品牌是'GSI' (10000)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

工厂交货时间

包装/外壳

表面安装

终端数量

操作温度

包装

系列

JESD-609代码

无铅代码

ECCN 代码

类型

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

子类别

技术

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

引脚数量

JESD-30代码

资历状况

工作电源电压

电源电压-最大值(Vsup)

电源

温度等级

电源电压-最小值(Vsup)

内存大小

端口的数量

操作模式

电源电流-最大值

访问时间

数据率

建筑学

组织结构

输出特性

座位高度-最大

内存宽度

地址总线宽度

产品类别

密度

待机电流-最大值

记忆密度

筛选水平

并行/串行

I/O类型

内存IC类型

待机电压-最小值

产品类别

长度

宽度

辐射硬化

GS8342TT10BGD-450I
GS8342TT10BGD-450I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaDDR-II+

Details

DDR

Industrial grade

450 MHz

FBGA

DDR

1.8000 V

1.7 V

Synchronous

4 MWords

9 Bit

1.9 V

表面贴装

450 MHz

+ 85 C

1.9 V

- 40 C

15

1.7 V

-40 to 100 °C

Tray

GS8342TT10BGD

SigmaDDR-II+ B2

100 °C

-40 °C

Memory & Data Storage

165

1.8 V

36 Mbit

1

680 mA

Pipelined

4 M x 9

21 Bit

SRAM

36 Mbit

Industrial

SRAM

GS74116AGP-10T
GS74116AGP-10T
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

6 Weeks

YES

44

TSOP2, TSOP44,.46,32

SMALL OUTLINE, THIN PROFILE

3

256000

PLASTIC/EPOXY

TSOP44,.46,32

未说明

10 ns

70 °C

GS74116AGP-10T

262144 words

3.3 V

TSOP2

RECTANGULAR

GSI技术

活跃

GSI TECHNOLOGY

5.16

TSOP2

Compliant

3A991.B.2.B

Pure Matte Tin (Sn)

8542.32.00.41

SRAMs

CMOS

DUAL

鸥翼

260

1

0.8 mm

compliant

44

R-PDSO-G44

不合格

3.6 V

3.3 V

COMMERCIAL

3 V

ASYNCHRONOUS

0.105 mA

256KX16

3-STATE

1.2 mm

16

0.01 A

4194304 bit

PARALLEL

COMMON

标准SRAM

3 V

18.41 mm

10.16 mm

GS8662T08BGD-333
GS8662T08BGD-333
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

1.7 V

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaDDR-II

DDR

Commercial grade

333 MHz

FBGA

DDR

1.8000 V

1.7 V

Synchronous

8 MWords

8 Bit

1.9 V

表面贴装

Compliant

333 MHz

+ 70 C

1.9 V

0 C

15

0 to 85 °C

Tray

GS8662T08BGD

SigmaDDR-II B2

85 °C

0 °C

Memory & Data Storage

165

1.8 V

72 Mbit

1

535 mA

Pipelined

8 M x 8

22 Bit

SRAM

72 Mbit

Commercial

SRAM

GS8182T09BGD-167I
GS8182T09BGD-167I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Compliant

85 °C

-40 °C

1.8 V

1

20 b

18 Mb

GS832118AD-333I
GS832118AD-333I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

FBGA

SDR

2.5, 3.3 V

2.3, 3 V

Synchronous

2 MWords

18 Bit

2.7, 3.6 V

表面贴装

Compliant

333 MHz

+ 85 C

3.6 V

- 40 C

2.3 V

SMD/SMT

Parallel

Industrial grade

222.2@Flow-Through/333@Pipelined MHz

-40 to 100 °C

Bulk

100 °C

-40 °C

165

36 Mbit

2

255 mA, 340 mA

4.5 ns

Flow-Through/Pipelined

2 M x 18

21 Bit

36 Mbit

Industrial

GS8662T10BGD-333I
GS8662T10BGD-333I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaDDR-II+

Details

DDR

Industrial grade

333 MHz

FBGA

DDR

1.8000 V

1.7 V

Synchronous

8 MWords

9 Bit

1.9 V

表面贴装

333 MHz

+ 85 C

1.9 V

- 40 C

15

1.7 V

-40 to 100 °C

Tray

GS8662T10BGD

SigmaDDR-II+ B2

100 °C

-40 °C

Memory & Data Storage

165

1.8 V

72 Mbit

1

545 mA

Pipelined

8 M x 9

22 Bit

SRAM

72 Mbit

Industrial

SRAM

GS8342D20BD-500
GS8342D20BD-500
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaQuad-II+

