品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8128036GT-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | Details | 200 MHz | Parallel | 2.3 V | - 40 C | + 100 C | SMD/SMT | SDR | 有 | 15 | SyncBurst | 3.6 V | Tray | GS8128036GT | Pipeline/Flow Through | 144 Mbit | 350 mA, 420 mA | 6.5 ns | 4 M x 36 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D06GE-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | 400 MHz | GS81302D06GE | 144 Mbit | 1.065 A | 16 M x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT20E-450M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SigmaQuad-II+ | QDR-II | 有 | 450 MHz | + 125 C | 1.9 V | - 55 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | Tray | GS81302DT20E | SigmaQuad-II+ | Memory & Data Storage | 144 Mbit | 8 M x 18 | SRAM | 144 | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS82582T38GE-550I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | Details | 550 MHz | Parallel | 1.7 V | - 40 C | + 85 C | SMD/SMT | DDR-II | 有 | 10 | SigmaDDR-II+ | 1.9 V | Tray | GS82582T38GE | SigmaDDR-II+ | 288 Mbit | 1.07 A | 8 M x 36 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS82582D20GE-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | Details | 450 MHz | Parallel | 1.7 V | - 40 C | + 100 C | SMD/SMT | DDR | 有 | 10 | SigmaQuad-II+ | 1.9 V | Tray | GS82582D20GE | SigmaQuad-II+ | 288 Mbit | 1 A | 16 M x 18 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662DT11BGD-550 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | Details | 550 MHz | Parallel | 1.7 V | 0 C | + 70 C | SMD/SMT | DDR | 有 | 15 | SigmaQuad-II+ | 1.9 V | Tray | GS8662DT11BGD | SigmaQuad-II+ | 72 Mbit | 8 M x 9 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T19BGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662S09BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | GSI技术 | GSI技术 | SigmaSIO DDR-II | Details | DDR | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | Tray | GS8662S09BGD | SigmaSIO DDR-II | Memory & Data Storage | 72 Mbit | 745 mA | 8 M x 9 | SRAM | 72 | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS82564Z18GD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | 333 MHz | Parallel | 2.3 V | - 40 C | + 100 C | SMD/SMT | SDR | 有 | 10 | NBT SRAM | 3.6 V | , | 未说明 | 有 | GS82564Z18GD-333I | 活跃 | GSI TECHNOLOGY | 5.69 | Details | -40 to 100 °C | Tray | GS82564Z18GD | NBT Pipeline/Flow Through | 未说明 | compliant | 288 Mbit | 530 mA, 670 mA | 4.5 ns | 16 M x 18 | ZBT SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662S36BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | 333 MHz | GS8662S36BGD | 72 Mbit | 810 mA | 2 M x 36 | 72 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT20BD-550I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SigmaDDR-II+ | DDR | 有 | 550 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | Tray | GS8342TT20BD | SigmaQuad-II+ | Memory & Data Storage | 36 Mbit | 810 mA | 2 M x 18 | SRAM | 36 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D07BGD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | 450 MHz | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8662D07BGD | SigmaQuad-II+ B4 | Memory & Data Storage | 72 Mbit | 2 | 830 mA | Pipelined | 8 M x 8 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182R36BD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182R36BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T36BGD-167 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88237CB-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 200 MHz | + 85 C | 3.6 V | - 40 C | 42 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | BGA, | 网格排列 | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 2.7 ns | 85 °C | 无 | GS88237CB-200I | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 1.68 | BGA | Industrial grade | 200 MHz | FBGA | SDR | -40 to 85 °C | Tray | GS88237CB | e0 | 无 | 3A991.B.2.B | SCD/DCD Pipeline | Tin/Lead (Sn/Pb) | PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 9 Mbit | 2 | SYNCHRONOUS | 190 mA | 2.7 ns | Pipelined | 256 k x 36 | 1.77 mm | 36 | 18 Bit | SRAM | 9 Mbit | 9437184 bit | Industrial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | ||||||||||
![]() | GS74116AGX-12 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | BGA-48 | YES | 48 | 48 | 16 Bit | 3.6 V | 表面贴装 | 有 | - | + 70 C | 3.6 V | 0 C | 135 | 3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | Details | SDR | TFBGA, BGA48,6X8,30 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | 256000 | PLASTIC/EPOXY | BGA48,6X8,30 | 未说明 | 12 ns | 70 °C | 有 | GS74116AGX-12 | 3.3 V | TFBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.66 | BGA | Commercial grade | FBGA | 3.3000 V | 3 V | Asynchronous | 256 kWords | 0 to 70 °C | GS74116AGX | e1 | 有 | 3A991.B.2.B | Asynchronous | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 0.75 mm | compliant | R-PBGA-B48 | 不合格 | 3.3 V | COMMERCIAL | 4 Mbit | 1 | ASYNCHRONOUS | 90 mA | 12 ns | 256 k x 16 | 3-STATE | 1.2 mm | 16 | 18 Bit | SRAM | 4 Mbit | 0.01 A | 4194304 bit | Commercial | PARALLEL | COMMON | 标准SRAM | 3 V | 3.6 V | 3 V | SRAM | 10 mm | 6 mm | ||||||||||
