品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | GS88236CD-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.7, 2.3 V | Synchronous | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 7.5 ns | 85 °C | 无 | GS88236CD-150IV | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.13 | BGA | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | -40 to 85 °C | Tray | GS88236CD | e0 | 无 | 3A991.B.2.B | SCD/DCD Pipeline/Flow Through | Tin/Lead (Sn/Pb) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 9 Mbit | 4 | SYNCHRONOUS | 130 mA, 145 mA | 7.5 ns | Flow-Through/Pipelined | 256 k x 36 | 1.4 mm | 36 | 18 Bit | SRAM | 9 Mbit | 9437184 bit | Industrial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||
![]() | GS8662Q18BGD-357 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 357 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 357 MHz | FBGA | QDR | 0 to 85 °C | 72 Mbit | 2 | 985 mA | Pipelined | 4 M x 18 | 21 Bit | 72 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662QT37BGD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 165 | 165 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8662QT37BGD-200I | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.21 | BGA | Industrial grade | 200 MHz | FBGA | QDR | 1.8000 V | 表面贴装 | 1.9 V | 36 Bit | 2 MWords | Synchronous | 1.7 V | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 2000000 | -40 to 100 °C | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | INDUSTRIAL | 2 | SYNCHRONOUS | Pipelined | 2MX36 | 1.4 mm | 36 | 20 Bit | 72 Mbit | 75497472 bit | Industrial | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | 15 mm | 13 mm | |||||||||||||||||||||||||||||||||
![]() | GS81302TT07E-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | DDR-II | Industrial grade | 300 MHz | FBGA | DDR | 1.8000 V | Synchronous | 16 MWords | 8 Bit | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | -40 to 100 °C | Tray | GS81302TT07E | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 700 mA | Pipelined | 16 M x 8 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT20BGD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662TT20BGD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 1 | 695 mA | Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161Z32DGD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 512 kWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | 375 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | Commercial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 0 to 70 °C | GS8161Z32DGD | 18 Mbit | 4 | 270 mA, 350 mA | 4.2 ns | Flow-Through/Pipelined | 512 k x 32 | 18 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662R08BD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8662R08BD-400I | 400 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | BGA | Industrial grade | 400 MHz | FBGA | -40 to 100 °C | Tray | GS8662R08BD | 3A991.B.2.B | SigmaDDR-II B4 | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 72 Mbit | 1 | SYNCHRONOUS | 635 mA | Pipelined | 8 M x 8 | 3-STATE | 1.4 mm | 8 | 21 Bit | SRAM | 72 Mbit | 67108864 bit | Industrial | PARALLEL | COMMON | 标准SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||
![]() | GS8322Z36AD-375M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | - 55 C | 3.6 V | + 125 C | 375 MHz | 有 | Military grade | 238@Flow-Through/375@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | SDR | NBT SRAM | GSI技术 | GSI技术 | Parallel | SMD/SMT | 2.3 V | 14 | -55 to 125 °C | Tray | GS8322Z36AD | NBT Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 4 | 310 mA, 400 mA | 4.2 ns | Flow-Through/Pipelined | 1 M x 36 | 20 Bit | SRAM | 36 Mbit | Military | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT20BD-550I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 18 Bit | 表面贴装 | Industrial grade | 550 MHz | FBGA | DDR | 1.8000 V | Synchronous | 4 MWords | -40 to 100 °C | 1 | Pipelined | 21 Bit | 72 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8162Z72CC-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Industrial grade | 200@Flow-Through/300@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 300 MHz | + 