品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 数据总线宽度 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 访问模式 | 自我刷新 | 产品类别 | 组织的记忆 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS88136CGD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 200 MHz | + 85 C | 3.6 V | - 40 C | 72 | 2.3 V | SMD/SMT | -40 to 85 °C | Tray | GS88136CGD | Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 1 | 160 mA, 190 mA | 6.5 ns | Flow-Through/Pipelined | 256 k x 36 | 17 Bit | SRAM | 9 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342Q18BD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks, 3 Days | BGA-165 | YES | 165 | 165 | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Compliant | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 0.45 ns | 85 °C | 无 | GS8342Q18BD-250I | 250 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 1.9 | BGA | Industrial grade | 250 MHz | FBGA | QDR | 1.8000 V | -40 to 100 °C | Tray | GS8342Q18BD | 3A991.B.2.B | SigmaQuad-II | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 675 mA | 450 ps | Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 20 Bit | SRAM | 36 Mbit | 0.215 A | 37748736 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||||||||||||
![]() | GS8161Z18DGT-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | TQFP-100 | YES | 100 | 100 | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 150 MHz | + 70 C | 3.6 V | 0.550045 oz | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 7.5 ns | 70 °C | 有 | GS8161Z18DGT-150 | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.79 | QFP | Commercial grade | 133.3@Flow-Through/150@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | 0 to 70 °C | Tray | GS8161Z18DGT | 3A991.B.2.B | NBT | ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | COMMERCIAL | 18 Mbit | 2 | SYNCHRONOUS | 170 mA, 180 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 18 | 1.6 mm | 18 | 20 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||
![]() | GS832218AGB-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | SDR | Details | SyncBurst | GSI技术 | GSI技术 | Parallel | SMD/SMT | 2.3 V | 14 | 0 C | 3.6 V | + 70 C | 150 MHz | 有 | BGA, BGA119,7X17,50 | 网格排列 | 3 | 2000000 | PLASTIC/EPOXY | BGA119,7X17,50 | 未说明 | 7.5 ns | 70 °C | 有 | GS832218AGB-150 | 150 MHz | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.56 | BGA | Commercial grade | 133@Flow-Through/150@Pipelined MHz | FBGA | SDR | 0 to 85 °C | Tray | GS832218AGB | e1 | 有 | 3A991.B.2.B | Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 2.5/3.3 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 175 mA, 190 mA | 7.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.99 mm | 18 | 21 Bit | SRAM | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | |||||||||||||||||||||||
![]() | GS832036AGT-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | SDR | TQFP | 153.8@Flow-Through/200@Pipelined MHz | 有 | 200 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 有 | GS832036AGT-200I | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.88 | QFP | Industrial grade | 表面贴装 | 2.7, 3.6 V | 36 Bit | 1 MWords | Synchronous | 2.3, 3 V | 2.5, 3.3 V | -40 to 100 °C | Tray | GS832036AGT | 3A991.B.2.B | Pipeline/Flow Through | ALSO OPERATES AT 3.3; SYNCHRONOUS BURST | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 36 Mbit | 4 | SYNCHRONOUS | 225 mA, 260 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 36 | 1.6 mm | 36 | 20 Bit | SRAM | 36 Mbit | 37748736 bit | Industrial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||
![]() | GS8642Z36GB-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | GSI技术 | NBT SRAM | Details | SDR | Commercial grade | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 14 | 1.7 V | SMD/SMT | Parallel | GSI技术 | 0 to 70 °C | Tray | GS8642Z36GB | NBT Pipeline/Flow Through | Memory & Data Storage | 72 Mbit | 4 | 230 mA, 310 mA | 7.5 ns | Flow-Through/Pipelined | 2 M x 36 | SRAM | 72 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D37GE-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | YES | 165 | 165 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 4000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 有 | GS81302D37GE-300 | 4194304 words | 1.8 V | LBGA | RECTANGULAR | 不推荐 | GSI TECHNOLOGY | 8.03 | BGA | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | Tray | GS81302D37GE | e1 | 有 | 3A991.B.2.B | SigmaQuad-II+ B4 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 