品牌是'IDT' (3177)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

安装类型

包装/外壳

表面安装

供应商器件包装

终端数量

操作温度

包装

系列

JESD-609代码

无铅代码

零件状态

ECCN 代码

端子表面处理

附加功能

HTS代码

子类别

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

功能

最大电流源

资历状况

电源电压-最大值(Vsup)

电源

温度等级

电源电压-最小值(Vsup)

内存大小

操作模式

电源电流-最大值

访问时间

数据率

组织结构

输出特性

座位高度-最大

内存宽度

待机电流-最大值

记忆密度

筛选水平

并行/串行

内存IC类型

总线定向

重传能力

FWFT支持

备用内存宽度

可编程标志支持

输出启用

扩展类型

周期

长度

宽度

72V223L7-5PFI8
72V223L7-5PFI8
IDT 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

80-LQFP

80-TQFP (14x14)

-40°C ~ 85°C

72V

Obsolete

3.15V ~ 3.45V

Synchronous

35mA

9K (512 x 18)(1K x 9)

5ns

133.3MHz

Uni-Directional

Depth, Width

72271L15PF
72271L15PF
IDT 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

64-LQFP

64-TQFP (14x14)

0°C ~ 70°C

7200

Obsolete

4.5V ~ 5.5V

Synchronous

75mA

288K (32K x 9)

10ns

66.7MHz

Uni-Directional

Depth, Width

72T1895L4-4BBI
72T1895L4-4BBI
IDT 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

144-BGA

144-PBGA (13x13)

-40°C ~ 85°C

72T

Obsolete

2.375V ~ 2.625V

Synchronous

60mA

1.125M (64K x 18)(128K x 9)

3.6ns

200MHz

Uni-Directional

Depth, Width

72V263L7-5PFI8
72V263L7-5PFI8
IDT 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

80-LQFP

80-TQFP (14x14)

-40°C ~ 85°C

72V

Obsolete

3.15V ~ 3.45V

Synchronous

35mA

144K (8K x 18)(16K x 9)

5ns

133.3MHz

Uni-Directional

Depth, Width

72V205L15TFGI
72V205L15TFGI
IDT 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

64-LQFP

64-TQFP (10x10)

-40°C ~ 85°C

72V

Preliminary

3V ~ 3.6V

Synchronous

30mA

4.5K (256 x 18)

10ns

66.7MHz

Uni-Directional

Depth, Width

7202LA20JG
7202LA20JG
IDT 数据表

N/A

-

最小起订量: 1

最小包装量: 1

IDT7204L15J8
IDT7204L15J8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

32

PLASTIC, LCC-32

CHIP CARRIER

1

4000

PLASTIC/EPOXY

LDCC32,.5X.6

20

15 ns

70 °C

IDT7204L15J8

40 MHz

4096 words

5 V

QCCJ

RECTANGULAR

Integrated Device Technology Inc

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

5.09

QFJ

e0

EAR99

Tin/Lead (Sn85Pb15)

RETRANSMIT

8542.32.00.71

FIFOs

CMOS

QUAD

J BEND

225

1

1.27 mm

not_compliant

32

R-PQCC-J32

不合格

5.5 V

5 V

COMMERCIAL

4.5 V

ASYNCHRONOUS

4KX9

3-STATE

3.556 mm

9

0.002 A

36864 bit

PARALLEL

其他先进先出

NO

25 ns

13.9954 mm

11.4554 mm

IDT72V2103L10PF
IDT72V2103L10PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

80

PLASTIC, TQFP-80

FLATPACK, LOW PROFILE

3

128000

PLASTIC/EPOXY

QFP80,.64SQ

20

6.5 ns

70 °C

IDT72V2103L10PF

100 MHz

131072 words

3.3 V

LQFP

SQUARE

Integrated Device Technology Inc

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

5.3

QFP

e0

EAR99

Tin/Lead (Sn85Pb15)

ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE

8542.32.00.71

FIFOs

CMOS

QUAD

鸥翼

240

1

0.65 mm

not_compliant

80

S-PQFP-G80

不合格

3.45 V

3.3 V

COMMERCIAL

3.15 V

SYNCHRONOUS

0.035 mA

128KX18

1.6 mm

18

0.015 A

2359296 bit

PARALLEL

其他先进先出

9

YES

10 ns

14 mm

14 mm

723633L12PFG
723633L12PFG
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

128-LQFP

128-TQFP (14x20)

