品牌是'IDT' (6623)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

工厂交货时间

底架

包装/外壳

表面安装

引脚数

Current - Supply (Nom)

包装

已出版

JESD-609代码

无铅代码

零件状态

湿度敏感性等级(MSL)

终止次数

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

频率

时间@峰值回流温度-最大值(s)

JESD-30代码

资历状况

电源

温度等级

界面

内存大小

端口的数量

操作模式

时钟频率

电源电流-最大值

访问时间

组织结构

输出特性

内存宽度

地址总线宽度

密度

待机电流-最大值

记忆密度

访问时间(最大)

I/O类型

同步/异步

字长

待机电压-最小值

电压 - 供电 (最大值)

电压 - 供电 (最小值)

输出启用

座位高度(最大)

长度

宽度

器件厚度

辐射硬化

RoHS状态

无铅

7025S20J
7025S20J
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

84

290mA

RAM, SDR, SRAM

2009

e0

no

活跃

1 (Unlimited)

84

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

5V

QUAD

J BEND

225

1

5V

COMMERCIAL

Parallel

16kB

2

20 ns

8KX16

3-STATE

26b

128 kb

0.015A

COMMON

Asynchronous

16b

5.5V

4.5V

4.57mm

29.21mm

29.21mm

3.63mm

符合RoHS标准

含铅

IDT71V65703S85PF8
IDT71V65703S85PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

100

RAM, SRAM

Tape & Reel (TR)

2009

e0

3 (168 Hours)

100

3A991.B.2.A

Tin/Lead (Sn85Pb15)

70°C

0°C

FLOW-THROUGH ARCHITECTURE

8542.32.00.41

3.3V

QUAD

鸥翼

240

1

0.65mm

not_compliant

20

R-PQFP-G100

不合格

3.3V

COMMERCIAL

Parallel

SYNCHRONOUS

90MHz

0.225mA

256KX36

3-STATE

36

0.04A

9437184 bit

8.5 ns

COMMON

3.14V

3.465V

3.135V

1.6mm

20mm

14mm

Non-RoHS Compliant

709279L15PF
709279L15PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

285mA

28.5MHz

RAM, SDR, SRAM

2009

活跃

70°C

0°C

5V

28.5MHz

Parallel

64kB

2

15 ns

30b

512 kb

Synchronous

16b

5.5V

4.5V

14mm

14mm

1.4mm

符合RoHS标准

含铅

70V9199L9PFI
70V9199L9PFI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

240mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

100

Tin/Lead (Sn85Pb15)

85°C

0°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

3.3V

QUAD

鸥翼

240

1

0.5mm

40MHz

20

INDUSTRIAL

Parallel

128kB

2

9 ns

3-STATE

34b

1.1 Mb

COMMON

Synchronous

9b

3V

3.6V

3V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

71V3556S133PFGI8
71V3556S133PFGI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

12 Weeks

表面贴装

TQFP

100

310mA

RAM, SRAM

Tape & Reel

2006

e3

yes

活跃

3 (168 Hours)

100

Matte Tin (Sn) - annealed

85°C

-40°C

3.3V

QUAD

鸥翼

260

1

0.65mm

133MHz

30

INDUSTRIAL

Parallel

1

4.2 ns

3-STATE

17b

4.5 Mb

0.045A

COMMON

Synchronous

36b

3.465V

3.135V

20mm

14mm

1.4mm

符合RoHS标准

无铅

71V35761S200BGGI8
71V35761S200BGGI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA

119

RAM, SRAM

Tape & Reel

2009

e1

yes

Discontinued

3 (168 Hours)

Tin/Silver/Copper (Sn/Ag/Cu)

85°C

-40°C

3.3V

260

200MHz

Parallel

1

3.1 ns

17b

4.5 Mb

Synchronous

36b

3.465V

3.135V

14mm

22mm

2.15mm

符合RoHS标准

无铅

70V9089S9PF
70V9089S9PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

260mA

RAM, SRAM

2009

活跃

70°C

0°C

3.3V

40MHz

Parallel

2

20 ns

32b

512 kb

Synchronous

8b

3.6V

3V

14mm

14mm

1.4mm

符合RoHS标准

含铅

7008S15PF8
7008S15PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

365mA

RAM, SDR, SRAM

2010

活跃

70°C

0°C

5V

Parallel

64kB

2

15 ns

32b

512 kb

Asynchronous

8b

5.5V

4.5V

14mm

14mm

1.4mm

符合RoHS标准

含铅

IDT71V424YL10PH
IDT71V424YL10PH
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TSOP