![]() | GS816032DGT-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | 181.8@Flow-Through/250@Pipelined MHz | 2.5, 3.3 V | 2.3, 3 V | 32 Bit | 2.7, 3.6 V | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | -40 to 100 °C | Tray | GS816032DGT | Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 250 mA, 270 mA | 5.5@Flow-Through/2.5 | 512 k x 32 | SRAM | 18 | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88037CGT-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 250 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | QFP100,.63X.87 | -40 °C | 未说明 | 2.3 ns | 85 °C | 有 | GS88037CGT-250I | 250 MHz | 2.5 V | LQFP | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.24 | QFP | Industrial grade | 250 MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | -40 to 85 °C | GS88037CGT | e3 | 有 | 3A991.B.2.B | 纯哑光锡 | PIPELINED ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | 8542.32.00.41 | SRAMs | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 9 Mbit | 1 | SYNCHRONOUS | 215 mA | 2.3 ns | Pipelined | 256 k x 36 | 3-STATE | 1.6 mm | 36 | 18 Bit | 9 Mbit | 0.045 A | 9437184 bit | Industrial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | 20 mm | 14 mm | ||||||||||||
![]() | GS8673ED36BGK-675 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-260 | YES | 260 | 260 | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 2000000 | PLASTIC/EPOXY | 85 °C | 有 | GS8673ED36BGK-675 | 1.35 V | HBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.44 | Commercial grade | 675/450 MHz | BGA | QDR | 1.3500 V | Synchronous | 2 MWords | 36 Bit | 表面贴装 | 675 MHz | + 85 C | 1.4 V | 0 C | 1.3 V | SMD/SMT | Parallel | 0 to 70 °C | GS8673ED36BGK | 3A991.B.2.B | 8542.32.00.41 | CMOS | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B260 | OTHER | 72 Mbit | SYNCHRONOUS | 3.17 A | 400 ps | Pipelined | 2 M x 36 | 2.3 mm | 36 | 19 Bit | 72 Mbit | 75497472 bit | Commercial | PARALLEL | DDR SRAM | 1.4 V | 1.3 V | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||
![]() | GS864018GT-167I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 4 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 167 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 3 | 4000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 8 ns | 85 °C | 有 | GS864018GT-167I | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.37 | QFP | Industrial grade | 125@Flow-Through/167@Pipelined MHz | TQFP | -40 to 85 °C | Tray | GS864018GT | e3 | 有 | 3A991.B.2.B | Pipeline/Flow Through | 纯哑光锡 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 215 mA, 260 mA | 8 ns | Flow-Through/Pipelined | 4 M x 18 | 1.6 mm | 18 | 22 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | |||||||||
![]() | GS8662Q36E-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 165 | 165 | Obsolete | GSI技术 | RECTANGULAR | LBGA | 1.8 V | 2097152 words | GS8662Q36E-250 | 无 | 70 °C | 0.45 ns | 未说明 | PLASTIC/EPOXY | 2000000 | 3 | GRID ARRAY, LOW PROFILE | 15 X 17 MM, 1 MM PITCH, FPBGA-165 | BGA | 5.71 | GSI TECHNOLOGY | 无 | 3A991.B.2.B | 流水线结构 | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | SYNCHRONOUS | 2MX36 | 1.5 mm | 36 | 75497472 bit | PARALLEL | 标准SRAM | 1.9 V | 1.7 V | 17 mm | 15 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q36E-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 165 | 165 | 2000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 无 | GS8662Q36E-200 | 2097152 words | 1.8 V | LBGA | RECTANGULAR | GSI技术 | Obsolete | GSI TECHNOLOGY | 5.74 | BGA | 15 X 17 MM, 1 MM PITCH, FPBGA-165 | GRID ARRAY, LOW PROFILE | 3 | 无 | 3A991.B.2.B | 流水线结构 | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | SYNCHRONOUS | 2MX36 | 1.5 mm | 36 | 75497472 bit | PARALLEL | 标准SRAM | 1.9 V | 1.7 V | 17 mm | 15 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS84032CGT-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | Details | 200 MHz | Parallel | 2.3 V | - 40 C | + 85 C | SMD/SMT | SDR | 有 | 72 | SyncBurst | 3.6 V | Tray | GS84032CGT | Pipeline/Flow Through | 4 Mbit | 160 mA, 190 mA | 6.5 ns | 128 k x 32 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8128236GD-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | Details | 200 MHz | Parallel | 2.3 V | - 40 C | + 100 C | SMD/SMT | SDR | 有 | 10 | SyncBurst | 3.6 V | Tray | GS8128236GD | SCD/DCD Pipeline/Flow Through | 144 Mbit | 350 mA, 420 mA | 6.5 ns | 4 M x 36 |
GS8128036GT-200IV
GSI Technology
分类:Memory
GS81302D06GE-400I
GSI Technology
分类:Memory
GS81302DT20E-450M
GSI Technology
分类:Memory
GS82582T38GE-550I
GSI Technology
分类:Memory
GS82582D20GE-450I
GSI Technology
分类:Memory
GS8662DT11BGD-550
GSI Technology
分类:Memory
GS8182T19BGD-300
GSI Technology
分类:Memory
GS8662S09BGD-400I
GSI Technology
分类:Memory
GS82564Z18GD-333I
GSI Technology
分类:Memory
GS8662S36BGD-333
GSI Technology
分类:Memory
GS8342TT20BD-550I
GSI Technology
分类:Memory
GS8662D07BGD-450I
GSI Technology
分类:Memory
GS8182R36BD-250I
GSI Technology
分类:Memory
GS8182R36BD-333I
GSI Technology
分类:Memory
GS8182T36BGD-167
GSI Technology
分类:Memory
GS88237CB-200I
GSI Technology
分类:Memory
GS74116AGX-12
GSI Technology
分类:Memory
GS816032DGT-250I
GSI Technology
分类:Memory
GS88037CGT-250I
GSI Technology
分类:Memory
GS8673ED36BGK-675
GSI Technology
分类:Memory
GS864018GT-167I
GSI Technology
分类:Memory
GS8662Q36E-250
GSI Technology
分类:Memory
GS8662Q36E-200
GSI Technology
分类:Memory
GS84032CGT-200I
GSI Technology
分类:Memory
GS8128236GD-200IV
GSI Technology
分类:Memory