N

DDR

Commercial grade

500 MHz

FBGA

QDR

表面贴装

1.9 V

18 Bit

2 MWords

Synchronous

1.7 V

1.8000 V

500 MHz

+ 70 C

1.9 V

0 C

15

1.7 V

0 to 85 °C

Tray

GS8342D20BD

SigmaQuad-II+

85 °C

0 °C

Memory & Data Storage

165

1.8 V

36 Mbit

2

855 mA

Pipelined

2 M x 18

19 Bit

SRAM

36 Mbit

Commercial

SRAM

GS881Z18CD-250IV
GS881Z18CD-250IV
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

SMD/SMT

Parallel

GSI技术

GSI技术

NBT SRAM

SDR

Compliant

Industrial grade

181.8@Flow-Through/250@Pipelined MHz

FBGA

SDR

1.8, 2.5 V

1.7, 2.3 V

Synchronous

512 kWords

18 Bit

2, 2.7 V

表面贴装

250 MHz

+ 85 C

2.7 V

- 40 C

66

1.7 V

-40 to 85 °C

Tray

GS881Z18CD

NBT

85 °C

-40 °C

Memory & Data Storage

165

9 Mbit

1

145 mA, 185 mA

5.5 ns

Flow-Through/Pipelined

512 k x 18

18 Bit

SRAM

9 Mbit

Industrial

SRAM

GS8342R09BGD-400I
GS8342R09BGD-400I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

SigmaCIO DDR-II

Details

DDR

Industrial grade

400 MHz

FBGA

DDR

1.8000 V

Synchronous

4 MWords

9 Bit

表面贴装

400 MHz

+ 85 C

1.9 V

- 40 C

15

1.7 V

SMD/SMT

Parallel

GSI技术

GSI技术

-40 to 100 °C

Tray

GS8342R09BGD

SigmaDDR-II B4

100 °C

-40 °C

Memory & Data Storage

165

1.8 V

36 Mbit

1

610 mA

Pipelined

4 M x 9

20 Bit

SRAM

36 Mbit

Industrial

SRAM

GS8342D38BGD-500
GS8342D38BGD-500
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaQuad-II+

Details

DDR

Commercial grade

500 MHz

FBGA

QDR

1.8000 V

1.7 V

Synchronous

1 MWords

36 Bit

1.9 V

表面贴装

500 MHz

+ 70 C

1.9 V

0 C

15

1.7 V

0 to 70 °C

Tray

GS8342D38BGD

SigmaQuad-II+

70 °C

0 °C

Memory & Data Storage

165

1.8 V

36 Mbit

2

1.115 A

Pipelined

1 M x 36

18 Bit

SRAM

36 Mbit

Commercial

SRAM

GS88132CD-150IV
GS88132CD-150IV
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

SMD/SMT

Parallel

GSI技术

GSI技术

SyncBurst

SDR

Compliant

Industrial grade

133.3@Flow-Through/150@Pipelined MHz

FBGA

SDR

1.8, 2.5 V

1.7, 2.3 V

Synchronous

256 kWords

32 Bit

2, 2.7 V

表面贴装

150 MHz

+ 85 C

2.7 V

- 40 C

66

1.7 V

-40 to 85 °C

Tray

GS88132CD

同步突发

85 °C

-40 °C

Memory & Data Storage

165

9 Mbit

1

130 mA, 145 mA

7.5 ns

Flow-Through/Pipelined

256 k x 32

18 Bit

SRAM

9 Mbit

Industrial

SRAM

GS88218CGD-200I
GS88218CGD-200I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

BGA-165

YES

165

Details

SDR

LBGA,

GRID ARRAY, LOW PROFILE

3

512000

PLASTIC/EPOXY

-40 °C

未说明

6.5 ns

85 °C

GS88218CGD-200I

524288 words

2.5 V

LBGA

RECTANGULAR

活跃

GSI TECHNOLOGY

5.13

BGA

200 MHz

+ 85 C

3.6 V

- 40 C

72

2.3 V

SMD/SMT

Parallel

GSI技术

GSI技术

SyncBurst

Tray

GS88218CGD

e1

3A991.B.2.B

Pipeline/Flow Through

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

260

1

1 mm

compliant

165

R-PBGA-B165

不合格

2.7 V

INDUSTRIAL

2.3 V

9 Mbit

2

SYNCHRONOUS

150 mA, 175 mA

6.5 ns

512 k x 18

1.4 mm

18

19 b

SRAM

9 Mb

9437184 bit

PARALLEL

缓存SRAM

SRAM

15 mm

13 mm

GS8662DT11BD-350I
GS8662DT11BD-350I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaQuad-II+

