品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | 无铅代码 | ECCN 代码 | 类型 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8342D06BGD-550 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Commercial grade | 550 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 550 MHz | + 70 C | 1.9 V | 0 to 85 °C | Bulk | GS8342D06BGD | SigmaQuad-II+ | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 940 mA | Pipelined | 4 M x 8 | 20 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T08BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 0 to 70 °C | 70 °C | 0 °C | 1.8 V | 1 | Pipelined | 20 Bit | 18 Mbit | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662S09BD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR | Industrial grade | 300 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 300 MHz | + 85 C | 1.9 V | -40 to 100 °C | Bulk | GS8662S09BD | SigmaSIO DDR-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 590 mA | Pipelined | 8 M x 9 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662S18BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | SigmaSIO DDR-II | DDR | 15 | Parallel | GSI技术 | GSI技术 | Compliant | 有 | 400 MHz | Bulk | GS8662S18BGD | SigmaSIO DDR-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 745 mA | 4 M x 18 | 21 b | SRAM | 72 Mb | 72 | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T07BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 0 to 85 °C | 85 °C | 0 °C | 1.8 V | 1 | Pipelined | 22 Bit | 72 Mbit | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662S09BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 400 MHz | + 70 C | 1.9 V | 0 to 85 °C | Bulk | GS8662S09BD | SigmaSIO DDR-II | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 735 mA | Pipelined | 8 M x 9 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832272GC-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | 0 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Commercial grade | 117.6@Flow-Through/150@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 150 MHz | + 70 C | 3.6 V | 0 to 70 °C | Tray | GS832272GC | SCD/DCD Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 36 Mbit | 8 | 210 mA, 260 mA | 8.5 ns | Flow-Through/Pipelined | 512 k x 72 | 19 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673ET36BGK-725IS | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-260 | YES | 260 | DDR | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 2000000 | PLASTIC/EPOXY | 未说明 | 有 | GS8673ET36BGK-725IS | 2097152 words | 1.35 V | HBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.74 | Compliant | 有 | 725 MHz | + 100 C | 1.4 V | - 40 C | 8 | 1.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-IIIe | Tray | GS8673ET36BGK | 3A991.B.2.B | SigmaDDR-IIIe B2 | 85 °C | -40 °C | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.35 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B260 | 72 Mbit | SYNCHRONOUS | 2.49 A | 2 M x 36 | 2.3 mm | 36 | SRAM | 72 Mb | 75497472 bit | PARALLEL | DDR SRAM | 1.4 V | 1.3 V | SRAM | 22 mm | 14 mm | 无 | ||||||||||||||||||||||||||||||||||
![]() | GS8321Z18AGD-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | LBGA, BGA165,11X15,40 | 有 | GS8321Z18AGD-200V | 活跃 | GSI TECHNOLOGY | BGA | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | 1.8, 2.5 V | 1.7, 2.3 V | 18 Bit | 2, 2.7 V | Compliant | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | SMD/SMT | 0 to 85 °C | Bulk | GS8321Z18AGD | 有 | NBT | 85 °C | 0 °C | Memory & Data Storage | 36 Mbit | 2 | 195 mA, 230 mA | 6.5@Flow-Through/3@P | 2 M x 18 | 21 b | SRAM | 36 Mb | 36 | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T07BD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 350 MHz | + 70 C | 1.9 V | 0 to 85 °C | Bulk | GS8662T07BD | SigmaDDR-II+ B2 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 590 mA | Pipelined | 8 M x 8 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T07BGD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Industrial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 450 MHz | + 85 C | 1.9 V | -40 to 100 °C | Tray | GS8662T07BGD | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 705 mA | Pipelined | 8 M x 8 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673ET36BGK-725S | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-260 | YES | 260 | SigmaDDR-IIIe | DDR | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 2000000 | PLASTIC/EPOXY | 未说明 | 85 °C | 有 | GS8673ET36BGK-725S | 2097152 words | 1.35 V | HBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.74 | Compliant | 有 | 725 MHz | + 85 C | 1.4 V | 0 C | 8 | 1.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | Tray | GS8673ET36BGK | 3A991.B.2.B | SigmaDDR-IIIe B2 | 70 °C | 0 °C | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.35 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B260 | OTHER | 72 Mbit | SYNCHRONOUS | 2.49 A | 2 M x 36 | 2.3 mm | 36 | SRAM | 72 Mb | 75497472 bit | PARALLEL | DDR SRAM | 1.4 V | 1.3 V | SRAM | 22 mm | 14 mm | 无 | ||||||||||||||||||||||||||||||||
