品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 数据率 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8342TT10BGD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Industrial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342TT10BGD | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 165 | 1.8 V | 36 Mbit | 1 | 680 mA | Pipelined | 4 M x 9 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS74116AGP-10T | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | YES | 44 | TSOP2, TSOP44,.46,32 | SMALL OUTLINE, THIN PROFILE | 3 | 256000 | PLASTIC/EPOXY | TSOP44,.46,32 | 未说明 | 10 ns | 70 °C | 有 | GS74116AGP-10T | 262144 words | 3.3 V | TSOP2 | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.16 | TSOP2 | Compliant | 有 | 3A991.B.2.B | Pure Matte Tin (Sn) | 8542.32.00.41 | SRAMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 0.8 mm | compliant | 44 | R-PDSO-G44 | 不合格 | 3.6 V | 3.3 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.105 mA | 256KX16 | 3-STATE | 1.2 mm | 16 | 0.01 A | 4194304 bit | PARALLEL | COMMON | 标准SRAM | 3 V | 18.41 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T08BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | DDR | Commercial grade | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 15 | 0 to 85 °C | Tray | GS8662T08BGD | SigmaDDR-II B2 | 85 °C | 0 °C | Memory & Data Storage | 165 | 1.8 V | 72 Mbit | 1 | 535 mA | Pipelined | 8 M x 8 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T09BGD-167I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 85 °C | -40 °C | 1.8 V | 1 | 20 b | 18 Mb | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832118AD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 333 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | -40 to 100 °C | Bulk | 100 °C | -40 °C | 165 | 36 Mbit | 2 | 255 mA, 340 mA | 4.5 ns | Flow-Through/Pipelined | 2 M x 18 | 21 Bit | 36 Mbit | Industrial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T10BGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Industrial grade | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8662T10BGD | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 165 | 1.8 V | 72 Mbit | 1 | 545 mA | Pipelined | 8 M x 9 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D20BD-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | DDR | Commercial grade | 500 MHz | FBGA | QDR | 表面贴装 | 1.9 V | 18 Bit | 2 MWords | Synchronous | 1.7 V | 1.8000 V | 有 | 500 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342D20BD | SigmaQuad-II+ | 85 °C | 0 °C | Memory & Data Storage | 165 | 1.8 V | 36 Mbit | 2 | 855 mA | Pipelined | 2 M x 18 | 19 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z18CD-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Compliant | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | -40 to 85 °C | Tray | GS881Z18CD | NBT | 85 °C | -40 °C | Memory & Data Storage | 165 | 9 Mbit | 1 | 145 mA, 185 mA | 5.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 Bit | SRAM | 9 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342R09BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SigmaCIO DDR-II | Details | DDR | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | Synchronous | 4 MWords | 9 Bit | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | -40 to 100 °C | Tray | GS8342R09BGD | SigmaDDR-II B4 | 100 °C | -40 °C | Memory & Data Storage | 165 | 1.8 V | 36 Mbit | 1 | 610 mA | Pipelined | 4 M x 9 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D38BGD-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Commercial grade | 500 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 70 °C | Tray | GS8342D38BGD | SigmaQuad-II+ | 70 °C | 0 °C | Memory & Data Storage | 165 | 1.8 V | 36 Mbit | 2 | 1.115 A | Pipelined | 1 M x 36 | 18 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88132CD-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Compliant | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 32 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | -40 to 85 °C | Tray | GS88132CD | 同步突发 | 85 °C | -40 °C | Memory & Data Storage | 165 | 9 Mbit | 1 | 130 mA, 145 mA | 7.5 ns | Flow-Through/Pipelined | 256 k x 32 | 18 Bit | SRAM | 9 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88218CGD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | Details | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS88218CGD-200I | 524288 words | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.13 | BGA | 有 | 200 MHz | + 85 C | 3.6 V | - 40 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Tray | GS88218CGD | e1 | 有 | 3A991.B.2.B | Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 2.7 V | INDUSTRIAL | 2.3 V | 9 Mbit | 2 | SYNCHRONOUS | 150 mA, 175 mA | 6.5 ns | 512 k x 18 | 1.4 mm | 18 | 19 b | SRAM | 9 Mb | 9437184 bit | PARALLEL | 缓存SRAM | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||||||||||||
