品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS88032CGT-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 250 MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 32 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 70 C | 2.7 V | 0 C | 66 | 1.7 V | 0 to 70 °C | Tray | GS88032CGT | 同步突发 | Memory & Data Storage | 9 Mbit | 4 | 140 mA, 180 mA | 5.5 ns | Flow-Through/Pipelined | 256 k x 32 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T10GE-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | Industrial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | -40 to 100 °C | Tray | GS81302T10GE | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 1.01 A | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816032DGT-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | TQFP-100 | YES | 100 | 100 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 400 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 4 ns | 85 °C | 有 | GS816032DGT-400I | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.34 | QFP | Industrial grade | 250@Flow-Through/400@Pipelined MHz | TQFP | SDR | -40 to 100 °C | Tray | GS816032DGT | 3A991.B.2.B | Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | INDUSTRIAL | 18 Mbit | 4 | SYNCHRONOUS | 300 mA, 385 mA | 4 ns | Flow-Through/Pipelined | 512 k x 32 | 1.6 mm | 32 | 20 Bit | SRAM | 18 Mbit | 16777216 bit | Industrial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | |||||||||||||||
![]() | GS864236GB-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 14 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | BGA, | 网格排列 | 3 | 2000000 | PLASTIC/EPOXY | BGA | 5.18 | GSI TECHNOLOGY | 活跃 | RECTANGULAR | BGA | 1.8 V | GS864236GB-250IV | 有 | 85 °C | 6.5 ns | 未说明 | -40 °C | Industrial grade | 153.8@Flow-Through/250@Pipelined MHz | FBGA | -40 to 85 °C | Tray | GS864236GB | e1 | 有 | 3A991.B.2.B | SCD/DCD Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 72 Mbit | 4 | SYNCHRONOUS | 275 mA, 380 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 36 | 1.99 mm | 36 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | ||||||||||
![]() | GS8342T06BD-550I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 550 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8342T06BD-550I | 550 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | BGA | Industrial grade | 550 MHz | FBGA | -40 to 100 °C | Tray | GS8342T06BD | e0 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 1 | SYNCHRONOUS | 810 mA | Pipelined | 4 M x 8 | 3-STATE | 1.4 mm | 8 | 21 Bit | SRAM | 36 Mbit | 0.265 A | 33554432 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||
![]() | GS8662Q36BD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | Synchronous | 2 MWords | 36 Bit | 表面贴装 | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8662Q36BD-250I | 250 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.28 | BGA | Industrial grade | 250 MHz | FBGA | QDR | 1.8000 V | -40 to 100 °C | Tray | GS8662Q36BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 905 mA | Pipelined | 2 M x 36 | 3-STATE | 1.4 mm | 36 | 20 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||
![]() | GS816018DGT-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | TQFP-100 | YES | 100 | 100 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | + 100 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | 400 MHz | 有 | LQFP, | FLATPACK, LOW PROFILE | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 4 ns | 85 °C | 有 | GS816018DGT-400I | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.32 | QFP | Industrial grade | 250@Flow-Through/400@Pipelined MHz | TQFP | SDR | -40 to 100 °C | Tray | GS816018DGT | 3A991.B.2.B | Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 275 mA, 355 mA | 4 ns | Flow-Through/Pipelined | 1 M x 18 | 1.6 mm | 8 | 21 Bit | SRAM | 18 Mbit | 8388608 bit | Industrial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | |||||||||||||||
![]() | GS8662D20BD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | DDR | Commercial grade | 350 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662D20BD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 2 | 695 mA | Pipelined | 4 M x 18 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88118CD-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | Commercial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 70 C | 2.7 V | 0 C | 66 | 1.7 V | 0 to 70 °C | Tray | GS88118CD | 同步突发 | Memory & Data Storage | 9 Mbit | 1 | 125 mA, 165 mA | 5.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T38BD-550I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 550 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 550 MHz | FBGA | DDR | -40 to 100 °C | 72 Mbit | 1 | 1.095 A | Pipelined | 2 M x 36 | 20 Bit | 72 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT07BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Commercial grade | 表面贴装 | 1.9 V | 8 Bit | 4 MWords | Synchronous | 1.7 V | 1.8000 V | DDR | FBGA | 400 MHz | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342TT07BGD | SigmaDDR-II+ B2 | Memory & Data Storage | 36 Mbit | 1 | 600 mA | Pipelined | 4 M x 8 | 21 Bit | SRAM | 36 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT38E-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | LBGA, | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 无 | GS81302TT38E-400 | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 不推荐 | GSI TECHNOLOGY | 5.06 | BGA | 400 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 0 to 85 °C | GS81302TT38E | 无 | 3A991.B.2.B | 流水线结构 | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 144 Mbit | 1 | SYNCHRONOUS | 995 mA | Pipelined | 4MX36 | 1.5 mm | 36 | 21 Bit | 144 Mbit | 150994944 bit | Commercial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | 17 mm | 15 mm | ||||||||||||||||||||||||||
![]() | GS8342TT38BD-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 36 Bit | 1 MWords | Synchronous | 1.7 V | 1.8000 V | DDR | FBGA | 500 MHz | 有 | 500 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8342TT38BD-500I | 500 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | BGA | Industrial grade | 表面贴装 | 1.9 V | -40 to 100 °C | Tray | GS8342TT38BD | e0 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 1 | SYNCHRONOUS | 955 mA | Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 19 Bit | SRAM | 36 Mbit | 37748736 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||