![]() | GS8182T09BD-167I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 85 °C | -40 °C | 1.8 V | 1 | 20 b | 18 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z72C-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | - 40 C | 14 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Industrial grade | 133.3@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 72 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 200 MHz | + 85 C | 2.7 V | -40 to 85 °C | Tray | GS8322Z72C | NBT | 85 °C | -40 °C | Memory & Data Storage | 36 Mbit | 8 | 245 mA, 340 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 72 | 19 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT07BD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 450 MHz | + 70 C | 1.9 V | 0 to 85 °C | Bulk | GS8342TT07BD | SigmaDDR-II+ B2 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 1 | 670 mA | Pipelined | 4 M x 8 | 21 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D19E-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Industrial grade | 450 MHz | FBGA | QDR | 1.8000 V | Synchronous | 8 MWords | 18 Bit | 表面贴装 | Compliant | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | -40 to 100 °C | Bulk | GS81302D19E | SigmaQuad-II+ B4 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 1.185 A | Pipelined | 8 M x 18 | 21 Bit | SRAM | 144 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T07BGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Industrial grade | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 333 MHz | + 85 C | 1.9 V | -40 to 100 °C | Tray | GS8662T07BGD | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 545 mA | Pipelined | 8 M x 8 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T18BD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 70 °C | 0 °C | 1.8 V | 1 | 20 b | 18 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662S18BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | 333 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | -40 to 100 °C | GS8662S18BD | 100 °C | -40 °C | 1.8 V | 72 Mbit | 2 | 640 mA | Pipelined | 4 M x 18 | 21 Bit | 72 Mbit | Industrial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T08BD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | DDR | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 400 MHz | + 85 C | 1.9 V | -40 to 100 °C | Bulk | GS8662T08BD | SigmaDDR-II B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 635 mA | Pipelined | 8 M x 8 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T36BD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 70 °C | 0 °C | 1.8 V | 1 | 19 b | 18 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832032AGT-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 32 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 7.5 ns | 85 °C | 有 | GS832032AGT-150V | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.34 | QFP | Commercial grade | 133@Flow-Through/150@Pipelined MHz | TQFP | 0 to 85 °C | Tray | GS832032AGT | 3A991.B.2.B | 同步突发 | 85 °C | 0 °C | ALSO OPERTAES AT 2.5, SYNCHRONOUS BURST | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | OTHER | 36 Mbit | 4 | SYNCHRONOUS | 200 mA, 210 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 32 | 1.6 mm | 32 | 20 Bit | SRAM | 36 Mbit | 33554432 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | 无 | ||||||||||||
![]() | GS8322Z18AGD-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 70 C | SDR | Details | NBT SRAM | GSI技术 | GSI技术 | Parallel | SMD/SMT | 1.7 V | 14 | 0 C | 2.7 V | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 5.5 ns | 70 °C | 有 | GS8322Z18AGD-250V | 250 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.13 | BGA | Commercial grade | FBGA | 0 to 85 °C | Tray | GS8322Z18AGD | 3A991.B.2.B | NBT | 85 °C | 0 °C | ALSO OPERATED WITH 2.5V SUPPLY; PIPELINE/FLOW THROUGH ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.8/2.5 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 225 mA, 265 mA | 5.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 21 b | SRAM | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | ZBT SRAM | 1.7 V | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||
![]() | GS8662T09BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | - 40 C | 1.9 V | + 85 C | 400 MHz | 有 | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | Synchronous | 8 MWords | 9 Bit | 表面贴装 | DDR | Details | SigmaDDR-II | GSI技术 | GSI技术 | Parallel | SMD/SMT | 1.7 V | 15 | -40 to 100 °C | Tray | GS8662T09BGD | SigmaDDR-II B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 635 mA | Pipelined | 8 M x 9 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T20BD-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Commercial grade | 500 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 500 MHz | + 70 C | 1.9 V | 0 to 85 °C | Bulk | GS8662T20BD | SigmaQuad-II+ | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 760 mA | Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 |
GS8342D06BGD-550
GSI Technology
分类:Memory
GS8182T08BGD-400
GSI Technology
分类:Memory
GS8662S09BD-300I
GSI Technology
分类:Memory
GS8662S18BGD-400I
GSI Technology
分类:Memory
GS8662T07BGD-400
GSI Technology
分类:Memory
GS8662S09BD-400
GSI Technology
分类:Memory
GS832272GC-150
GSI Technology
分类:Memory
GS8673ET36BGK-725IS
GSI Technology
分类:Memory
GS8321Z18AGD-200V
GSI Technology
分类:Memory
GS8662T07BD-350
GSI Technology
分类:Memory
GS8662T07BGD-450I
GSI Technology
分类:Memory
GS8673ET36BGK-725S
GSI Technology
分类:Memory
GS8182T09BD-167I
GSI Technology
分类:Memory
GS8322Z72C-200IV
GSI Technology
分类:Memory
GS8342TT07BD-450
GSI Technology
分类:Memory
GS81302D19E-450I
GSI Technology
分类:Memory
GS8662T07BGD-333I
GSI Technology
分类:Memory
GS8182T18BD-250
GSI Technology
分类:Memory
GS8662S18BD-333I
GSI Technology
分类:Memory
GS8662T08BD-400I
GSI Technology
分类:Memory
GS8182T36BD-300
GSI Technology
分类:Memory
GS832032AGT-150V
GSI Technology
分类:Memory
GS8322Z18AGD-250V
GSI Technology
分类:Memory
GS8662T09BGD-400I
GSI Technology
分类:Memory
GS8662T20BD-500
GSI Technology
分类:Memory
