品牌是'IDT' (6623)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | Current - Supply (Nom) | 包装 | 已出版 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 界面 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 访问时间(最大) | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | |||||||||||||||||||||||||||
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![]() | IDT71T75902S80BGGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA | YES | 119 | RAM, SRAM | 2005 | e0 | 3 (168 Hours) | 119 | 3A991.B.2.A | 锡铅 | 85°C | -40°C | FLOW-THROUGH ARCHITECTURE | 8542.32.00.41 | 2.5V | BOTTOM | BALL | 225 | 1 | 1.27mm | unknown | 30 | 不合格 | INDUSTRIAL | Parallel | SYNCHRONOUS | 1MX18 | 18 | 18874368 bit | 8 ns | 2.625V | 2.375V | 2.36mm | 22mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 7024S17G | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 通孔 | 84 | 310mA | RAM, SDR, SRAM | Bulk | 2000 | e0 | no | 活跃 | 1 (Unlimited) | 84 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | 5V | PERPENDICULAR | PIN/PEG | 240 | 1 | 20 | 5V | COMMERCIAL | Parallel | 8kB | 2 | 17 ns | 4KX16 | 3-STATE | 24b | 64 kb | 0.015A | COMMON | Asynchronous | 16b | 5.5V | 4.5V | 27.94mm | 27.94mm | 3.68mm | 无 | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 71V3557S75PFG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | TQFP | 100 | 275mA | 100MHz | RAM, SDR, SRAM | 2009 | e3 | yes | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) - annealed | 70°C | 0°C | FLOW-THROUGH ARCHITECTURE | 3.3V | QUAD | 鸥翼 | 260 | 1 | 0.65mm | 100MHz | 30 | COMMERCIAL | Parallel | 512kB | 1 | 7.5 ns | 3-STATE | 17b | 4.5 Mb | 0.04A | COMMON | Synchronous | 36b | 3.465V | 3.135V | 20mm | 14mm | 1.4mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 7026L20J8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 表面贴装 | PLCC | 84 | 275mA | RAM, SDR, SRAM | 2009 | no | 活跃 | EAR99 | 70°C | 0°C | 5V | Parallel | 32kB | 2 | 20 ns | 14b | 256 kb | Asynchronous | 16b | 5.5V | 4.5V | 29.21mm | 29.21mm | 3.63mm | 无 | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 70V05L35J | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | PLCC | YES | 68 | RAM, SDR, SRAM | 2006 | e0 | no | 活跃 | 1 (Unlimited) | 68 | EAR99 | Tin/Lead (Sn85Pb15) | 70°C | 0°C | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | 3.3V | QUAD | J BEND | 225 | 1 | COMMERCIAL | Parallel | 8kB | 2 | 0.155mA | 35 ns | 8KX8 | 3-STATE | 26b | 64 kb | COMMON | 3V | 3.6V | 3V | 24mm | 24mm | 3.63mm | 无 | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 70V3399S133PRF8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | TQFP | 128 | 400mA | RAM, SRAM | Tape & Reel | 2009 | e0 | no | 活跃 | 3 (168 Hours) | 128 | Tin/Lead (Sn85Pb15) | 70°C | 0°C | PIPELINED OR FLOW-THROUGH ARCHITECTURE | 3.3V | QUAD | 鸥翼 | 225 | 1 | 0.5mm | 133MHz | COMMERCIAL | Parallel | 2 | 15 ns | 3-STATE | 34b | 2.3 Mb | 0.03A | COMMON | Synchronous | 18b | 3.45V | 3.15V | 1.6mm | 20mm | 14mm | 1.4mm | 无 | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 7054L35PRF8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 表面贴装 | TQFP | 128 | 250mA | RAM, SRAM | Tape & Reel | 2001 | e0 | no | 活跃 | 3 (168 Hours) | 