品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | GS832218AGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 250@Flow-Through/400@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 400 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | -40 to 100 °C | Tray | GS832218AGD | Pipeline/Flow Through | 100 °C | -40 °C | Memory & Data Storage | 36 Mbit | 2 | 285 mA, 375 mA | 4 ns | Flow-Through/Pipelined | 2 M x 18 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D20BD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | 400 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 400 MHz | -40 to 100 °C | Bulk | 100 °C | -40 °C | 1.8 V | 72 Mbit | 2 | 745 mA | Pipelined | 4 M x 18 | 20 Bit | 72 Mbit | Industrial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D08BD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Compliant | Industrial grade | 350 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8662D08BD | SigmaQuad-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 705 mA | Pipelined | 8 M x 8 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q18BD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | N | DDR | Commercial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662Q18BD | SigmaQuad-II | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 850 mA | Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321Z18AGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 333 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | -40 to 100 °C | Bulk | GS8321Z18AGD | 100 °C | -40 °C | 36 Mbit | 2 | 255 mA, 340 mA | 4.5 ns | Flow-Through/Pipelined | 2 M x 18 | 21 Bit | 36 Mbit | Industrial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS840H36AB-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 119 | 119 | 5.21 | BGA | Compliant | BGA, BGA119,7X17,50 | 网格排列 | 3 | 128000 | PLASTIC/EPOXY | BGA119,7X17,50 | -40 °C | 未说明 | 10 ns | 85 °C | 无 | GS840H36AB-150I | 150 MHz | 131072 words | 3.3 V | BGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | 3.3 V | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 2.5/3.3,3.3 V | INDUSTRIAL | 4 | SYNCHRONOUS | 0.29 mA | 128KX36 | 3-STATE | 2.19 mm | 36 | 17 b | 4.5 Mb | 0.03 A | 4.5 | PARALLEL | COMMON | 缓存SRAM | 3.14 V | 3.6 V | 3 V | 22 mm | 14 mm | 无 | |||||||||||||||||||||||||||||||||||
![]() | GS8662T36BGD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | Details | DDR | Industrial grade | 250 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8662T36BGD | SigmaDDR-II B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 630 mA | Pipelined | 2 M x 36 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342DT38BD-550I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | 550 MHz | FBGA | 1.8000 V | 1.7 V | 36 Bit | 1.9 V | Compliant | 550 MHz | + 85 C | 1.9 V | - 40 C | -40 to 100 °C | Bulk | 100 °C | -40 °C | 1.8 V | 36 Mbit | 2 | 1.235 A | 0.45 | 1 M x 36 | 18 b | 36 Mb | 36 | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88132CGD-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 32 Bit | 2, 2.7 V | 表面贴装 | Compliant | 150 MHz | + 70 C | 2.7 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 133.3@Flow-Through/150@Pipelined MHz | 0 to 70 °C | 70 °C | 0 °C | 9 Mbit | 1 | 110 mA, 125 mA | 7.5 ns | Flow-Through/Pipelined | 256 k x 32 | 18 Bit | 9 Mbit | Commercial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z36AGD-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Industrial grade | 200@Flow-Through/333@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 333 MHz | + 85 C | 2.7 V | - 40 C | 14 | 1.7 V | -40 to 100 °C | Tray | GS8322Z36AGD | NBT | 100 °C | -40 °C | Memory & Data Storage | 36 Mbit | 4 | 290 mA, 375 mA | 5 ns | Flow-Through/Pipelined | 1 M x 36 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT06BD-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | 165 | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Compliant | , | 无 | GS8342TT06BD-500I | 活跃 | GSI TECHNOLOGY | 5.88 | Industrial grade | 500 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | -40 to 100 °C | Tray | GS8342TT06BD | SigmaQuad-II+ | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | compliant | 36 Mbit | 1 | 740 mA | Pipelined | 4 M x 8 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302Q37GE-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | QDR-II | Industrial grade | 200 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 36 Bit | 1.9 V | 有 | 200 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | -40 to 100 °C | Tray | GS81302Q37GE | SigmaQuad-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 940 mA | 0.45 | 4 M x 36 | 21 b | SRAM | 144 Mb | 144 | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS82582DT38GE-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | 8 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 有 | GS82582DT38GE-400I | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.59 | Industrial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | -40 to 100 °C | Tray | GS82582DT38GE | 3A991.B.2.B | SigmaQuad-II+ | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 288 Mbit | 2 | SYNCHRONOUS | 1.01 A | Pipelined | 8 M x 36 | 1.5 mm | 36 | 21 Bit | SRAM | 288 Mbit | 301989888 bit | Industrial | PARALLEL | 标准SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | |||||||||||||||||||||||||
![]() | GS8640FZ18GT-7.5I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | 4 MWords | 18 Bit | 表面贴装 | 有 | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 3 | 4000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 7.5 ns | 85 °C | 有 | GS8640FZ18GT-7.5I | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.38 | QFP | Industrial grade | 133.3 MHz | TQFP | SDR | 3.3000 V | Synchronous | -40 to 85 °C | Tray | GS8640FZ18GT | e3 | 有 | 3A991.B.2.B | NBT Flow Through | Matte Tin (Sn) | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY. | 8542.32.00.41 | Memory & Data Storage | CMOS | 3.3 V | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 225 mA | 7.5 ns | Flow-Through | 4 M x 18 | 1.6 mm | 18 | 22 Bit | SRAM | 72 Mb | 75497472 bit | Industrial | PARALLEL | ZBT SRAM | 2.75 V | 2.25 V | SRAM | 20 mm | 14 mm | 无 | ||||||||||||