![]() | GS882Z36CGB-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 300 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | Commercial grade | 200@Flow-Through/300@Pipelined MHz | FBGA | SDR | 0 to 70 °C | GS882Z36CGB | 9 Mbit | 4 | 165 mA, 225 mA | 5 ns | Flow-Through/Pipelined | 256 k x 36 | 18 Bit | 9 Mbit | Commercial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342QT10BD-357I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Industrial grade | 357 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 357 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8342QT10BD | SigmaQuad-II+ B2 | Memory & Data Storage | 36 Mbit | 2 | 955 mA | Pipelined | 4 M x 9 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8128418B-167 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-119 | YES | 119 | 119 | 2.3, 3 V | Synchronous | 8 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 167 MHz | + 70 C | 3.6 V | 0 C | 10 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | BGA, | 网格排列 | 8000000 | PLASTIC/EPOXY | 未说明 | 8 ns | 70 °C | 无 | GS8128418B-167 | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | BGA | 5.22 | Commercial grade | 125@Flow-Through/167@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 0 to 70 °C | Tray | GS8128418B | e0 | 无 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Lead (Sn/Pb) | PIPELINE AND FLOW THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3V TO 3.6V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | COMMERCIAL | 144 Mbit | 2 | SYNCHRONOUS | 315 mA, 365 mA | 8 ns | Flow-Through/Pipelined | 8 M x 18 | 1.99 mm | 18 | 23 Bit | SRAM | 144 Mbit | 150994944 bit | Commercial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | ||||||||||||
![]() | GS882Z36CGD-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS882Z36CGD-200IV | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | -40 to 85 °C | Tray | GS882Z36CGD | e1 | 有 | 3A991.B.2.B | NBT | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 9 Mbit | 4 | SYNCHRONOUS | 145 mA, 170 mA | 6.5 ns | Flow-Through/Pipelined | 256 k x 36 | 1.4 mm | 36 | 18 Bit | SRAM | 9 Mbit | 9437184 bit | Industrial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||
![]() | GS8662DT20BGD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Commercial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662DT20BGD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 2 | 820 mA | Pipelined | 4 M x 18 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT37BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662TT37BD | SigmaDDR-II+ B2 | Memory & Data Storage | 72 Mbit | 1 | 800 mA | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321Z32AD-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 32 Bit | 2, 2.7 V | 表面贴装 | 有 | 333 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 5 ns | 85 °C | 无 | GS8321Z32AD-333IV | 333 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.16 | BGA | Industrial grade | 200@Flow-Through/333@Pipelined MHz | FBGA | -40 to 100 °C | Tray | GS8321Z32AD | e0 | 无 | 3A991.B.2.B | NBT | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.8/2.5 V | INDUSTRIAL | 36 Mbit | 4 | SYNCHRONOUS | 290 mA, 375 mA | 5 ns | Flow-Through/Pipelined | 1 M x 32 | 3-STATE | 1.4 mm | 32 | 20 Bit | SRAM | 36 Mbit | 0.04 A | 33554432 bit | Industrial | PARALLEL | COMMON | ZBT SRAM | 1.7 V | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||
![]() | GS832272C-133V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-209 | YES | 209 | 209 | LBGA, | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | 8.5 ns | 70 °C | 无 | GS832272C-133V | 524288 words | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | 117.6@Flow-Through/133@Pipelined MHz | FBGA | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 72 Bit | 2, 2.7 V | 133 MHz | + 70 C | 2.7 V | 0 C | 1.7 V | SMD/SMT | Parallel | 0 to 70 °C | GS832272C | 无 | 3A991.B.2.B | FLOW-THROUGH OR PIELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 未说明 | R-PBGA-B209 | 不合格 | COMMERCIAL | 36 Mbit | SYNCHRONOUS | 210 mA, 235 mA | 8.5@Flow-Through/4@P | 512 k x 72 | 1.7 mm | 72 | 19 Bit | 36 | PARALLEL | 缓存SRAM | 2 V | 1.7 V | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||
![]() | GS832272C-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | SyncBurst | N | SDR | Commercial grade | 153.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 72 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 70 C | 0 C | 14 | SMD/SMT | Parallel | GSI技术 | GSI技术 | 0 to 70 °C | Tray | GS832272C | 同步突发 | Memory & Data Storage | 36 Mbit | 8 | 275 mA, 380 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 72 | 19 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT11GE-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | 1.7 V | Synchronous | 9 Bit | 1.9 V | 有 | 500 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | Commercial grade | 0 to 85 °C | Tray | GS81302DT11GE | SigmaQuad-II+ | Memory & Data Storage | 144 Mbit | 1.26 A | 0.45 | 16 M x 9 | SRAM | 144 | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D06BD-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8662D06BD-500I | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.23 | BGA | Industrial grade | 500 MHz | FBGA | QDR | 1.8000 V | -40 to 100 °C | Tray | GS8662D06BD | 3A991.B.2.B | SigmaQuad-II+ | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 900 mA | Pipelined | 8 M x 8 | 1.4 mm | 8 | 21 Bit | SRAM | 72 Mbit | 67108864 bit | Industrial | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||||||
![]() | GS8662D09BGD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaQuad-II | Details | DDR | Commercial grade | 350 MHz | FBGA | QDR | 1.8000 V | Synchronous | 8 MWords | 9 Bit | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | 0 to 85 °C | Tray | GS8662D09BGD | SigmaQuad-II | Memory & Data Storage | 72 Mbit | 2 | 695 mA | Pipelined | 8 M x 9 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM |
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