.B.2.B

锡铅

85 °C

-40 °C

THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT.

8542.32.00.41

CMOS

3.3 V

BOTTOM

BALL

未说明

1

1.27 mm

compliant

R-PBGA-B119

不合格

INDUSTRIAL

1

ASYNCHRONOUS

512KX16

1.99 mm

16

19 b

8 Mb

8388608 bit

PARALLEL

标准SRAM

3.6 V

3 V

22 mm

14 mm

无

N/A

-

12 Weeks

YES

119

119

BGA,

网格排列

3

256000

PLASTIC/EPOXY

-40 °C

未说明

10 ns

85 °C

无

GS76024AB-10I

262144 words

3.3 V

BGA

RECTANGULAR

GSI技术

不推荐

GSI TECHNOLOGY

5.24

BGA

Compliant

e0

无

3A991.B.2.B

锡铅

85 °C

-40 °C

8542.32.00.41

CMOS

3.3 V

BOTTOM

BALL

未说明

1

1.27 mm

compliant

R-PBGA-B119

不合格

INDUSTRIAL

1

ASYNCHRONOUS

256KX24

1.99 mm

24

18 b

6 Mb

6291456 bit

PARALLEL

标准SRAM

3.6 V

3 V

22 mm

14 mm

无

N/A

-

Compliant

70 °C

0 °C

1.8 V

1

20 b

36 Mb

无

N/A

-

25 Weeks, 5 Days

YES

119

119

BGA,

网格排列

3

1000000

PLASTIC/EPOXY

-40 °C

未说明

12 ns

85 °C

有

GS78108AGB-12I

1048576 words

3.3 V

BGA

RECTANGULAR

GSI技术

生命周期结束

GSI TECHNOLOGY

5.24

BGA

Compliant

e1

有

3A991.B.2.B

锡银铜

85 °C

-40 °C

THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT

8542.32.00.41

CMOS

3.3 V

BOTTOM

BALL

260

1

1.27 mm

compliant

R-PBGA-B119

不合格

INDUSTRIAL

1

ASYNCHRONOUS

1MX8

1.99 mm

8

20 b

8 Mb

8388608 bit

PARALLEL

标准SRAM

3.6 V

3 V

22 mm

14 mm

无

N/A

-

12 Weeks

YES

119

119

1000000

PLASTIC/EPOXY

未说明

8 ns

70 °C

有

GS78108AGB-8

1048576 words

3.3 V

BGA

RECTANGULAR

GSI技术

生命周期结束

GSI TECHNOLOGY

5.24

BGA

BGA,

网格排列

3

e1

有

3A991.B.2.B

锡银铜

THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT

8542.32.00.41

CMOS

BOTTOM

BALL

260

1

1.27 mm

compliant

R-PBGA-B119

不合格

COMMERCIAL

ASYNCHRONOUS

1MX8

1.99 mm

8

8388608 bit

PARALLEL

标准SRAM

3.6 V

3 V

22 mm

14 mm

N/A

-

YES

165

165

PLASTIC/EPOXY

未说明

7.5 ns

70 °C

无

GS816118BD-150

1048576 words

2.5 V

LBGA

RECTANGULAR

GSI技术

Obsolete

GSI TECHNOLOGY

5.67

BGA

LBGA,

GRID ARRAY, LOW PROFILE

1000000

e0

无

3A991.B.2.B

Tin/Lead (Sn/Pb)

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY

8542.32.00.41

CMOS

BOTTOM

BALL

未说明

1

1 mm

not_compliant

R-PBGA-B165

不合格

COMMERCIAL

SYNCHRONOUS

1MX18

1.4 mm

18

18874368 bit

PARALLEL

缓存SRAM

2.7 V

2.3 V

15 mm

13 mm

N/A

-

12 Weeks

YES

119

119

512000

PLASTIC/EPOXY

未说明

10 ns

70 °C

无

GS78116AB-10

524288 words

3.3 V

BGA

RECTANGULAR

GSI技术

生命周期结束

GSI TECHNOLOGY

5.22

BGA

BGA,

网格排列

3

e0

无

3A991.B.2.B

锡铅

THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT.