0°C ~ 70°C

Tray

7200

活跃

4.5V ~ 5.5V

Synchronous

400mA

18K (512 x 36)

8ns

83MHz

Bi-Directional

Depth, Width

IDT72V241L15PF8
IDT72V241L15PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

32

PLASTIC, TQFP-32

FLATPACK, LOW PROFILE

3

4000

PLASTIC/EPOXY

QFP32,.35SQ,32

20

10 ns

70 °C

IDT72V241L15PF8

66.7 MHz

4096 words

3.3 V

LQFP

SQUARE

Integrated Device Technology Inc

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

5.19

QFP

e0

EAR99

Tin/Lead (Sn85Pb15)

8542.32.00.71

FIFOs

CMOS

QUAD

鸥翼

225

1

0.8 mm

not_compliant

32

S-PQFP-G32

不合格

3.6 V

3.3 V

COMMERCIAL

3 V

SYNCHRONOUS

0.02 mA

4KX9

1.6 mm

9

0.005 A

36864 bit

PARALLEL

其他先进先出

YES

15 ns

7 mm

7 mm

IDT72V2103L15PFG
IDT72V2103L15PFG
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

80

LQFP, QFP80,.64SQ

FLATPACK, LOW PROFILE

3

128000

PLASTIC/EPOXY

QFP80,.64SQ

30

10 ns

70 °C

IDT72V2103L15PFG

66.7 MHz

131072 words

3.3 V

LQFP

SQUARE

Integrated Device Technology Inc

活跃

INTEGRATED DEVICE TECHNOLOGY INC

5.41

QFP

e3

EAR99

Matte Tin (Sn) - annealed

ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE

8542.32.00.71

FIFOs

CMOS

QUAD

鸥翼

260

1

0.65 mm

compliant

80

S-PQFP-G80

不合格

3.45 V

3.3 V

COMMERCIAL

3.15 V

SYNCHRONOUS

0.035 mA

128KX18

1.6 mm

18

0.015 A

2359296 bit

PARALLEL

其他先进先出

9

YES

15 ns

14 mm

14 mm

IDT72V201L15PF
IDT72V201L15PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

32

PLASTIC, TQFP-32

FLATPACK, LOW PROFILE

3

256

PLASTIC/EPOXY

QFP32,.35SQ,32

20

10 ns

70 °C

IDT72V201L15PF

66.7 MHz

256 words

3.3 V

LQFP

SQUARE

Integrated Device Technology Inc

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

7.69

QFP

e0

EAR99

Tin/Lead (Sn85Pb15)

8542.32.00.71

FIFOs

CMOS

QUAD

鸥翼

225

1

0.8 mm

not_compliant

32

S-PQFP-G32

不合格

3.6 V

3.3 V

COMMERCIAL

3 V

SYNCHRONOUS

0.02 mA

256X9

1.6 mm

9

0.005 A

2304 bit

PARALLEL

其他先进先出

YES

15 ns

7 mm

7 mm

IDT7202LA12P
IDT7202LA12P
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

28

0.600 INCH, PLASTIC, DIP-28

IN-LINE

1

1000

PLASTIC/EPOXY

DIP28,.6

20

12 ns

70 °C

IDT7202LA12P

50 MHz

1024 words

5 V

DIP

RECTANGULAR

Integrated Device Technology Inc

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

5.24

DIP

e0

EAR99

Tin/Lead (Sn85Pb15)

RETRANSMIT

8542.32.00.71

FIFOs

CMOS

DUAL

THROUGH-HOLE

240

1

2.54 mm

not_compliant

28

R-PDIP-T28

不合格

5.5 V

5 V

COMMERCIAL

4.5 V

ASYNCHRONOUS

0.125 mA

1KX9

3-STATE

4.699 mm

9

0.0005 A

9216 bit

PARALLEL

其他先进先出

NO

20 ns

36.576 mm

15.24 mm

IDT7204L15P
IDT7204L15P
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

28

PLASTIC, DIP-28

IN-LINE

1

4000

PLASTIC/EPOXY

DIP28,.6

20

15 ns

70 °C

IDT7204L15P

40 MHz

4096 words

5 V

DIP

RECTANGULAR

Integrated Device Technology Inc

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

5.05

DIP

e0

EAR99

Tin/Lead (Sn85Pb15)

