品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS81302Q19E-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | QDR-II | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 无 | GS81302Q19E-300 | 1.8 V | LBGA | RECTANGULAR | 不推荐 | GSI TECHNOLOGY | 5.33 | BGA | Commercial grade | 300 MHz | FBGA | QDR | 1.8000 V | 0 to 85 °C | Tray | GS81302Q19E | 无 | 3A991.B.2.B | SigmaQuad-II+ B2 | 85 °C | 0 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 144 Mbit | 2 | SYNCHRONOUS | 1.25 A | Pipelined | 8 M x 18 | 1.5 mm | 18 | 22 Bit | SRAM | 144 Mbit | 150994944 bit | Commercial | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | 无 | ||||||||||||||
![]() | GS832218AB-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 375 MHz | + 85 C | 3.6 V | - 40 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | BGA, BGA119,7X17,50 | 网格排列 | 2000000 | PLASTIC/EPOXY | BGA119,7X17,50 | -40 °C | 未说明 | 4.2 ns | 85 °C | 无 | GS832218AB-375I | 375 MHz | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.11 | BGA | Industrial grade | 238@Flow-Through/375@Pipelined MHz | FBGA | -40 to 100 °C | Tray | GS832218AB | e0 | 无 | 3A991.B.2.B | Pipeline/Flow Through | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 270 mA, 370 mA | 4.2 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.99 mm | 18 | 21 Bit | SRAM | 36 Mb | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | ||||||||
![]() | GS8322Z18AB-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | GSI技术 | RECTANGULAR | BGA | 1.8 V | 2097152 words | 333 MHz | GS8322Z18AB-333IV | 无 | 85 °C | 5 ns | -40 °C | BGA119,7X17,50 | PLASTIC/EPOXY | 2000000 | 网格排列 | BGA, BGA119,7X17,50 | 333 MHz | + 85 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | 200@Flow-Through/333@Pipelined MHz | FBGA | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 18 Bit | 2, 2.7 V | BGA | 5.27 | GSI TECHNOLOGY | 活跃 | -40 to 100 °C | GS8322Z18AB | 3A991.B.2.B | ALSO OPERATED WITH 2.5V SUPPLY; PIPELINE/FLOW THROUGH ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 1.8/2.5 V | INDUSTRIAL | 36 Mbit | SYNCHRONOUS | 0.275 mA | 5@Flow-Through/3@Pip | 2MX18 | 3-STATE | 1.99 mm | 18 | 0.04 A | 36 | PARALLEL | COMMON | ZBT SRAM | 1.7 V | 2 V | 1.7 V | 22 mm | 14 mm | ||||||||||||||||||||||||||||||
![]() | GS88136CGT-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 256000 | UNSPECIFIED | 未说明 | 70 °C | 有 | GS88136CGT-333 | 3.3 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.28 | QFP | Commercial grade | 222.2@Flow-Through/333@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | 0 to 70 °C | Tray | GS88136CGT | 3A991.B.2.B | Pipeline/Flow Through | ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY, FLOW THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-XQFP-G100 | 不合格 | COMMERCIAL | 9 Mbit | 1 | SYNCHRONOUS | 180 mA, 240 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 36 | 1.6 mm | 36 | 17 Bit | SRAM | 9 Mbit | 9437184 bit | Commercial | SERIAL | 缓存SRAM | 3.6 V | 3 V | SRAM | 20 mm | 14 mm | |||||||||||||||||||
![]() | GS8662T18BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | N | DDR-II | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662T18BD | SigmaDDR-II B2 | Memory & Data Storage | 72 Mbit | 1 | 625 mA | Pipelined | 4 M x 18 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS840H18AGT-100I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 100 | 100 | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | QFP100,.63X.87 | -40 °C | 未说明 | 12 ns | 85 °C | 有 | GS840H18AGT-100I | 100 MHz | 262144 words | 3.3 V | LQFP | RECTANGULAR | GSI技术 | Obsolete | GSI TECHNOLOGY | 5.7 | QFP | e3 | 有 | 3A991.B.2.B | 纯哑光锡 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3,3.3 V | INDUSTRIAL | SYNCHRONOUS | 0.2 mA | 256KX18 | 3-STATE | 1.6 mm | 18 | 0.03 A | 4718592 bit | PARALLEL | COMMON | 缓存SRAM | 3.14 V | 3.6 V | 3 V | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T07E-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 300 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 300 MHz | FBGA | DDR | -40 to 100 °C | 144 Mbit | 1 | 700 mA | Pipelined | 16 M x 8 | 23 Bit | 144 Mbit | Industrial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8162Z72CC-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-209 | YES | 209 | 209 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 21 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 4.5 ns | 85 °C | 无 | GS8162Z72CC-333I | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.17 | BGA | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | SDR | -40 to 85 °C | Tray | GS8162Z72CC | 无 | 3A991.B.2.B | NBT Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B209 | 不合格 | INDUSTRIAL | 18 Mbit | 8 | SYNCHRONOUS | 330 mA, 470 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 72 | 1.7 mm | 72 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | ||||||||||||||||
![]() | GS8342QT19BGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8342QT19BGD-300I | 300 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | Industrial grade | -40 to 100 °C | Tray | GS8342QT19BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II+ B2 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 785 mA | Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 20 Bit | SRAM | 36 Mbit | 37748736 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||
![]() | GS8342DT20BGD-550 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Commercial grade | 550 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 550 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342DT20BGD | SigmaQuad-II+ | Memory & Data Storage | 36 Mbit | 2 | 940 mA | Pipelined | 2 M x 18 | 19 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS880F36CGT-7.5V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 133.3 MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | + 70 C | 2.7 V | 0 C | 66 | 1.7 V | SMD/SMT | Parallel | 0 to 70 °C | Tray | GS880F36CGT | 流过 | Memory & Data Storage | 9 Mbit | 4 | 110 mA | 7.5 ns | Flow-Through | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342Q07BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaQuad-II+ | Details | DDR | Commercial grade | 333 MHz | FBGA | QDR | 1.8000 V | Synchronous | 4 MWords | 8 Bit | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | 0 to 85 °C | Tray | GS8342Q07BGD | SigmaQuad-II+ B2 | Memory & Data Storage | 36 Mbit | 2 | 885 mA | Pipelined | 4 M x 8 | 21 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832018AGT-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 400 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 2000000 | PLASTIC/EPOXY | 未说明 | 4 ns | 85 °C | 有 | GS832018AGT-400 | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.34 | QFP | Commercial grade | 250@Flow-Through/400@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 0 to 85 °C | Tray | GS832018AGT | 3A991.B.2.B | Pipeline/Flow Through | ALSO OPERATES AT 3.3; SYNCHRONOUS BURST | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | OTHER | 36 Mbit | 2 | SYNCHRONOUS | 265 mA, 355 mA | 4 ns | Flow-Through/Pipelined | 2 M x 18 | 1.6 mm | 18 | 21 Bit | SRAM | 36 Mbit | 37748736 bit | Commercial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | |||||||||||||||||||
![]() | GS832272GC-166 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 166 MHz | + 70 C | 3.6 V | 0 C | 14 | 2.3 V | SMD/SMT | Parallel | 0 to 70 °C | Tray | GS832272GC | SCD/DCD Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 8 | 225 mA, 280 mA | 8 ns | Flow-Through/Pipelined | 512 k x 72 | SRAM | 36 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816236DGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 400 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 4 ns | 85 °C | 有 | GS816236DGD-400I | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.25 | BGA | Industrial grade | 250@Flow-Through/400@Pipelined MHz | FBGA | SDR | -40 to 100 °C | Tray | GS816236DGD | 3A991.B.2.B | Pipeline/Flow Through | ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | INDUSTRIAL | 18 Mbit | 4 | SYNCHRONOUS | 300 mA, 385 mA | 4 ns | Flow-Through/Pipelined | 512 k x 36 | 1.4 mm | 36 | 19 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | ||||||||||||||||||
