品牌是'IDT' (6623)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

终端数量

操作温度

包装

系列

JESD-609代码

无铅代码

零件状态

湿度敏感性等级(MSL)

ECCN 代码

端子表面处理

附加功能

HTS代码

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

JESD-30代码

资历状况

温度等级

内存大小

端口的数量

操作模式

电源电流-最大值

访问时间

内存格式

内存接口

组织结构

输出特性

座位高度-最大

内存宽度

写入周期时间 - 字符、页面

待机电流-最大值

记忆密度

筛选水平

并行/串行

I/O类型

内存IC类型

待机电压-最小值

电压 - 供电 (最大值)

电压 - 供电 (最小值)

输出启用

长度

宽度

IDT61970S20P
IDT61970S20P
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

22

22

INTEGRATED DEVICE TECHNOLOGY INC

DIP

0.300 INCH, PLASTIC, DIP-22

20 ns

4096 words

4000

70 °C

PLASTIC/EPOXY

DIP

DIP22,.3

RECTANGULAR

IN-LINE

5 V

Obsolete

e0

EAR99

锡铅

8542.32.00.41

DUAL

THROUGH-HOLE

1

2.54 mm

not_compliant

R-PDIP-T22

不合格

COMMERCIAL

1

ASYNCHRONOUS

0.12 mA

4KX4

3-STATE

4.191 mm

4

0.02 A

16384 bit

PARALLEL

COMMON

标准SRAM

4.5 V

5.5 V

4.5 V

YES

26.797 mm

7.62 mm

IDT70V27L25PFGI
IDT70V27L25PFGI
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

100

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LFQFP,

25 ns

3

32768 words

32000

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.3 V

e3

EAR99

Matte Tin (Sn)

8542.32.00.41

QUAD

鸥翼

未说明

1

0.5 mm

compliant

未说明

S-PQFP-G100

不合格

INDUSTRIAL

ASYNCHRONOUS

32KX16

1.6 mm

16

524288 bit

PARALLEL

MULTI-PORT SRAM

3.6 V

3 V

14 mm

14 mm

IDT70V24L25PFGI
IDT70V24L25PFGI
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

100

Transferred

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LFQFP, QFP100,.63SQ,20

25 ns

3

4096 words

4000

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.3 V

e3

EAR99

Matte Tin (Sn) - annealed

8542.32.00.41

QUAD

鸥翼

260

1

0.5 mm

compliant

30

S-PQFP-G100

不合格

INDUSTRIAL

2

ASYNCHRONOUS

0.18 mA

4KX16

3-STATE

1.6 mm

16

0.0025 A

65536 bit

PARALLEL

COMMON

MULTI-PORT SRAM

3 V

3.6 V

3 V

14 mm

14 mm

IDT71256L30DB
IDT71256L30DB
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