85 C | 3.6 V | - 40 C | 21 | 2.3 V | SMD/SMT | -40 to 85 °C | Tray | GS8162Z72CC | NBT Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 8 | 300 mA, 425 mA | 5 ns | Flow-Through/Pipelined | 256 k x 72 | 18 Bit | SRAM | 18 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182D19BD-435 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 435 MHz | + 70 C | 1.9 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 无 | GS8182D19BD-435 | 435 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.21 | BGA | Commercial grade | 435 MHz | FBGA | 0 to 70 °C | Tray | GS8182D19BD | e0 | 无 | 3A991.B.2.B | SigmaQuad II+ | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 18 Mbit | 2 | SYNCHRONOUS | 770 mA | Pipelined | 1 M x 18 | 3-STATE | 1.4 mm | 18 | 18 Bit | SRAM | 18 Mbit | 0.19 A | 18874368 bit | Commercial | PARALLEL | SEPARATE | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 10 mm | |||||
![]() | GS816132DD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 32 Bit | 2.7, 3.6 V | 有 | 400 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | 250@Flow-Through/400@Pipelined MHz | -40 to 85 °C | Tray | GS816132DD | Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 300 mA, 385 mA | 4@Flow-Through/2.5@P | 512 k x 32 | 19 Bit | SRAM | 18 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342DT07BD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Industrial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8342DT07BD | SigmaQuad-II+ B4 | Memory & Data Storage | 36 Mbit | 2 | 795 mA | Pipelined | 4 M x 8 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT20BD-450M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaCIO DDR-II | DDR | Military grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 125 C | 1.9 V | - 55 C | 15 | 1.7 V | SMD/SMT | -55 to 125 °C | Tray | GS8662TT20BD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 1 | Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Military | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88037CGT-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 333 MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | 0 to 70 °C | Tray | GS88037CGT | Pipeline | Memory & Data Storage | 9 Mbit | 1 | 240 mA | Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T07BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 有 | GS8342T07BGD-400 | 400 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | Commercial grade | 400 MHz | FBGA | 0 to 85 °C | Tray | GS8342T07BGD | 3A991.B.2.B | SigmaDDR-II+ B2 | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 36 Mbit | 1 | SYNCHRONOUS | 600 mA | Pipelined | 4 M x 8 | 3-STATE | 1.4 mm | 8 | 21 Bit | SRAM | 36 Mbit | 0.215 A | 33554432 bit | Commercial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||
![]() | GS8662QT19BGD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 165 | 165 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8662QT19BGD-200I | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.2 | BGA | Industrial grade | 200 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 4000000 | -40 to 100 °C | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 2 | SYNCHRONOUS | Pipelined | 4MX18 | 1.4 mm | 18 | 21 Bit | 72 Mbit | 75497472 bit | Industrial | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||
![]() | GS840H18AGT-180I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 100 | 100 | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | QFP100,.63X.87 | -40 °C | 未说明 | 8 ns | 85 °C | 有 | GS840H18AGT-180I | 180 MHz | 262144 words | 3.3 V | LQFP | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.35 | QFP | e3 | 有 | 3A991.B.2.B | 纯哑光锡 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3,3.3 V | INDUSTRIAL | SYNCHRONOUS | 0.345 mA | 256KX18 | 3-STATE | 1.6 mm | 18 | 0.03 A | 4718592 bit | PARALLEL | COMMON | 缓存SRAM | 3.14 V | 3.6 V | 3 V | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||