![]() | GS8321E36AD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 36 Bit | 2.7, 3.6 V | 表面贴装 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 4 ns | 85 °C | 无 | GS8321E36AD-400I | 400 MHz | 2.5 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.31 | BGA | 400 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | Industrial grade | 250@Flow-Through/400@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | -40 to 100 °C | GS8321E36AD | e0 | 无 | 3A991.B.2.B | 锡铅 | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | SRAMs | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 36 Mbit | 4 | SYNCHRONOUS | 0.37 mA | 4 ns | Flow-Through/Pipelined | 1MX36 | 3-STATE | 1.4 mm | 36 | 20 Bit | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | 15 mm | 13 mm | ||||||||||||||||||
![]() | GS8321E18AD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | Commercial grade | 250@Flow-Through/400@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 400 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | 0 to 85 °C | Tray | GS8321E18AD | DCD Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 2 | 265 mA, 355 mA | 4 ns | Flow-Through/Pipelined | 2 M x 18 | 21 Bit | SRAM | 36 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT19BD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662TT19BD | SigmaDDR-II+ B2 | Memory & Data Storage | 72 Mbit | 1 | 695 mA | Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS842Z18CB-200M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | 200 MHz | FBGA | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 18 Bit | 2.7, 3.6 V | 有 | 200 MHz | + 125 C | 3.6 V | - 55 C | 84 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | -55 to 125 °C | Tray | GS842Z18CB | NBT Pipeline/Flow Through | Memory & Data Storage | 4 Mbit | 6.5 | 256 k x 18 | SRAM | 4 | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T08BD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | N | DDR | Commercial grade | 300 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662T08BD | SigmaDDR-II B2 | Memory & Data Storage | 72 Mbit | 1 | 495 mA | Pipelined | 8 M x 8 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864032GT-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 153.8@Flow-Through/250@Pipelined MHz | TQFP | SDR | 3.3000 V | 3 V | Synchronous | 2 MWords | 32 Bit | 3.6 V | 表面贴装 | 有 | 250 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | 0 to 70 °C | Tray | GS864032GT | Pipeline/Flow Through | Memory & Data Storage | 72 Mbit | 4 | 255 mA, 360 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 32 | 21 Bit | SRAM | 64 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816136DD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | Commercial grade | 238@Flow-Through/375@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 375 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | 0 to 70 °C | Tray | GS816136DD | Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 4 | 270 mA, 350 mA | 4.2 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | SRAM | 18 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864032GT-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 300 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 5.5 ns | 85 °C | 有 | GS864032GT-300I | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.38 | QFP | Industrial grade | 181.8@Flow-Through/300@Pipelined MHz | TQFP | -40 to 85 °C | Tray | GS864032GT | e3 | 有 | 3A991.B.2.B | Pipeline/Flow Through | 纯哑光锡 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | INDUSTRIAL | 72 Mbit | 4 | SYNCHRONOUS | 320 mA, 440 mA | 5.5 ns | Flow-Through/Pipelined | 2 M x 32 | 1.6 mm | 32 | 21 Bit | SRAM | 64 Mbit | 67108864 bit | Industrial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | |||||||||||||
![]() | GS88118CD-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | SMD/SMT | -40 to 85 °C | Tray | GS88118CD | 同步突发 | Memory & Data Storage | 9 Mbit | 1 | 125 mA, 135 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 Bit | SRAM | 9 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT37GE-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | Industrial grade | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | -40 to 100 °C | Tray | GS81302DT37GE | SigmaQuad-II+ B4 | Memory & Data Storage | 144 Mbit | 2 | 1.01 A | Pipelined | 4 M x 36 | 20 Bit | SRAM | 144 Mbit | Industrial | SRAM |
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