GSI Technology GS832272GC-150

包装/外壳

BGA-209

引脚数

209

Maximum Clock Rate

117.6@Flow-Through/150@Pipelined MHz

Supplier Package

FBGA

Data Rate Architecture

SDR

Typical Operating Supply Voltage

2.5, 3.3 V

Minimum Operating Supply Voltage

2.3, 3 V

Timing Type

Synchronous

Number of Words

512 kWords

Number of I/O Lines

72 Bit

Maximum Operating Supply Voltage

2.7, 3.6 V

Mounting

表面贴装

RoHS

Compliant

Moisture Sensitive

有

Maximum Clock Frequency

150 MHz

Maximum Operating Temperature

+ 70 C

Supply Voltage-Max

3.6 V

Minimum Operating Temperature

0 C

Factory Pack QuantityFactory Pack Quantity

14

Supply Voltage-Min

2.3 V

Mounting Styles

SMD/SMT

Interface Type

Parallel

Manufacturer

GSI技术

Brand

GSI技术

Tradename

SyncBurst

Memory Types

SDR

Usage Level

Commercial grade

操作温度

0 to 70 °C

系列

GS832272GC

包装

Tray

类型

SCD/DCD Pipeline/Flow Through

最高工作温度

70 °C

最小工作温度

0 °C

子类别

Memory & Data Storage

内存大小

36 Mbit

端口的数量

8

电源电流-最大值

210 mA, 260 mA

访问时间

8.5 ns

建筑学

Flow-Through/Pipelined

组织结构

512 k x 72

地址总线宽度

19 Bit

产品类别

SRAM

密度

36 Mbit

筛选水平

Commercial

产品类别

SRAM

辐射硬化

无