28

28

32000

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

5 V

30 ns

0.600 INCH, CERDIP-28

DIP

INTEGRATED DEVICE TECHNOLOGY INC

Obsolete

32768 words

e0

3A001.A.2.C

锡铅

8542.32.00.41

DUAL

THROUGH-HOLE

1

2.54 mm

not_compliant

R-GDIP-T28

不合格

MILITARY

1

ASYNCHRONOUS

0.125 mA

32KX8

3-STATE

5.08 mm

8

0.0005 A

262144 bit

38535Q/M;38534H;883B

PARALLEL

COMMON

标准SRAM

2 V

5.5 V

4.5 V

YES

37.211 mm

15.24 mm

IDT7133L70GB
IDT7133L70GB
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

68

68

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

PGA

CAVITY-UP, CERAMIC, PGA-68

70 ns

2048 words

2000

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

PGA

PGA68,11X11

SQUARE

网格排列

5 V

e0

3A001.A.2.C

锡铅

AUTOMATIC POWER-DOWN

8542.32.00.41

PERPENDICULAR

PIN/PEG

1

2.54 mm

not_compliant

S-CPGA-P68

不合格

MILITARY

2

ASYNCHRONOUS

0.24 mA

2KX16

3-STATE

5.207 mm

16

0.004 A

32768 bit

38535Q/M;38534H;883B

PARALLEL

COMMON

MULTI-PORT SRAM

2 V

5.5 V

4.5 V

YES

29.464 mm

29.464 mm

IDT6167SA25Y
IDT6167SA25Y
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

20

20

INTEGRATED DEVICE TECHNOLOGY INC

SOJ

0.300 INCH, 1.27 MM PITCH, PLASTIC, SOJ-20

25 ns

16384 words

16000

70 °C

PLASTIC/EPOXY

SOJ

SOJ20,.34

RECTANGULAR

小概要

5 V

Obsolete

e0

EAR99

锡铅

8542.32.00.41

DUAL

J BEND

1

1.27 mm

not_compliant

R-PDSO-J20

不合格

COMMERCIAL

1

ASYNCHRONOUS

0.1 mA

16KX1

3-STATE

3.556 mm

1

0.005 A

16384 bit

PARALLEL

SEPARATE

标准SRAM

4.5 V

5.5 V

4.5 V

NO

12.8524 mm

7.5184 mm

IDT7005S25JB
IDT7005S25JB
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

68

68

Transferred

INTEGRATED DEVICE TECHNOLOGY INC

LCC

QCCJ, LDCC68,1.0SQ

25 ns

1

8192 words

8000

125 °C

-55 °C

PLASTIC/EPOXY

QCCJ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

5 V

e0

3A001.A.2.C

锡铅

8542.32.00.41

QUAD

J BEND

225

1

1.27 mm

not_compliant

20

S-PQCC-J68

不合格

MILITARY

2

ASYNCHRONOUS

0.34 mA

8KX8

3-STATE

4.572 mm

8

0.03 A

65536 bit

PARALLEL

COMMON

MULTI-PORT SRAM

4.5 V

5.5 V

4.5 V

24.2062 mm

24.2062 mm

IDT7188S45DB
IDT7188S45DB
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

22

22

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

DIP

DIP, DIP22,.3

45 ns

16384 words

16000

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

DIP22,.3

RECTANGULAR

IN-LINE

5 V

e0

3A001.A.2.C

锡铅

8542.32.00.41

DUAL

THROUGH-HOLE

1

2.54 mm

not_compliant

R-GDIP-T22

不合格

MILITARY

1

ASYNCHRONOUS

0.14 mA

16KX4

3-STATE

5.08 mm

4

0.02 A

65536 bit

MIL-STD-883 Class B

PARALLEL

COMMON

标准SRAM

4.5 V

5.5 V

4.5 V

NO

27.051 mm

7.62 mm

IDT7130LA55PFI
IDT7130LA55PFI
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

64

64

5 V

FLATPACK, LOW PROFILE

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

QFP

TQFP-64

55 ns

3

1024 words

1000

85 °C

-40 °C

PLASTIC/EPOXY

LQFP

QFP64,.66SQ,32

SQUARE

e0

EAR99

锡铅

8542.32.00.41

QUAD

鸥翼

240

1

0.8 mm

not_compliant

30

S-PQFP-G64

不合格

INDUSTRIAL

2

ASYNCHRONOUS

0.14 mA

1KX8

3-STATE

1.6 mm

8

0.004 A

8192 bit

PARALLEL

COMMON

MULTI-PORT SRAM

2 V

5.5 V

4.5 V

14 mm

14 mm

IDT70T659S10BFGI
IDT70T659S10BFGI
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

208

208

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

BGA

15 X 15 MM, 1.40 MM PITCH, GREEN, FBGA-208

10 ns

3

131072 words

128000

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

2.5 V

e1

3A991.B.2.A

Tin/Silver/Copper (Sn/Ag/Cu)