RETRANSMIT

8542.32.00.71

FIFOs

CMOS

DUAL

THROUGH-HOLE

240

1

2.54 mm

not_compliant

28

R-PDIP-T28

不合格

5.5 V

5 V

COMMERCIAL

4.5 V

ASYNCHRONOUS

0.12 mA

4KX9

3-STATE

4.699 mm

9

0.002 A

36864 bit

PARALLEL

其他先进先出

NO

25 ns

36.576 mm

15.24 mm

IDT7208L20JG
IDT7208L20JG
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

32

PLASTIC/EPOXY

30

20 ns

70 °C

IDT7208L20JG

65536 words

5 V

QCCJ

RECTANGULAR

Integrated Device Technology Inc

活跃

INTEGRATED DEVICE TECHNOLOGY INC

5.43

QFJ

QCCJ,

CHIP CARRIER

64000

e3

EAR99

哑光锡

RETRANSMIT

8542.32.00.71

CMOS

QUAD

J BEND

260

1

1.27 mm

compliant

32

R-PQCC-J32

不合格

5.5 V

COMMERCIAL

4.5 V

ASYNCHRONOUS

64KX9

3.556 mm

9

589824 bit

PARALLEL

NO

30 ns

13.9954 mm

11.4554 mm

IDT7201LA12TP
IDT7201LA12TP
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

28

IDT7201LA12TP

512 words

5 V

DIP

RECTANGULAR

Rochester Electronics LLC

接触制造商

ROCHESTER ELECTRONICS LLC

5.22

DIP,

IN-LINE

512

PLASTIC/EPOXY

12 ns

70 °C

e0

EAR99

锡铅

RETRANSMIT

8542.32.00.71

CMOS

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

R-PDIP-T28

5.5 V

COMMERCIAL

4.5 V

ASYNCHRONOUS

512X9

4.572 mm

9

4608 bit

PARALLEL

NO

20 ns

34.671 mm

7.62 mm

IDT72V36110L7-5PF
IDT72V36110L7-5PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

128

PLASTIC, TQFP-128

FLATPACK, LOW PROFILE, FINE PITCH

3

128000

PLASTIC/EPOXY

QFP128,.63X.87,20

20

5 ns

70 °C

IDT72V36110L7-5PF

133.3 MHz

131072 words

3.3 V

LFQFP

RECTANGULAR

Integrated Device Technology Inc

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

5.19

QFP

e0

EAR99

Tin/Lead (Sn85Pb15)

RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE

8542.32.00.71

FIFOs

CMOS

QUAD

鸥翼

240

1

0.5 mm

not_compliant

128

R-PQFP-G128

不合格

3.45 V

3.3 V

COMMERCIAL

3.15 V

SYNCHRONOUS

0.04 mA

128KX36

1.6 mm

36

0.015 A

4718592 bit

PARALLEL

其他先进先出

YES

7.5 ns

20 mm

14 mm

IDT72T36125L5BBI
IDT72T36125L5BBI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

240

BGA, BGA240,18X18,40

网格排列

3

256000

PLASTIC/EPOXY

BGA240,18X18,40

-40 °C

20

3.6 ns

85 °C

IDT72T36125L5BBI

200 MHz

262144 words

2.5 V

BGA

SQUARE

Integrated Device Technology Inc

活跃

IDT IDT72T36125L5BBI, FIFO Memory, Dual, 256K x 36 bit, Uni-Directional 10ns 200MHz, 2.375 u2192 2.625 V, 240-Pin BGA

INTEGRATED DEVICE TECHNOLOGY INC

5.24

BGA

e0

EAR99

Tin/Lead (Sn63Pb37)

可进行异步操作

8542.32.00.71

FIFOs

CMOS

BOTTOM

BALL

225

1

1 mm

not_compliant

240

S-PBGA-B240

不合格

2.625 V

1.5/2.5,2.5 V

INDUSTRIAL

2.375 V

SYNCHRONOUS

0.06 mA

256KX36

1.97 mm

36

0.01 A

9437184 bit

PARALLEL

其他先进先出

YES

5 ns

19 mm

19 mm

IDT72V3680L6PFG
IDT72V3680L6PFG
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