128 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | AUTOMATIC POWER DOWN; LOW POWER STANDBY MODE | 5V | QUAD | 鸥翼 | 225 | 1 | 0.5mm | 5V | COMMERCIAL | Parallel | 4 | 35 ns | 3-STATE | 12b | 32 kb | 0.0015A | COMMON | Asynchronous | 8b | 2V | 5.5V | 4.5V | 1.6mm | 20mm | 14mm | 1.4mm | 无 | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 71V3557S80PFG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | TQFP | 100 | 250mA | 100MHz | RAM, SDR, SRAM | 2009 | e3 | yes | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) - annealed | 70°C | 0°C | FLOW-THROUGH ARCHITECHTURE | 3.3V | QUAD | 鸥翼 | 260 | 1 | 0.65mm | 95MHz | 30 | COMMERCIAL | Parallel | 512kB | 1 | 8 ns | 3-STATE | 17b | 4.5 Mb | 0.04A | COMMON | Synchronous | 36b | 3.465V | 3.135V | 20mm | 14mm | 1.4mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 71V416L10PHG8 | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | 44 | 70°C | e3 | icon-pbfree yes | 3 (168 Hours) | 3A991.B.2.A | Matte Tin (Sn) - annealed | 8542.32.00.41 | 3.3V | DUAL | 鸥翼 | 260 | 1 | 0.8mm | compliant | 30 | R-PDSO-G44 | 不合格 | 3.3V | COMMERCIAL | ASYNCHRONOUS | 0.18mA | 256KX16 | 3-STATE | 16 | 0.01A | 4194304 bit | 10 ns | PARALLEL | COMMON | 标准SRAM | 3V | 3.6V | 3V | 1.2mm | 18.41mm | 10.16mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 7027S55PF8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 表面贴装 | TQFP | 100 | 270mA | RAM, SDR, SRAM | 2009 | 活跃 | 70°C | 0°C | 5V | Parallel | 64kB | 2 | 55 ns | 30b | 512 kb | Asynchronous | 16b | 5.5V | 4.5V | 14mm | 14mm | 1.4mm | 无 | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 7134SA55P | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | PDIP | 48 | 240mA | RAM, SDR, SRAM | Bulk | 2013 | Discontinued | 70°C | 0°C | 5V | Parallel | 4kB | 2 | 55 ns | 24b | 32 kb | Asynchronous | 8b | 5.5V | 4.5V | 61.7mm | 15.24mm | 3.8mm | 无 | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 7016L12JG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 表面贴装 | PLCC | 68 | 275mA | RAM, SRAM | Tape & Reel | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 68 | EAR99 | Matte Tin (Sn) - annealed | 70°C | 0°C | SEMAPHORE; INTERRUPT FLAG; AUTOMATIC POWER DOWN; LOW POWER STANDBY MODE | 5V | QUAD | J BEND | 260 | 1 | 5V | COMMERCIAL | Parallel | 2 | 12 ns | 16KX9 | 3-STATE | 14b | 144 kb | 0.005A | COMMON | Asynchronous | 9b | 5.5V | 4.5V | 4.57mm | 24mm | 24mm | 3.63mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 709089S9PF | Integrated Device Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 100 | FLATPACK | 3 | 64000 | PLASTIC/EPOXY | QFP100,.63SQ,20 | PN100 | 20 | 9 ns | 70 °C | 无 | 709089S9PF | 66 MHz | 65536 words | 5 V | QFF | SQUARE | Integrated Device Technology Inc | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | 5.28 | TQFP | 集成设备技术 | e0 | 无 | 3A991 | Tin/Lead (Sn85Pb15) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | QUAD | FLAT | 240 | 1 | 0.5 mm | not_compliant | S-PQFP-F100 | 不合格 | 14 X 14 MM, 1.4 MM HEIGHT, TQFP-100 | 5 V | COMMERCIAL | 2 | SYNCHRONOUS | 0.39 mA | 64KX8 | 3-STATE | 1.6 mm | 8 | 0.015 A | 524288 bit | PARALLEL | COMMON | DUAL-PORT SRAM | 4.5 V | 5.5 V | 4.5 V | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||