8542.32.00.41

BOTTOM

BALL

260

1

0.8 mm

unknown

30

S-PBGA-B208

不合格

INDUSTRIAL

2

ASYNCHRONOUS

0.445 mA

128KX36

3-STATE

1.5 mm

36

0.02 A

4718592 bit

PARALLEL

COMMON

MULTI-PORT SRAM

2.4 V

2.6 V

2.4 V

15 mm

15 mm

IDT71C65S45TC
IDT71C65S45TC
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

28

28

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

DIP

0.300 INCH, THIN, SIDE BRAZED, DIP-28

8192 words

8000

70 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP28,.3

RECTANGULAR

IN-LINE

5 V

45 ns

e0

EAR99

锡铅

8542.32.00.41

DUAL

THROUGH-HOLE

1

2.54 mm

not_compliant

R-CDIP-T28

不合格

COMMERCIAL

1

ASYNCHRONOUS

0.16 mA

8KX8

3-STATE

5.08 mm

8

0.015 A

65536 bit

PARALLEL

COMMON

标准SRAM

4.5 V

5.5 V

4.5 V

YES

35.56 mm

7.62 mm

IDT71256SL25Y
IDT71256SL25Y
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

28

28

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

SOJ

0.300 INCH, SOJ-28

25 ns

3

32768 words

32000

70 °C

PLASTIC/EPOXY

SOJ

SOJ28,.34

RECTANGULAR

小概要

5 V

e0

EAR99

锡铅

8542.32.00.41

DUAL

J BEND

225

1

1.27 mm

not_compliant

30

R-PDSO-J28

不合格

COMMERCIAL

1

ASYNCHRONOUS

0.12 mA

32KX8

3-STATE

3.556 mm

8

0.00012 A

262144 bit

PARALLEL

COMMON

缓存SRAM

2 V

5.5 V

4.5 V

YES

17.9324 mm

7.5184 mm

IDT70V9079L15PF
IDT70V9079L15PF
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

100

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 14 MM, 1.40 MM HEIGHT, TQFP-100

30 ns

40 MHz

3

32768 words

32000

70 °C

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.3 V

e0

EAR99

Tin/Lead (Sn85Pb15)

FLOW-THROUGH OR PIPELINED ARCHITECTURE

8542.32.00.41

QUAD

鸥翼

240

1

0.5 mm

not_compliant

20

S-PQFP-G100

不合格

COMMERCIAL

2

SYNCHRONOUS

0.185 mA

32KX8

3-STATE

1.6 mm

8

0.003 A

262144 bit

PARALLEL

COMMON

MULTI-PORT SRAM

3 V

3.6 V

3 V

14 mm

14 mm

IDT7006S20PFI
IDT7006S20PFI
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

