品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8322Z72C-166IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-209 | YES | 209 | 209 | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 72 Bit | 2, 2.7 V | 表面贴装 | 有 | 166 MHz | + 85 C | 2.7 V | - 40 C | 14 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Compliant | LBGA, | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 8 ns | 85 °C | 无 | GS8322Z72C-166IV | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | Industrial grade | 125@Flow-Through/166@Pipelined MHz | FBGA | SDR | -40 to 85 °C | Tray | GS8322Z72C | 无 | 3A991.B.2.B | NBT | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B209 | 不合格 | INDUSTRIAL | 36 Mbit | 8 | SYNCHRONOUS | 235 mA, 300 mA | 8 ns | Flow-Through/Pipelined | 512 k x 72 | 1.7 mm | 72 | 19 Bit | SRAM | 36 Mbit | 37748736 bit | Industrial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | 无 | |||||||||||||
![]() | GS8662S08BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaSIO DDR-II | DDR | Compliant | Industrial grade | 333 MHz | FBGA | DDR | 1.8000 V | Synchronous | 8 MWords | 8 Bit | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | -40 to 100 °C | Tray | GS8662S08BD | SigmaSIO DDR-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 640 mA | Pipelined | 8 M x 8 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816118DGD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 375 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | 0 to 70 °C | Tray | GS816118DGD | Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 18 Mbit | 2 | 250 mA, 320 mA | 4.2 ns | Flow-Through/Pipelined | 1 M x 18 | 20 b | SRAM | 18 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS840H32AGT-180I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 100 | 100 | 5.35 | QFP | Compliant | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 128000 | PLASTIC/EPOXY | QFP100,.63X.87 | -40 °C | 未说明 | 8 ns | 85 °C | 有 | GS840H32AGT-180I | 180 MHz | 131072 words | 3.3 V | LQFP | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | e3 | 有 | 3A991.B.2.B | 纯哑光锡 | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | 3.3 V | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3,3.3 V | INDUSTRIAL | 4 | SYNCHRONOUS | 0.345 mA | 128KX32 | 3-STATE | 1.6 mm | 32 | 17 b | 4 Mb | 0.03 A | 4194304 bit | PARALLEL | COMMON | 缓存SRAM | 3.14 V | 3.6 V | 3 V | 20 mm | 14 mm | 无 | |||||||||||||||||||||||||||||||||||
![]() | GS8662T20BGD-550I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 4 MWords | 18 Bit | 表面贴装 | Compliant | 550 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 550 MHz | FBGA | DDR | 1.8000 V | Synchronous | -40 to 100 °C | 100 °C | -40 °C | 1.8 V | 72 Mbit | 1 | 840 mA | Pipelined | 4 M x 18 | 21 Bit | 72 Mbit | Industrial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T37BGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8662T37BGD-300I | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.44 | BGA | Industrial grade | 300 MHz | FBGA | DDR | -40 to 100 °C | Tray | GS8662T37BGD | 3A991.B.2.B | SigmaDDR-II+ B2 | 100 °C | -40 °C | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 72 Mbit | 1 | SYNCHRONOUS | 635 mA | Pipelined | 2 M x 36 | 1.4 mm | 36 | 20 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||
![]() | GS832036AGT-333V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | Synchronous | 1.7, 2.3 V | 1.8, 2.5 V | SDR | TQFP | 200@Flow-Through/333@Pipelined MHz | 有 | 333 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 5 ns | 85 °C | 有 | GS832036AGT-333V | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.7 | QFP | Commercial grade | 表面贴装 | 2, 2.7 V | 36 Bit | 1 MWords | 0 to 85 °C | Tray | GS832036AGT | 3A991.B.2.B | 同步突发 | 85 °C | 0 °C | ALSO OPERTAES AT 2.5, SYNCHRONOUS BURST | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | OTHER | 36 Mbit | 4 | SYNCHRONOUS | 270 mA, 355 mA | 5 ns | Flow-Through/Pipelined | 1 M x 36 | 1.6 mm | 36 | 20 Bit | SRAM | 36 Mbit | 37748736 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | 无 | ||||||||||||||||
![]() | GS8342D08BD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 8 Bit | 1.9 V | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Compliant | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 0.45 ns | 85 °C | 无 | GS8342D08BD-400I | 400 MHz | 4194304 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.35 | BGA | 400 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | -40 to 100 °C | Tray | GS8342D08BD | 3A991.B.2.B | SigmaQuad-II | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 715 mA | 0.45 | 4 M x 8 | 3-STATE | 1.4 mm | 8 | 20 b | SRAM | 36 Mb | 0.235 A | 36 | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||
![]() | GS8182T37BD-435 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 165 | 165 | 70 °C | 无 | GS8182T37BD-435 | 435 MHz | 524288 words | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.47 | BGA | Commercial grade | 435 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 36 Bit | 1.9 V | Compliant | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 0 to 70 °C | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 流水线结构 | 8542.32.00.41 | SRAMs | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | not_compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 1 | SYNCHRONOUS | 0.75 mA | 0.45 | 512KX36 | 3-STATE | 1.4 mm | 36 | 18 b | 18 Mb | 0.19 A | 18 | Commercial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | 15 mm | 13 mm | 无 | ||||||||||||||||||||||||||