DDR

Compliant

Industrial grade

350 MHz

FBGA

QDR

1.8000 V

1.7 V

Synchronous

8 MWords

9 Bit

1.9 V

表面贴装

350 MHz

+ 85 C

1.9 V

- 40 C

15

1.7 V

-40 to 100 °C

Tray

GS8662DT11BD

SigmaQuad-II+

100 °C

-40 °C

Memory & Data Storage

165

1.8 V

72 Mbit

2

705 mA

Pipelined

8 M x 9

21 Bit

SRAM

72 Mbit

Industrial

SRAM

GS88132CD-333
GS88132CD-333
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

BGA-165

YES

165

Synchronous

256 kWords

32 Bit

2.7, 3.6 V

表面贴装

333 MHz

+ 70 C

3.6 V

0 C

36

2.3 V

SMD/SMT

Parallel

GSI技术

GSI技术

SyncBurst

N

SDR

LBGA,

GRID ARRAY, LOW PROFILE

256000

PLASTIC/EPOXY

未说明

70 °C

GS88132CD-333

3.3 V

LBGA

RECTANGULAR

活跃

GSI TECHNOLOGY

5.16

BGA

Commercial grade

222.2@Flow-Through/333@Pipelined MHz

FBGA

SDR

2.5, 3.3 V

2.3, 3 V

0 to 70 °C

Tray

GS88132CD

3A991.B.2.B

Pipeline/Flow Through

70 °C

0 °C

ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY, FLOW THROUGH OR PIPELINED ARCHITECTURE

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

未说明

1

1 mm

compliant

165

R-PBGA-B165

不合格

3.6 V

COMMERCIAL

3 V

9 Mbit

1

SYNCHRONOUS

180 mA, 240 mA

4.5 ns

Flow-Through/Pipelined

256 k x 36

1.4 mm

32

18 Bit

SRAM

9 Mbit

8388608 bit

Commercial

SERIAL

缓存SRAM

SRAM

15 mm

13 mm

GS8673ED18BGK-550
GS8673ED18BGK-550
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-260

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaQuad-IIIe

Details

DDR

Commercial grade

550/375 MHz

BGA

QDR

1.3500 V

1.25 V

Synchronous

4 MWords

18 Bit

1.4 V

表面贴装

550 MHz

+ 85 C

1.4 V

0 C

8

1.25 V

0 to 70 °C

Tray

GS8673ED18BGK

SigmaQuad-IIIe B4

Memory & Data Storage

260

72 Mbit

1.93 A

1.1 Gb/s

Pipelined

4 M x 18

20 Bit

SRAM

72 Mbit

Commercial

SRAM

GS881E18CGT-200IV
GS881E18CGT-200IV
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TQFP-100

GSI技术

GSI技术

SyncBurst

Details

SDR

Industrial grade

TQFP

SDR

1.8, 2.5 V

1.7, 2.3 V

Synchronous

512 kWords

18 Bit

2, 2.7 V

表面贴装

200 MHz

+ 85 C

2.7 V

- 40 C

66

1.7 V

SMD/SMT

Parallel

-40 to 85 °C

Tray

GS881E18CGT

DCD Pipeline/Flow Through

85 °C

-40 °C

Memory & Data Storage

100

9 Mbit

2

125 mA, 160 mA

6.5 ns

Flow-Through/Pipelined

512 k x 18

18 b

SRAM

9 Mbit

Industrial

SRAM

GS81302S08E-300
GS81302S08E-300
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaSIO DDR-II

N

DDR-II

Commercial grade

300 MHz

FBGA

DDR

1.8000 V

1.7 V

Synchronous

16 MWords

8 Bit

1.9 V

表面贴装

300 MHz

+ 70 C

1.9 V

0 C

10

1.7 V

0 to 85 °C

Tray

GS81302S08E

SigmaSIO DDR-II

85 °C

0 °C

Memory & Data Storage

165

1.8 V

144 Mbit

2

815 mA

Pipelined

16 M x 8

23 Bit

SRAM

144 Mbit

Commercial

SRAM

GS8182D08BD-375M
GS8182D08BD-375M
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaQuad-II

DDR

Compliant

Military grade

375 MHz

FBGA

QDR

1.8000 V

1.7 V

Synchronous

2 MWords

8 Bit

1.9 V

表面贴装

375 MHz

+ 125 C

1.9 V

- 55 C

18

1.7 V

-55 to 125 °C

Tray

GS8182D08BD

SigmaQuad-II

125 °C

-55 °C

Memory & Data Storage

165

1.8 V

18 Mbit

2

730 mA

Pipelined

2 M x 8

19 Bit

SRAM

18 Mbit

Military

SRAM

GS8182T08BGD-200
GS8182T08BGD-200
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Compliant

70 °C

0 °C

1.8 V

1

20 b

18 Mb

GS832136AGD-400I
GS832136AGD-400I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