128

LFQFP, QFP128,.63X.87,20

FLATPACK, LOW PROFILE, FINE PITCH

3

16000

PLASTIC/EPOXY

QFP128,.63X.87,20

30

4 ns

70 °C

IDT72V3680L6PFG

166 MHz

16384 words

3.3 V

LFQFP

RECTANGULAR

Integrated Device Technology Inc

活跃

INTEGRATED DEVICE TECHNOLOGY INC

5.17

QFP

e3

EAR99

Matte Tin (Sn) - annealed

RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE

8542.32.00.71

FIFOs

CMOS

QUAD

鸥翼

260

1

0.5 mm

compliant

128

R-PQFP-G128

不合格

3.45 V

3.3 V

COMMERCIAL

3.15 V

SYNCHRONOUS

0.04 mA

16KX36

1.6 mm

36

0.015 A

589824 bit

PARALLEL

其他先进先出

YES

6 ns

20 mm

14 mm

72V3643L10PFG
72V3643L10PFG
IDT 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

128-LQFP

128-TQFP (14x20)

0°C ~ 70°C

Tray

72V

活跃

3.15V ~ 3.6V

Synchronous

400mA

36K (1K x 36)

6.5ns

100MHz

Uni-Directional

Depth, Width

72V241L15PFGI8
72V241L15PFGI8
IDT 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

32-LQFP

32-TQFP (7x7)

-40°C ~ 85°C

72V

活跃

3V ~ 3.6V

Synchronous

20mA

36K (4K x 9)

10ns

66.7MHz

Uni-Directional

Depth, Width

7201LA50JG
7201LA50JG
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

32

活跃

INTEGRATED DEVICE TECHNOLOGY INC

QFJ

QCCJ, LDCC32,.5X.6

5.15

50 ns

15 MHz

1

512 words

512

70 °C

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

5 V

30

7201LA50JG

e3

EAR99

Matte Tin (Sn) - annealed

RETRANSMIT

8542.32.00.71

QUAD

J BEND

260

1

1.27 mm

compliant

32

R-PQCC-J32

不合格

5.5 V

5 V

COMMERCIAL

4.5 V

ASYNCHRONOUS

0.08 mA

512X9

3.55 mm

9

0.005 A

4608 bit

PARALLEL

其他先进先出

NO

65 ns

13.97 mm

11.43 mm

IDT77301
IDT77301
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LFQFP,

8 ns

128 words

128

PLASTIC/EPOXY

e0

EAR99

锡铅

8542.32.00.71

QUAD

鸥翼

1

0.5 mm

compliant

100

S-PQFP-G100

不合格

SYNCHRONOUS

128X9

1.6 mm

9

1152 bit

PARALLEL

YES

12.5 ns

14 mm

14 mm

IDT72215LB10TFG
IDT72215LB10TFG
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

64

SQUARE

QFP64,.47SQ,20

LFQFP

PLASTIC/EPOXY

70 °C

512

512 words

3

100 MHz

6.5 ns

LFQFP, QFP64,.47SQ,20

QFP

INTEGRATED DEVICE TECHNOLOGY INC

Transferred

5 V

FLATPACK, LOW PROFILE, FINE PITCH

e3

EAR99

Matte Tin (Sn) - annealed

8542.32.00.71

QUAD

鸥翼

260

1

0.5 mm

compliant

30

64

S-PQFP-G64

不合格

5.5 V

COMMERCIAL

4.5 V

SYNCHRONOUS

0.06 mA

512X18

1.6 mm

18

0.005 A

9216 bit

PARALLEL

其他先进先出

YES

10 ns

10 mm

10 mm

IDT72200L25TCB
IDT72200L25TCB
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

28

0.300 INCH, THIN, SIDE BRAZED, DIP-28

15 ns

40 MHz

256 words

256

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP28,.3

RECTANGULAR

IN-LINE

5 V

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

DIP

e0

EAR99

锡铅

8542.32.00.71

DUAL

THROUGH-HOLE

1

2.54 mm

not_compliant

28

R-CDIP-T28

不合格

5.5 V

MILITARY

4.5 V

SYNCHRONOUS

0.04 mA

256X8

3-STATE

5.08 mm

8

0.005 A

2048 bit

MIL-STD-883 Class B

PARALLEL

其他先进先出

YES

25 ns

35.56 mm

7.62 mm