![]() | 70V9169L7PFI8 | Integrated Device Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 100 | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | 16000 | PLASTIC/EPOXY | QFP100,.63SQ,20 | PN100 | -40 °C | 20 | 18 ns | 85 °C | 无 | 70V9169L7PFI8 | 83 MHz | 16384 words | 3.3 V | LFQFP | SQUARE | Integrated Device Technology Inc | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | 5.26 | TQFP | 集成设备技术 | e0 | 无 | EAR99 | Tin/Lead (Sn85Pb15) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | QUAD | 鸥翼 | 240 | 1 | 0.5 mm | not_compliant | S-PQFP-G100 | 不合格 | 3.3 V | INDUSTRIAL | 2 | SYNCHRONOUS | 0.28 mA | 16KX9 | 3-STATE | 1.6 mm | 9 | 0.003 A | 147456 bit | PARALLEL | COMMON | DUAL-PORT SRAM | 3 V | 3.6 V | 3 V | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||
![]() | 709159L7BFI | Integrated Device Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 100 | CABGA | 5.9 | INTEGRATED DEVICE TECHNOLOGY INC | Obsolete | Integrated Device Technology Inc | SQUARE | LFBGA | 5 V | 8192 words | 83 MHz | 709159L7BFI | 无 | 85 °C | 7.5 ns | 未说明 | -40 °C | BF100 | BGA100,10X10,32 | PLASTIC/EPOXY | 8000 | 3 | GRID ARRAY, LOW PROFILE, FINE PITCH | 10 X 10 MM, 1.4 MM HEIGHT, 0.8 MM PITCH, FBGA-100 | 集成设备技术 | e0 | 无 | EAR99 | Tin/Lead (Sn63Pb37) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 225 | 1 | 0.8 mm | not_compliant | S-PBGA-B100 | 不合格 | 5 V | INDUSTRIAL | 2 | SYNCHRONOUS | 0.44 mA | 8KX9 | 3-STATE | 1.4 mm | 9 | 0.003 A | 73728 bit | PARALLEL | COMMON | DUAL-PORT SRAM | 4.5 V | 5.5 V | 4.5 V | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||
![]() | 71256SA20Y | Integrated Device Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | 28 | Obsolete | Integrated Device Technology Inc | RECTANGULAR | SOJ | 5 V | 32768 words | 71256SA20Y | 无 | 70 °C | 20 ns | 30 | SOJ28,.34 | PLASTIC/EPOXY | 32000 | 3 | 小概要 | 0.300 INCH, PLASTIC, SOJ-28 | SOJ | 7.63 | e0 | 无 | EAR99 | Tin/Lead (Sn85Pb15) | 8542.32.00.41 | SRAMs | CMOS | DUAL | J BEND | 225 | 1 | 1.27 mm | not_compliant | R-PDSO-J28 | 不合格 | INTEGRATED DEVICE TECHNOLOGY INC | 5 V | COMMERCIAL | ASYNCHRONOUS | 0.145 mA | 32KX8 | 3-STATE | 3.556 mm | 8 | 0.015 A | 262144 bit | PARALLEL | COMMON | 标准SRAM | 4.5 V | 5.5 V | 4.5 V | 17.9324 mm | 7.5184 mm | ||||||||||||||||||||||||||||||||||||||
![]() | 709369L9PFI | Integrated Device Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 100 | 14 X 14 MM, 1.4 MM HEIGHT, TQFP-100 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | 16000 | PLASTIC/EPOXY | QFP100,.63SQ,20 | PN100 | -40 °C | 20 | 9 ns | 85 °C | 无 | 709369L9PFI | 66 MHz | 16384 words | 5 V | LFQFP | SQUARE | Integrated Device Technology Inc | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | 5.88 | TQFP | 集成设备技术 | e0 | 无 | 3A991 | Tin/Lead (Sn85Pb15) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | QUAD | 鸥翼 | 240 | 1 | 0.5 mm | not_compliant | S-PQFP-G100 | 不合格 | 5 V | INDUSTRIAL | 2 | SYNCHRONOUS | 0.43 mA | 16KX18 | 3-STATE | 1.4 mm | 18 | 0.006 A | 294912 bit | PARALLEL | COMMON | DUAL-PORT SRAM | 4.5 V | 5.5 V | 4.5 V | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||