![]() | GS8662T36BGD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | Details | DDR | Commercial grade | 250 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 250 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662T36BGD | SigmaDDR-II B2 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 620 mA | Pipelined | 2 M x 36 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832236AGB-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | 1.8, 2.5 V | 1.7, 2.3 V | 36 Bit | 2, 2.7 V | Compliant | 250 MHz | + 85 C | -40 to 100 °C | Bulk | 100 °C | -40 °C | 36 Mbit | 4 | 260 mA, 315 mA | 5.5@Flow-Through/3@P | 1 M x 36 | 20 b | 36 Mb | 36 | Industrial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816236DGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 222.2@Flow-Through/333@Pipelined MHz | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 36 Bit | 2.7, 3.6 V | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | 0 to 85 °C | Tray | GS816236DGD | Pipeline/Flow Through | 85 °C | 0 °C | Memory & Data Storage | 18 Mbit | 4 | 260 mA, 315 mA | 4.5@Flow-Through/2.5 | 512 k x 36 | 19 Bit | SRAM | 18 Mb | 18 | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT38BGD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Industrial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8662TT38BGD | SigmaQuad-II+ | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 910 mA | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88236CB-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | Commercial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 42 | 2.3 V | 0 to 70 °C | Tray | GS88236CB | Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 9 Mbit | 4 | 180 mA, 240 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8640E18GT-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 153.8@Flow-Through/250@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 4 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | -40 to 85 °C | Tray | GS8640E18GT | Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | 72 Mbit | 2 | 250 mA, 335 mA | 6.5 ns | Flow-Through/Pipelined | 4 M x 18 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT37E-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaQuad-II+ | N | QDR-II | Commercial grade | 350 MHz | FBGA | QDR | 1.8000 V | Synchronous | 4 MWords | 36 Bit | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | 0 to 85 °C | Tray | GS81302DT37E | SigmaQuad-II+ B4 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 114 Mbit | 2 | 1.055 A | Pipelined | 4 M x 36 | 20 Bit | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E36CGD-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | -40 to 85 °C | Tray | GS881E36CGD | DCD Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | 9 Mbit | 4 | 160 mA, 200 mA | 5.5 ns | Flow-Through/Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182R18BGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 85 °C | -40 °C | 1.8 V | 1 | 20 b | 18 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z18AB-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Compliant | BGA, BGA119,7X17,50 | 网格排列 | 2000000 | PLASTIC/EPOXY | BGA119,7X17,50 | -40 °C | 未说明 | 4.5 ns | 85 °C | 无 | GS8322Z18AB-333I | 333 MHz | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.13 | BGA | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | -40 to 100 °C | Tray | GS8322Z18AB | e0 | 无 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 255 mA, 340 mA | 4.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.99 mm | 18 | 21 Bit | SRAM | 36 Mb | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | 无 | ||||
![]() | GS8342D20BD-550 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 0.45 ns | 70 °C | 无 | GS8342D20BD-550 | 550 MHz | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.35 | BGA | 550 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 550 MHz | FBGA | QDR | 1.8000 V | Synchronous | 2 MWords | 18 Bit | 表面贴装 | Compliant | LBGA, BGA165,11X15,40 | 0 to 85 °C | Bulk | GS8342D20BD | 3A991.B.2.B | 85 °C | 0 °C | 流水线结构 | 8542.32.00.41 | SRAMs | CMOS | 1.8 V | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 0.94 mA | Pipelined | 4MX18 | 3-STATE | 1.4 mm | 18 | 19 Bit | 36 Mbit | 0.265 A | 75497472 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | 15 mm | 13 mm | 无 |
GS832218AGD-400I
GSI Technology
分类:Memory
GS8662D20BD-400I
GSI Technology
分类:Memory
GS8662D08BD-350I
GSI Technology
分类:Memory
GS8662Q18BD-300
GSI Technology
分类:Memory
GS8321Z18AGD-333I
GSI Technology
分类:Memory
GS840H36AB-150I
GSI Technology
分类:Memory
GS8662T36BGD-250I
GSI Technology
分类:Memory
GS8342DT38BD-550I
GSI Technology
分类:Memory
GS88132CGD-150V
GSI Technology
分类:Memory
GS8322Z36AGD-333IV
GSI Technology
分类:Memory
GS8342TT06BD-500I
GSI Technology
分类:Memory
GS81302Q37GE-200I
GSI Technology
分类:Memory
GS82582DT38GE-400I
GSI Technology
分类:Memory
GS8640FZ18GT-7.5I
GSI Technology
分类:Memory
GS8662T36BGD-250
GSI Technology
分类:Memory
GS832236AGB-250IV
GSI Technology
分类:Memory
GS816236DGD-333
GSI Technology
分类:Memory
GS8662TT38BGD-450I
GSI Technology
分类:Memory
GS88236CB-333
GSI Technology
分类:Memory
GS8640E18GT-250I
GSI Technology
分类:Memory
GS81302DT37E-350
GSI Technology
分类:Memory
GS881E36CGD-250IV
GSI Technology
分类:Memory
GS8182R18BGD-333I
GSI Technology
分类:Memory
GS8322Z18AB-333I
GSI Technology
分类:Memory
GS8342D20BD-550
GSI Technology
分类:Memory