![]() | GS8662DT11BD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Compliant | Industrial grade | 350 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8662DT11BD | SigmaQuad-II+ | 100 °C | -40 °C | Memory & Data Storage | 165 | 1.8 V | 72 Mbit | 2 | 705 mA | Pipelined | 8 M x 9 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88132CD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | Synchronous | 256 kWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 256000 | PLASTIC/EPOXY | 未说明 | 70 °C | 无 | GS88132CD-333 | 3.3 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.16 | BGA | Commercial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | 0 to 70 °C | Tray | GS88132CD | 3A991.B.2.B | Pipeline/Flow Through | 70 °C | 0 °C | ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY, FLOW THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 3.6 V | COMMERCIAL | 3 V | 9 Mbit | 1 | SYNCHRONOUS | 180 mA, 240 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 36 | 1.4 mm | 32 | 18 Bit | SRAM | 9 Mbit | 8388608 bit | Commercial | SERIAL | 缓存SRAM | SRAM | 15 mm | 13 mm | 无 | |||||||||||||||||
![]() | GS8673ED18BGK-550 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-260 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-IIIe | Details | DDR | Commercial grade | 550/375 MHz | BGA | QDR | 1.3500 V | 1.25 V | Synchronous | 4 MWords | 18 Bit | 1.4 V | 表面贴装 | 有 | 550 MHz | + 85 C | 1.4 V | 0 C | 8 | 1.25 V | 0 to 70 °C | Tray | GS8673ED18BGK | SigmaQuad-IIIe B4 | Memory & Data Storage | 260 | 72 Mbit | 1.93 A | 1.1 Gb/s | Pipelined | 4 M x 18 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E18CGT-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | SMD/SMT | Parallel | -40 to 85 °C | Tray | GS881E18CGT | DCD Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | 100 | 9 Mbit | 2 | 125 mA, 160 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 b | SRAM | 9 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302S08E-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | N | DDR-II | Commercial grade | 300 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302S08E | SigmaSIO DDR-II | 85 °C | 0 °C | Memory & Data Storage | 165 | 1.8 V | 144 Mbit | 2 | 815 mA | Pipelined | 16 M x 8 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182D08BD-375M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Compliant | Military grade | 375 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 375 MHz | + 125 C | 1.9 V | - 55 C | 18 | 1.7 V | -55 to 125 °C | Tray | GS8182D08BD | SigmaQuad-II | 125 °C | -55 °C | Memory & Data Storage | 165 | 1.8 V | 18 Mbit | 2 | 730 mA | Pipelined | 2 M x 8 | 19 Bit | SRAM | 18 Mbit | Military | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T08BGD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 70 °C | 0 °C | 1.8 V | 1 | 20 b | 18 Mb | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832136AGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 400 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | Industrial grade | 250@Flow-Through/400@Pipelined MHz | -40 to 100 °C | Bulk | GS832136AGD | 100 °C | -40 °C | 165 | 36 Mbit | 4 | 305 mA, 415 mA | 4 ns | Flow-Through/Pipelined | 1 M x 36 | 20 Bit | 36 Mbit | Industrial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT10BGD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342TT10BGD | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 165 | 1.8 V | 36 Mbit | 1 | 575 mA | Pipelined | 4 M x 9 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q07BGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | 300 MHz | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | -40 to 100 °C | Tray | GS8662Q07BGD | SigmaQuad-II+ B2 | Memory & Data Storage | 72 Mbit | 2 | 860 mA | Pipelined | 8 M x 8 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D20BD-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | DDR | Commercial grade | 500 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662D20BD | SigmaQuad-II+ | 85 °C | 0 °C | Memory & Data Storage | 165 | 1.8 V | 72 Mbit | 2 | 890 mA | Pipelined | 4 M x 18 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T36BGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | Details | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8662T36BGD-333I | 333 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.2 | BGA | Industrial grade | -40 to 100 °C | Tray | GS8662T36BGD | e1 | 有 | 3A991.B.2.B | SigmaDDR-II B2 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 1.8 V | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 72 Mbit | 1 | SYNCHRONOUS | 695 mA | Pipelined | 2 M x 36 | 3-STATE | 1.4 mm | 36 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||
![]() | GS8642Z72C-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | Commercial grade | 166.6@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 72 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 70 C | 2.7 V | 0 C | 14 | 1.7 V | 0 to 70 °C | Tray | GS8642Z72C | NBT Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 209 | 72 Mbit | 8 | 330 mA, 460 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 72 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 |
GS8342TT10BGD-450I
GSI Technology
分类:Memory
GS74116AGP-10T
GSI Technology
分类:Memory
GS8662T08BGD-333
GSI Technology
分类:Memory
GS8182T09BGD-167I
GSI Technology
分类:Memory
GS832118AD-333I
GSI Technology
分类:Memory
GS8662T10BGD-333I
GSI Technology
分类:Memory
GS8342D20BD-500
GSI Technology
分类:Memory
GS881Z18CD-250IV
GSI Technology
分类:Memory
GS8342R09BGD-400I
GSI Technology
分类:Memory
GS8342D38BGD-500
GSI Technology
分类:Memory
GS88132CD-150IV
GSI Technology
分类:Memory
GS88218CGD-200I
GSI Technology
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