![]() | GS81302S08E-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaSIO DDR-II | DDR-II | Compliant | Industrial grade | 300 MHz | FBGA | DDR | 1.8000 V | Synchronous | 16 MWords | 8 Bit | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | -40 to 100 °C | Tray | GS81302S08E | SigmaSIO DDR-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 825 mA | Pipelined | 16 M x 8 | 23 b | SRAM | 144 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182S36BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | Details | DDR | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 512 kWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 18 | 1.7 V | 0 to 70 °C | Tray | GS8182S36BGD | SigmaSIO DDR-II | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | 18 Mbit | 2 | 905 mA | Pipelined | 512 k x 36 | 18 Bit | SRAM | 18 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q09BD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | N | DDR | Commercial grade | 200 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 200 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662Q09BD | SigmaQuad-II | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 600 mA | Pipelined | 8 M x 9 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302S09GE-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | Details | DDR-II | Commercial grade | 250 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 250 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302S09GE | SigmaSIO DDR-II | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 700 mA | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS880Z36CGT-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Commercial grade | 222.2@Flow-Through/333@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | 0 to 70 °C | Tray | GS880Z36CGT | NBT | 70 °C | 0 °C | Memory & Data Storage | 9 Mbit | 1 | 180 mA, 240 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT19GE-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | Industrial grade | 350 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | -40 to 100 °C | Tray | GS81302DT19GE | SigmaQuad-II+ B4 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 950 mA | Pipelined | 8 M x 18 | 21 Bit | SRAM | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT10BGD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342TT10BGD | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 1 | 575 mA | Pipelined | 4 M x 9 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D20BD-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | DDR | Commercial grade | 500 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662D20BD | SigmaQuad-II+ | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 890 mA | Pipelined | 4 M x 18 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88218CD-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 2, 2.7 V | 表面贴装 | Compliant | 150 MHz | + 85 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 7.5 ns | 85 °C | 无 | GS88218CD-150IV | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.13 | BGA | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | -40 to 85 °C | GS88218CD | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 9 Mbit | 2 | SYNCHRONOUS | 125 mA, 135 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 18 | 1.4 mm | 18 | 18 Bit | 9 Mbit | 9437184 bit | Industrial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | 15 mm | 13 mm | 无 | |||||||||||||||||||||
![]() | GS8182R18BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 70 °C | 0 °C | 1.8 V | 1 | 20 b | 18 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T36BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | DDR | Details | SigmaDDR-II | GSI技术 | GSI技术 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 有 | GS8662T36BGD-333 | 333 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.2 | BGA | Commercial grade | 333 MHz | 0 to 85 °C | Tray | GS8662T36BGD | e1 | 有 | 3A991.B.2.B | SigmaDDR-II B2 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 72 Mbit | 1 | SYNCHRONOUS | 685 mA | Pipelined | 2 M x 36 | 3-STATE | 1.4 mm | 36 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||
![]() | GS8662S36BD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 15 | - 40 C | 1.9 V | + 85 C | 400 MHz | 有 | Compliant | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | DDR | SigmaSIO DDR-II | GSI技术 | GSI技术 | Parallel | SMD/SMT | 1.7 V | -40 to 100 °C | Tray | GS8662S36BD | SigmaSIO DDR-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 950 mA | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88218CGD-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 70 C | 2.7 V | 0 C | 66 | 1.7 V | 0 to 70 °C | Tray | GS88218CGD | SCD/DCD Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 9 Mbit | 2 | 105 mA, 115 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E32CD-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Compliant | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 32 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | -40 to 85 °C | Tray | GS881E32CD | DCD Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | 9 Mbit | 4 | 160 mA, 200 mA | 5.5 ns | Flow-Through/Pipelined | 256 k x 32 | 18 Bit | SRAM | 8 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662DT07BGD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaQuad-II+ | Details | DDR | Commercial grade | 450 MHz | FBGA | QDR | 1.8000 V | Synchronous | 8 MWords | 8 Bit | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | 0 to 85 °C | Tray | GS8662DT07BGD | SigmaQuad-II+ B4 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 820 mA | Pipelined | 8 M x 8 | 21 b | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT10GE-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 333 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 333 MHz | FBGA | QDR | -40 to 100 °C | 144 Mbit | 2 | 900 mA | Pipelined | 16 M x 9 | 22 Bit | 144 Mbit | Industrial |
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