8542.32.00.41

CMOS

BOTTOM

BALL

未说明

1

1.27 mm

compliant

R-PBGA-B119

不合格

COMMERCIAL

ASYNCHRONOUS

512KX16

1.99 mm

16

8388608 bit

PARALLEL

标准SRAM

3.6 V

3 V

22 mm

14 mm

N/A

-

12 Weeks

YES

119

119

1000000

PLASTIC/EPOXY

未说明

10 ns

70 °C

BGA

5.24

GSI TECHNOLOGY

生命周期结束

GSI技术

RECTANGULAR

BGA

3.3 V

1048576 words

GS78108AB-10

无

BGA,

网格排列

3

e0

无

3A991.B.2.B

锡铅

THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT

8542.32.00.41

CMOS

BOTTOM

BALL

未说明

1

1.27 mm

compliant

R-PBGA-B119

不合格

COMMERCIAL

ASYNCHRONOUS

1MX8

1.99 mm

8

8388608 bit

PARALLEL

标准SRAM

3.6 V

3 V

22 mm

14 mm

N/A

-

25 Weeks, 5 Days

YES

119

119

1000000

PLASTIC/EPOXY

未说明

BGA

5.24

GSI TECHNOLOGY

生命周期结束

GSI技术

RECTANGULAR

BGA

3.3 V

1048576 words

GS78108AB-12

无

70 °C

12 ns

BGA,

网格排列

3

e0

无

3A991.B.2.B

锡铅

THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT

8542.32.00.41

CMOS

BOTTOM

BALL

未说明

1

1.27 mm

compliant

R-PBGA-B119

不合格

COMMERCIAL

ASYNCHRONOUS

1MX8

1.99 mm

8

8388608 bit

PARALLEL

标准SRAM

3.6 V

3 V

22 mm

14 mm

N/A

-

25 Weeks, 5 Days

YES

119

119

3

1000000

PLASTIC/EPOXY

-40 °C

未说明

12 ns

85 °C

无

GS78108AB-12I

1048576 words

3.3 V

BGA

RECTANGULAR

GSI技术

生命周期结束

GSI TECHNOLOGY

5.24

BGA

BGA,

网格排列

e0

无

3A991.B.2.B

锡铅

THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT

8542.32.00.41

CMOS

BOTTOM

BALL

未说明

1

1.27 mm

compliant

R-PBGA-B119

不合格

INDUSTRIAL

ASYNCHRONOUS

1MX8

1.99 mm

8

8388608 bit

PARALLEL

标准SRAM

3.6 V

3 V

22 mm

14 mm

N/A

-

6 Weeks

YES

44

44

3

256000

PLASTIC/EPOXY

TSOP44,.46,32

未说明

10 ns

70 °C

有

GS72108AGP-10

262144 words

3.3 V

TSOP2

RECTANGULAR

GSI技术

Obsolete

GSI TECHNOLOGY

5.54

TSOP2

TSOP2, TSOP44,.46,32

SMALL OUTLINE, THIN PROFILE

有

3A991.B.2.B

Pure Matte Tin (Sn)

8542.32.00.41

CMOS

DUAL

鸥翼

260

1

0.8 mm

compliant

R-PDSO-G44

不合格

COMMERCIAL

ASYNCHRONOUS

0.095 mA

256KX8

3-STATE

1.2 mm

8

0.02 A

2097152 bit

PARALLEL

COMMON

标准SRAM

3 V

3.6 V

3 V

YES

18.41 mm

10.16 mm

N/A

-

25 Weeks, 5 Days

YES

119

119

PLASTIC/EPOXY

-40 °C

未说明

10 ns

85 °C

无

GS78116AB-10I

524288 words

3.3 V

BGA

RECTANGULAR

GSI技术

网格排列

BGA,

生命周期结束

GSI TECHNOLOGY

5.22

BGA

3

512000

e0

无

3A991.B.2.B

锡铅

THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT.

8542.32.00.41

CMOS

BOTTOM

BALL

未说明

1

1.27 mm

compliant

R-PBGA-B119

不合格

INDUSTRIAL

ASYNCHRONOUS

512KX16

1.99 mm

16

8388608 bit

PARALLEL

标准SRAM

3.6 V

3 V

22 mm

14 mm

N/A

-

25 Weeks, 5 Days

YES

119

119

1000000

PLASTIC/EPOXY

未说明

8 ns

70 °C

无

GS78108AB-8

1048576 words

3.3 V

BGA

RECTANGULAR

GSI技术

生命周期结束

GSI TECHNOLOGY

5.24

BGA

BGA,

网格排列

3

e0

无

3A991.B.2.B

锡铅

THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT

8542.32.00.41

CMOS

BOTTOM

BALL

未说明

1

1.27 mm

compliant

R-PBGA-B119

不合格

COMMERCIAL

ASYNCHRONOUS

1MX8

1.99 mm

8

8388608 bit

PARALLEL

标准SRAM

3.6 V

3 V

22 mm

14 mm

N/A

-

6 Weeks

YES

119

119

3

128000

PLASTIC/EPOXY

-40 °C

未说明

10 ns

85 °C

无

GS73024AB-10I

131072 words

3.3 V

BGA

RECTANGULAR

GSI技术

Obsolete

GSI TECHNOLOGY

5.69

BGA

14 X 22 MM, 1.27 MM PITCH, FPBGA-119

网格排列

e0

无

3A991.B.2.B

Tin/Lead (Sn/Pb)

8542.32.00.41

CMOS

BOTTOM

BALL

未说明

1

1.27 mm

compliant

R-PBGA-B119

不合格

INDUSTRIAL

ASYNCHRONOUS

128KX24

1.99 mm

24

3145728 bit

PARALLEL

标准SRAM

3.6 V

3 V

22 mm

14 mm

N/A

-

6 Weeks

YES

119

119

128000

PLASTIC/EPOXY

未说明

12 ns

70 °C

无

GS73024AB-12

131072 words

3.3 V

BGA

RECTANGULAR

GSI技术

Obsolete

GSI TECHNOLOGY

5.9

BGA

14 X 22 MM, 1.27 MM PITCH, FPBGA-119

网格排列

3

e0

无

3A991.B.2.B

Tin/Lead (Sn/Pb)

8542.32.00.41

CMOS

BOTTOM

BALL

未说明

1

1.27 mm

compliant

R-PBGA-B119

不合格

COMMERCIAL

ASYNCHRONOUS

128KX24

1.99 mm

24

3145728 bit

PARALLEL

标准SRAM

3.6 V

3 V

22 mm

14 mm

N/A

-

Compliant

70 °C

0 °C

4

19 b

18 Mb

无

N/A

-

Compliant

70 °C

0 °C

4

19 b

18 Mb

无

N/A

-

Compliant

85 °C

-40 °C

4

19 b

18 Mb

无

N/A

-

N/A

-

Compliant

85 °C

-40 °C

2

20 b

18 Mb

无

N/A

-

Compliant

85 °C

-40 °C

4

19 b

18 Mb

无

N/A

-

Non-Compliant

85 °C

-40 °C

2

19 b

9 Mb

无