![]() | IDT71V3577SA75BGGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA | RAM, SRAM | 2005 | 85°C | -40°C | Parallel | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IDT71V3577SA75BGGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA | RAM, SRAM | Tape & Reel (TR) | 2005 | 85°C | -40°C | Parallel | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IDT71V67602S166BQGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | RAM, SRAM | 2009 | 85°C | -40°C | 166MHz | Parallel | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IDT71V424YS10PHI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TSOP | RAM, SRAM - Asynchronous | Tape & Reel (TR) | 2009 | 85°C | -40°C | Parallel | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IDT71V424YS15PH8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TSOP | RAM, SRAM - Asynchronous | Tape & Reel (TR) | 2009 | 70°C | 0°C | Parallel | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IDT71256SA20TPI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | DIP | RAM, SRAM - Asynchronous | 2010 | 85°C | -40°C | Parallel | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IDT71P73804S200BQ8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 165 | DDR2, RAM, SRAM | Tape & Reel (TR) | 2005 | e0 | 3 (168 Hours) | 165 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | BOTTOM | BALL | 1mm | not_compliant | 200MHz | 不合格 | 1.5/1.81.8V | Parallel | SYNCHRONOUS | 0.55mA | 1MX18 | 3-STATE | 18 | 0.3A | 18874368 bit | 0.45 ns | COMMON | 1.7V | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IDT71V256SA20PZI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TSSOP | RAM, SRAM - Asynchronous | 2009 | 85°C | -40°C | Parallel | Non-RoHS Compliant |
IDT71T75902S80BGGI
Integrated Device Technology (IDT)
分类:Memory
7024S17G
Integrated Device Technology (IDT)
分类:Memory
71V3557S75PFG8
Integrated Device Technology (IDT)
分类:Memory
7026L20J8
Integrated Device Technology (IDT)
分类:Memory
70V05L35J
Integrated Device Technology (IDT)
分类:Memory
70V3399S133PRF8
Integrated Device Technology (IDT)
分类:Memory
7054L35PRF8
Integrated Device Technology (IDT)
分类:Memory
71V3557S80PFG
Integrated Device Technology (IDT)
分类:Memory
71V416L10PHG8
Integrated Device Technology Inc
分类:Memory
7027S55PF8
Integrated Device Technology (IDT)
分类:Memory
7134SA55P
Integrated Device Technology (IDT)
分类:Memory
7016L12JG8
Integrated Device Technology (IDT)
分类:Memory
709089S9PF
Integrated Device Technology
分类:Memory
70V9169L7PFI8
Integrated Device Technology
分类:Memory
709159L7BFI
Integrated Device Technology
分类:Memory
71256SA20Y
Integrated Device Technology
分类:Memory
709369L9PFI
Integrated Device Technology
分类:Memory
IDT71V3577SA75BGGI
Integrated Device Technology (IDT)
分类:Memory
IDT71V3577SA75BGGI8
Integrated Device Technology (IDT)
分类:Memory
IDT71V67602S166BQGI
Integrated Device Technology (IDT)
分类:Memory
IDT71V424YS10PHI8
Integrated Device Technology (IDT)
分类:Memory
IDT71V424YS15PH8
Integrated Device Technology (IDT)
分类:Memory
IDT71256SA20TPI
Integrated Device Technology (IDT)
分类:Memory
IDT71P73804S200BQ8
Integrated Device Technology (IDT)
分类:Memory
IDT71V256SA20PZI
Integrated Device Technology (IDT)
分类:Memory