144 Mbit | SYNCHRONOUS | 915 mA | 450 ps | 4 M x 36 | 1.5 mm | 36 | SRAM | 150994944 bit | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8320Z18AGT-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 200 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 2000000 | PLASTIC/EPOXY | QFP100,.63X.87 | 未说明 | 6.5 ns | 85 °C | 有 | GS8320Z18AGT-200 | 200 MHz | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 1.71 | QFP | Commercial grade | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 0 to 85 °C | Tray | GS8320Z18AGT | 3A991.B.2.B | NBT Pipeline/Flow Through | 85 °C | 0 °C | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3 V | OTHER | 36 Mbit | 2 | SYNCHRONOUS | 185 mA, 220 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.6 mm | 18 | 21 b | SRAM | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | 无 | ||||||||||||||||||||||||||
![]() | GS832032AGT-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | 1 MWords | 32 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | QFP | 4.87 | GSI TECHNOLOGY | 活跃 | RECTANGULAR | LQFP | 1.8 V | GS832032AGT-200V | 有 | 85 °C | 6.5 ns | 未说明 | PLASTIC/EPOXY | 1000000 | FLATPACK, LOW PROFILE | LQFP, | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 0 to 85 °C | Tray | GS832032AGT | 3A991.B.2.B | 同步突发 | ALSO OPERTAES AT 2.5, SYNCHRONOUS BURST | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | OTHER | 36 Mbit | 4 | SYNCHRONOUS | 215 mA, 250 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 32 | 1.6 mm | 32 | 20 Bit | SRAM | 36 Mbit | 33554432 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||
![]() | GS8644Z18E-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | GSI技术 | NBT SRAM | SDR | Industrial grade | 153.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 4 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 15 | 2.3 V | SMD/SMT | Parallel | -40 to 85 °C | Tray | GS8644Z18E | NBT | Memory & Data Storage | 72 Mbit | 2 | 275 mA, 395 mA | 6.5 ns | Flow-Through/Pipelined | 4 M x 18 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8644Z36GE-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 200 MHz | + 70 C | 3.6 V | 0.324873 oz | 0 C | 15 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | BGA, BGA165,11X15,40 | 网格排列 | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 6.5 ns | 70 °C | 有 | GS8644Z36GE-200 | 200 MHz | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.61 | BGA | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | 0 to 70 °C | Tray | GS8644Z36GE | e1 | 有 | 3A991.B.2.B | NBT | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 3.3V SUPPLY; PIPELINED OR FLOW-THROUGH ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | COMMERCIAL | 72 Mbit | 4 | SYNCHRONOUS | 270 mA, 345 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 36 | 3-STATE | 1.5 mm | 36 | 21 Bit | SRAM | 72 Mbit | 0.12 A | 75497472 bit | Commercial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 17 mm | 15 mm | ||||||||||||||||||||||
![]() | GS8162Z36DGD-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 1.7, 2.3 V | Synchronous | 512 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 85 C | 2.7 V | 0.368052 oz | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS8162Z36DGD-200IV | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.77 | BGA | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | -40 to 100 °C | Tray | GS8162Z36DGD | 3A991.B.2.B | NBT Pipeline/Flow Through | 100 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 18 Mbit | 4 | SYNCHRONOUS | 225 mA, 230 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 36 | 1.4 mm | 36 | 19 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||||||||||||||||||
![]() | GS84036CGT-166I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | TQFP-100 | YES | 100 | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 3 | 128000 | PLASTIC/EPOXY | -40 °C | 未说明 | 7 ns | 85 °C | 有 | GS84036CGT-166I | 131072 words | 3.3 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 1.7 | 有 | 166 MHz | + 85 C | 3.6 V | 0.262103 oz | - 40 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | -40 to 85 °C | Tray | GS84036CGT | 3A991.B.2.B | Pipeline/Flow Through | Pure Matte Tin (Sn) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | INDUSTRIAL | 4 Mbit | SYNCHRONOUS | 155 mA, 250 mA | 7 ns | 128 k x 36 | 1.6 mm | 36 | SRAM | 4718592 bit | PARALLEL | 缓存SRAM | 3.6 V | 3 V | SRAM | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS882Z36CGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | BGA-165 | YES | 165 | 165-FPBGA (13x15) | 165 | 表面贴装 | 2.7, 3.6 V | 36 Bit | 256 kWords | Synchronous | 2.3, 3 V | 2.5, 3.3 V | Compliant | 有 | 333 MHz | + 85 C | 3.6 V | GSI Technology Inc. | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | 活跃 | GS882Z36 | Tray | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 4.5 ns | 85 °C | 有 | GS882Z36CGD-333I | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | SDR | -40 to 85 °C | Tray | GS882Z36CGD | e1 | 有 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | SRAM - Synchronous, ZBT | 2.3V ~ 2.7V, 3V ~ 3.6V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 9 Mbit | 4 | SYNCHRONOUS | 333 MHz | 200 mA, 260 mA | 4.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 256 k x 36 | 1.4 mm | 36 | - | 18 Bit | SRAM | 9 Mbit | 9437184 bit | Industrial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 256K x 36 | 15 mm | 13 mm | 无 | ||||||||||||||
![]() | GS864036GT-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-100 | 100 | 100-TQFP (20x14) | GSI Technology Inc. | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Tray | GS864036 | 活跃 | Industrial grade | 181.8@Flow-Through/300@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 300 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | -40 to 85 °C | Tray | GS864036GT | Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | SRAM - Synchronous, Standard | 2.3V ~ 2.7V, 3V ~ 3.6V | 72 Mbit | 4 | 300 MHz | 320 mA, 440 mA | 5.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 2 M x 36 | - | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | 2M x 36 | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T36BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-165 | 165 | 165-FPBGA (13x15) | GSI Technology Inc. | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | Details | DDR | Tray | GS8662T | 活跃 | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8662T36BGD | SigmaDDR-II B2 | Memory & Data Storage | SRAM - Quad Port, Synchronous, DDR II | 1.7V ~ 1.9V | 72 Mbit | 1 | 400 MHz | 810 mA | SRAM | Parallel | Pipelined | 2 M x 36 | - | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | 2M x 36 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q37BGD-357I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-165 | 165 | 165-FPBGA (13x15) | GSI Technology Inc. | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | Tray | GS8662Q | 活跃 | Industrial grade | 357 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 357 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8662Q37BGD | SigmaQuad-II+ B2 | Memory & Data Storage | SRAM - Quad Port, Synchronous, QDR II+ | 1.7V ~ 1.9V | 72 Mbit | 2 | 357 MHz | 1.205 A | SRAM | Parallel | Pipelined | 2 M x 36 | - | 20 Bit | SRAM | 72 Mbit | Industrial | SRAM | 2M x 36 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816018DGT-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | TQFP-100 | YES | 100 | 100-TQFP (20x14) | 100 | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 333 MHz | + 100 C | 3.6 V | GSI Technology Inc. | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | 活跃 | GS816018 | Tray | LQFP, | FLATPACK, LOW PROFILE | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 4.5 ns | 85 °C | 有 | GS816018DGT-333I | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.28 | QFP | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | -40 to 100 °C | Bulk | GS816018DGT | 3A991.B.2.B | Pipeline/Flow Through | 100 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | SRAM - Synchronous, Standard | 2.3V ~ 2.7V, 3V ~ 3.6V | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 333 MHz | 260 mA, 305 mA | 4.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 1 M x 18 | 1.6 mm | 8 | - | 21 Bit | SRAM | 18 Mbit | 8388608 bit | Industrial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 1M x 18 | 20 mm | 14 mm | 无 | |||||||||||||||||||