FBGA

SDR

2.5, 3.3 V

2.3, 3 V

Synchronous

1 MWords

36 Bit

2.7, 3.6 V

表面贴装

Compliant

400 MHz

+ 85 C

3.6 V

- 40 C

2.3 V

SMD/SMT

Parallel

Industrial grade

250@Flow-Through/400@Pipelined MHz

-40 to 100 °C

Bulk

GS832136AGD

100 °C

-40 °C

165

36 Mbit

4

305 mA, 415 mA

4 ns

Flow-Through/Pipelined

1 M x 36

20 Bit

36 Mbit

Industrial

GS8342TT10BGD-350I
GS8342TT10BGD-350I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaDDR-II+

Details

DDR

Industrial grade

350 MHz

FBGA

DDR

1.8000 V

1.7 V

Synchronous

4 MWords

9 Bit

1.9 V

表面贴装

350 MHz

+ 85 C

1.9 V

- 40 C

15

1.7 V

-40 to 100 °C

Tray

GS8342TT10BGD

SigmaDDR-II+ B2

100 °C

-40 °C

Memory & Data Storage

165

1.8 V

36 Mbit

1

575 mA

Pipelined

4 M x 9

21 Bit

SRAM

36 Mbit

Industrial

SRAM

GS8662Q07BGD-300I
GS8662Q07BGD-300I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

GSI技术

GSI技术

SigmaQuad-II+

Details

DDR

Industrial grade

300 MHz

QDR

1.8000 V

1.7 V

Synchronous

8 MWords

8 Bit

1.9 V

表面贴装

300 MHz

+ 85 C

1.9 V

- 40 C

15

1.7 V

SMD/SMT

Parallel

-40 to 100 °C

Tray

GS8662Q07BGD

SigmaQuad-II+ B2

Memory & Data Storage

72 Mbit

2

860 mA

Pipelined

8 M x 8

22 Bit

SRAM

72 Mbit

Industrial

SRAM

GS8662D20BD-500
GS8662D20BD-500
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaQuad-II+

N

DDR

Commercial grade

500 MHz

FBGA

QDR

1.8000 V

1.7 V

Synchronous

4 MWords

18 Bit

1.9 V

表面贴装

500 MHz

+ 70 C

1.9 V

0 C

15

1.7 V

0 to 85 °C

Tray

GS8662D20BD

SigmaQuad-II+

85 °C

0 °C

Memory & Data Storage

165

1.8 V

72 Mbit

2

890 mA

Pipelined

4 M x 18

20 Bit

SRAM

72 Mbit

Commercial

SRAM

GS8662T36BGD-333I
GS8662T36BGD-333I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

BGA-165

YES

165

333 MHz

FBGA

DDR

1.8000 V

1.7 V

Synchronous

2 MWords

36 Bit

1.9 V

表面贴装

333 MHz

+ 85 C

1.9 V

- 40 C

15

1.7 V

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaDDR-II

Details

DDR

LBGA, BGA165,11X15,40

GRID ARRAY, LOW PROFILE

3

2000000

PLASTIC/EPOXY

BGA165,11X15,40

-40 °C

未说明

0.45 ns

85 °C

GS8662T36BGD-333I

333 MHz

1.8 V

LBGA

RECTANGULAR

活跃

GSI TECHNOLOGY

5.2

BGA

Industrial grade

-40 to 100 °C

Tray

GS8662T36BGD

e1

3A991.B.2.B

SigmaDDR-II B2

Tin/Silver/Copper (Sn/Ag/Cu)

100 °C

-40 °C

PIPELINED ARCHITECTURE, LATE WRITE

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

260

1

1 mm

compliant

165

R-PBGA-B165

不合格

1.8 V

1.9 V

1.5/1.8,1.8 V

INDUSTRIAL

1.7 V

72 Mbit

1

SYNCHRONOUS

695 mA

Pipelined

2 M x 36

3-STATE

1.4 mm

36

21 Bit

SRAM

72 Mbit

75497472 bit

Industrial

PARALLEL

COMMON

DDR SRAM

1.7 V

SRAM

15 mm

13 mm

GS8642Z72C-250V
GS8642Z72C-250V
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-209

SMD/SMT

Parallel

GSI技术

GSI技术

NBT SRAM

N

SDR

Commercial grade

166.6@Flow-Through/250@Pipelined MHz

FBGA

SDR

1.8, 2.5 V

1.7, 2.3 V

Synchronous

1 MWords

72 Bit

2, 2.7 V

表面贴装

250 MHz

+ 70 C

2.7 V

0 C

14

1.7 V

0 to 70 °C

Tray

GS8642Z72C

NBT Pipeline/Flow Through

70 °C

0 °C

Memory & Data Storage

209

72 Mbit

8

330 mA, 460 mA

6.5 ns

Flow-Through/Pipelined

1 M x 72

20 Bit

SRAM

72 Mbit

Commercial

SRAM