64

64

Transferred

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP, QFP64,.66SQ,32

20 ns

3

16384 words

16000

85 °C

-40 °C

PLASTIC/EPOXY

LQFP

QFP64,.66SQ,32

SQUARE

FLATPACK, LOW PROFILE

5 V

e0

EAR99

锡铅

8542.32.00.41

QUAD

鸥翼

240

1

0.8 mm

not_compliant

30

S-PQFP-G64

不合格

INDUSTRIAL

2

ASYNCHRONOUS

0.37 mA

16KX8

3-STATE

1.6 mm

8

0.03 A

131072 bit

PARALLEL

COMMON

MULTI-PORT SRAM

4.5 V

5.5 V

4.5 V

14 mm

14 mm

IDT7164S25E
IDT7164S25E
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

28

28

INTEGRATED DEVICE TECHNOLOGY INC

DFP

CERPACK-28

25 ns

8192 words

8000

70 °C

CERAMIC, GLASS-SEALED

DFP

FL28,.4

RECTANGULAR

FLATPACK

5 V

Obsolete

e0

EAR99

锡铅

8542.32.00.41

DUAL

FLAT

1

1.27 mm

not_compliant

R-GDFP-F28

不合格

COMMERCIAL

1

ASYNCHRONOUS

0.17 mA

8KX8

3-STATE

2.921 mm

8

0.015 A

65536 bit

PARALLEL

COMMON

标准SRAM

4.5 V

5.5 V

4.5 V

YES

18.288 mm

12.446 mm

IDT6116LA15Y
IDT6116LA15Y
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

24

24

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

SOJ

0.300 INCH, 1.27 MM PITCH, SOJ-24

15 ns

3

2048 words

2000

70 °C

PLASTIC/EPOXY

SOJ

SOJ24,.34

RECTANGULAR

小概要

5 V

e0

EAR99

锡铅

8542.32.00.41

DUAL

J BEND

225

1

1.27 mm

not_compliant

30

R-PDSO-J24

不合格

COMMERCIAL

1

ASYNCHRONOUS

0.14 mA

2KX8

3-STATE

3.76 mm

8

0.00002 A

16384 bit

PARALLEL

COMMON

标准SRAM

2 V

5.5 V

4.5 V

YES

15.88 mm

7.62 mm

70V9289L7PF
70V9289L7PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

100-LQFP

100-TQFP (14x14)

Volatile

0°C ~ 70°C (TA)

Tray

--

Obsolete

SRAM - Dual Port, Synchronous

3 V ~ 3.6 V

1Mb (64K x 16)

7.5ns

SRAM

Parallel

--

7130LA55TFI
7130LA55TFI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

64-LQFP

64-TQFP (10x10)

Volatile

-40°C ~ 85°C (TA)

Tray

--

Obsolete

SRAM - Dual Port, Asynchronous

4.5 V ~ 5.5 V

8Kb (1K x 8)

55ns

SRAM

Parallel

55ns

70261L15PFI
70261L15PFI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

100-LQFP

100-TQFP (14x14)

Contains lead / RoHS non-compliant

Volatile

-40°C ~ 85°C (TA)

Tray

-

Obsolete

3 (168 Hours)

SRAM - Dual Port, Asynchronous

4.5 V ~ 5.5 V

256Kb (16K x 16)

15ns

SRAM

Parallel

15ns

7130SA25JI
7130SA25JI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

52-LCC (J-Lead)

52-PLCC (19.13x19.13)

Volatile

-40°C ~ 85°C (TA)

Tube

--

Obsolete

SRAM - Dual Port, Asynchronous

4.5 V ~ 5.5 V

8Kb (1K x 8)

25ns

SRAM

Parallel

25ns

7025L15PFI
7025L15PFI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

100-LQFP

100-TQFP (14x14)

Volatile

-40°C ~ 85°C (TA)

Tray

--

Obsolete

SRAM - Dual Port, Asynchronous

4.5 V ~ 5.5 V

128Kb (8K x 16)

15ns

SRAM

Parallel

15ns

70V657S12DRGI
70V657S12DRGI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

208-BFQFP

208-PQFP (28x28)

Volatile

-40°C ~ 85°C (TA)

Tray

--

活跃

SRAM - Dual Port, Asynchronous

3.15 V ~ 3.45 V

1.125Mb (32K x 36)

12ns

SRAM

Parallel

12ns

70V261S25PFI
70V261S25PFI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

100-LQFP

100-TQFP (14x14)

Volatile

-40°C ~ 85°C (TA)

Tray

--

Obsolete

SRAM - Dual Port, Asynchronous

3 V ~ 3.6 V

256Kb (16K x 16)

25ns

SRAM

Parallel

25ns

7134SA-70JI
7134SA-70JI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

52-LCC (J-Lead)

52-PLCC (19.13x19.13)

Volatile

-40°C ~ 85°C (TA)

Tube

--

Obsolete

SRAM - Dual Port, Asynchronous

4.5 V ~ 5.5 V

32Kb (4K x 8)

70ns

SRAM

Parallel

70ns

70914S25PFI
70914S25PFI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

80-LQFP

80-TQFP (14x14)

Volatile

-40°C ~ 85°C (TA)

Tray

--

Obsolete

SRAM - Dual Port, Synchronous

4.5 V ~ 5.5 V

36Kb (4K x 9)

25ns

SRAM

Parallel

--