![]() | GS864236B-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | Commercial grade | 133.3@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 14 | 1.7 V | 0 to 70 °C | Tray | GS864236B | SCD/DCD Pipeline/Flow Through | Memory & Data Storage | 72 Mbit | 4 | 230 mA, 310 mA | 7.5 ns | Flow-Through/Pipelined | 2 M x 36 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662DT11BD-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8662DT11BD-500I | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.81 | BGA | Industrial grade | 500 MHz | FBGA | QDR | 1.8000 V | -40 to 100 °C | Tray | GS8662DT11BD | 3A991.B.2.B | SigmaQuad-II+ | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 900 mA | Pipelined | 8 M x 9 | 1.4 mm | 9 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||||||
![]() | GS816118DGT-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | TQFP-100 | YES | 100 | 100 | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 400 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | QFP, | FLATPACK | 1000000 | PLASTIC/EPOXY | 未说明 | 4 ns | 70 °C | 有 | GS816118DGT-400 | 2.5 V | QFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.26 | QFP | Commercial grade | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 0 to 70 °C | Tray | GS816118DGT | 3A991.B.2.B | Pipeline/Flow Through | FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | compliant | R-PQFP-G100 | COMMERCIAL | 18 Mbit | 2 | SYNCHRONOUS | 255 mA, 335 mA | 4 ns | Flow-Through/Pipelined | 1 M x 18 | 18 | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | |||||||||||||||||||||
![]() | GS880F18CGT-6.5IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | QFP100,.63X.87 | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS880F18CGT-6.5IV | 153 MHz | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | QFP | Industrial grade | 153.8 MHz | -40 to 85 °C | Tray | GS880F18CGT | e3 | 有 | 3A991.B.2.B | 流过 | 纯哑光锡 | FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 2.3 V TO 2.7 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 1.8/2.5 V | INDUSTRIAL | 9 Mbit | 2 | SYNCHRONOUS | 125 mA | 6.5 ns | Flow-Through | 512 k x 18 | 3-STATE | 1.6 mm | 18 | SRAM | 9 Mbit | 0.045 A | 9437184 bit | Industrial | PARALLEL | COMMON | 缓存SRAM | 1.7 V | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | ||||
![]() | GS8322Z72GC-225V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 72 Bit | 2, 2.7 V | 表面贴装 | 225 MHz | + 70 C | 2.7 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 143@Flow-Through/225@Pipelined MHz | FBGA | SDR | 0 to 70 °C | GS8322Z72GC | 36 Mbit | 8 | 255 mA, 350 mA | 7 ns | Flow-Through/Pipelined | 512 k x 72 | 19 Bit | 36 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662R36BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 表面贴装 | 400 MHz | + 70 C | 1.9 V | 0 C | Parallel | SMD/SMT | 1.7 V | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | Synchronous | 2 MWords | 36 Bit | 0 to 85 °C | 72 Mbit | 1 | 800 mA | Pipelined | 2 M x 36 | 21 Bit | 72 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662DT19BD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Industrial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8662DT19BD | SigmaQuad-II+ B4 | Memory & Data Storage | 72 Mbit | 2 | 590 mA | Pipelined | 4 M x 18 | 20 Bit | SRAM | 72 Mbit | Industrial | SRAM |
GS88236CD-150IV
GSI Technology
分类:Memory
GS8662Q18BGD-357
GSI Technology
分类:Memory
GS8662QT37BGD-200I
GSI Technology
分类:Memory
GS81302TT07E-300I
GSI Technology
分类:Memory
GS8662TT20BGD-450
GSI Technology
分类:Memory
GS8161Z32DGD-375
GSI Technology
分类:Memory
GS8662R08BD-400I
GSI Technology
分类:Memory
GS8322Z36AD-375M
GSI Technology
分类:Memory
GS8662TT20BD-550I
GSI Technology
分类:Memory
GS8162Z72CC-300I
GSI Technology
分类:Memory
GS8182D19BD-435
GSI Technology
分类:Memory
GS816132DD-400I
GSI Technology
分类:Memory
GS8342DT07BD-450I
GSI Technology
分类:Memory
GS8662TT20BD-450M
GSI Technology
分类:Memory
GS88037CGT-333
GSI Technology
分类:Memory
GS8342T07BGD-400
GSI Technology
分类:Memory
GS8662QT19BGD-200I
GSI Technology
分类:Memory
GS840H18AGT-180I
GSI Technology
分类:Memory
GS864236B-200V
GSI Technology
分类:Memory
GS8662DT11BD-500I
GSI Technology
分类:Memory
GS816118DGT-400
GSI Technology
分类:Memory
GS880F18CGT-6.5IV
GSI Technology
分类:Memory
GS8322Z72GC-225V
GSI Technology
分类:Memory
GS8662R36BGD-400
GSI Technology
分类:Memory
GS8662DT19BD-300I
GSI Technology
分类:Memory