![]() | GS88018CGT-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | TQFP-100 | YES | 100 | 100-TQFP (20x14) | 100 | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 333 MHz | + 85 C | 3.6 V | GSI Technology Inc. | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Tray | GS88018 | 活跃 | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | QFP100,.63X.87 | -40 °C | 未说明 | 4.5 ns | 85 °C | 有 | GS88018CGT-333I | 333 MHz | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.26 | QFP | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | -40 to 85 °C | Tray | GS88018CGT | e3 | 有 | 3A991.B.2.B | Pipeline/Flow Through | 纯哑光锡 | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | SRAM - Synchronous, Standard | 2.3V ~ 2.7V, 3V ~ 3.6V | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 9 Mbit | 2 | SYNCHRONOUS | 333 MHz | 185 mA, 240 mA | 4.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 512 k x 18 | 3-STATE | 1.6 mm | 18 | - | 19 Bit | SRAM | 9 Mbit | 0.045 A | 9437184 bit | Industrial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 512K x 18 | 20 mm | 14 mm | 无 | |||||||
![]() | GS8662Q36BGD-357I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | BGA-165 | YES | 165 | 165-FPBGA (13x15) | 165 | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 357 MHz | + 85 C | 1.9 V | - 40 C | GSI Technology Inc. | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | DDR | 活跃 | GS8662Q | Tray | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8662Q36BGD-357I | 357 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.3 | BGA | Industrial grade | 357 MHz | FBGA | -40 to 100 °C | Tray | GS8662Q36BGD | 3A991.B.2.B | SigmaQuad-II | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | SRAM - Quad Port, Synchronous, QDR II | 1.7V ~ 1.9V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 357 MHz | 1.205 A | SRAM | Parallel | Pipelined | 2 M x 36 | 3-STATE | 1.4 mm | 36 | - | 20 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 2M x 36 | 15 mm | 13 mm | ||||||||||||||||
![]() | GS8342D36BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-165 | 165 | 165-FPBGA (13x15) | GSI Technology Inc. | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | DDR | Tray | GS8342D | 活跃 | Industrial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8342D36BGD | SigmaQuad-II | Memory & Data Storage | SRAM - Quad Port, Synchronous, QDR II | 1.7V ~ 1.9V | 36 Mbit | 2 | 400 MHz | 915 mA | SRAM | Parallel | Pipelined | 1 M x 36 | - | 18 Bit | SRAM | 36 Mbit | Industrial | SRAM | 1M x 36 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342Q18BGD-357I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-165 | 165 | 165-FPBGA (13x15) | GSI Technology Inc. | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | DDR | Tray | GS8342Q | 活跃 | Industrial grade | 357 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 357 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8342Q18BGD | SigmaQuad-II | Memory & Data Storage | SRAM - Quad Port, Synchronous, QDR II | 1.7V ~ 1.9V | 36 Mbit | 2 | 357 MHz | 955 mA | SRAM | Parallel | Pipelined | 2 M x 18 | - | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 2M x 18 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS4576S18GL-18 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 144 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | 32000000 | PLASTIC/EPOXY | 未说明 | 70 °C | 有 | GS4576S18GL-18 | 33554432 words | 1.8 V | TFBGA | RECTANGULAR | GSI技术 | 生命周期结束 | GSI TECHNOLOGY | BGA | 5.97 | Compliant | TFBGA, | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | 95 °C | 0 °C | AUTO/SELF REFRESH | 8542.32.00.32 | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | R-PBGA-B144 | 不合格 | COMMERCIAL | 1 | SYNCHRONOUS | 18 b | 32MX18 | 1.2 mm | 18 | 24 b | 576 Mb | 603979776 bit | 533 MHz | DDR DRAM | 1.9 V | 1.7 V | 多库页面突发 | YES | 18.5 mm | 11 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673ED36BK-550 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-260 | Parallel | GSI技术 | GSI技术 | SigmaQuad-IIIe | N | DDR | 有 | 550 MHz | + 85 C | 1.4 V | 0 C | 8 | 1.25 V | SMD/SMT | Tray | GS8673ED36BK | SigmaQuad-IIIe B4 | Memory & Data Storage | 72 Mbit | 2.67 A | 2 M x 36 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS71116ATP-10 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | 44 | TSOP2, TSOP44,.46,32 | SMALL OUTLINE, THIN PROFILE | 3 | 64000 | PLASTIC/EPOXY | TSOP44,.46,32 | 未说明 | 10 ns | 70 °C | 无 | GS71116ATP-10 | TSOP2 | 5.13 | GSI TECHNOLOGY | Obsolete | GSI技术 | RECTANGULAR | TSOP2 | 3.3 V | 65536 words | e0 | 3A991.B.2.B | 锡铅 | 8542.32.00.41 | SRAMs | CMOS | DUAL | 鸥翼 | 未说明 | 1 | 0.8 mm | compliant | R-PDSO-G44 | 不合格 | 3.3 V | COMMERCIAL | ASYNCHRONOUS | 0.1 mA | 64KX16 | 3-STATE | 1.2 mm | 16 | 0.002 A | 1048576 bit | PARALLEL | COMMON | 标准SRAM | 3 V | 3.6 V | 3 V | 18.41 mm | 10.16 mm |
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