YES

44

RAM, SRAM - Asynchronous

2009

e3

yes

3 (168 Hours)

44

3A991.B.2.A

Matte Tin (Sn) - annealed

70°C

0°C

8542.32.00.41

3.3V

DUAL

鸥翼

260

1

0.8mm

30

R-PDSO-G44

不合格

3.3V

COMMERCIAL

Parallel

0.165mA

512KX8

3-STATE

8

0.01A

4194304 bit

10 ns

COMMON

3V

3.6V

3V

1.2mm

18.41mm

10.16mm

Non-RoHS Compliant

7054S25PRF
7054S25PRF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

128

300mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

128

EAR99

Tin/Lead (Sn/Pb)

70°C

0°C

AUTOMATIC POWER DOWN; LOW POWER STANDBY MODE

5V

QUAD

FLAT

225

1

0.5mm

5V

COMMERCIAL

Parallel

4kB

4

25 ns

3-STATE

12b

32 kb

0.0015A

COMMON

Asynchronous

8b

5.5V

4.5V

1.6mm

20mm

14mm

1.4mm

符合RoHS标准

含铅

IDT71256SA25PZ
IDT71256SA25PZ
Integrated Device Technology (IDT) 数据表

573 In Stock

-

最小起订量: 1

最小包装量: 1

TSSOP

YES

28

RAM, SRAM - Asynchronous

2009

e0

3 (168 Hours)

28

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

8542.32.00.41

5V

DUAL

鸥翼

240

1

0.55mm

not_compliant

20

R-PDSO-G28

不合格

5V

COMMERCIAL

Parallel

1

0.145mA

32KX8

3-STATE

8

0.015A

262144 bit

25 ns

COMMON

4.5V

5.5V

4.5V

YES

1.2mm

11.8mm

8mm

Non-RoHS Compliant

IDT71V416L15YI
IDT71V416L15YI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

RAM, SRAM - Asynchronous

2007

e0

no

3 (168 Hours)

44

3A991.B.2.A

Tin/Lead (Sn85Pb15)

85°C

-40°C

8542.32.00.41

3.3V

DUAL

J BEND

225

1

1.27mm

not_compliant

30

不合格

3.3V

INDUSTRIAL

Parallel

0.16mA

256KX16

3-STATE

16

0.01A

4194304 bit

15 ns

COMMON

3V

3.6V

3V

3.683mm

28.575mm

10.16mm

Non-RoHS Compliant

71V3556SA133BGG8
71V3556SA133BGG8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

BGA

119

300mA

133MHz

RAM, SDR, SRAM

Tape & Reel

2006

e1

yes

活跃

3 (168 Hours)

119

Tin/Silver/Copper (Sn/Ag/Cu)

70°C

0°C

3.3V

BOTTOM

BALL

260

1

133MHz

30

COMMERCIAL

Parallel

512kB

1

4.2 ns

3-STATE

17b

4.5 Mb

0.04A

COMMON

Synchronous

36b

3.465V

3.135V

2.36mm

14mm

22mm

2.15mm

符合RoHS标准

无铅

IDT71V424S12YI8
IDT71V424S12YI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

36

RAM, SRAM - Asynchronous

Tape & Reel (TR)

2009

e0

3 (168 Hours)

36

3A991.B.2.A

Tin/Lead (Sn85Pb15)

85°C

-40°C

8542.32.00.41

3.3V

DUAL

J BEND

225

1

1.27mm

not_compliant

30

不合格

3.3V

INDUSTRIAL

Parallel

0.17mA

512KX8

3-STATE

8

0.02A

4194304 bit

12 ns

COMMON

3V

3.6V

3V

3.683mm

23.495mm

10.16mm

Non-RoHS Compliant

IDT71V424L15YI8
IDT71V424L15YI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

36

RAM, SRAM - Asynchronous

Tape & Reel (TR)

2009

e0

3 (168 Hours)

36

3A991.B.2.A

Tin/Lead (Sn85Pb15)

85°C

-40°C

8542.32.00.41

3.3V

DUAL

J BEND

225

1

1.27mm

not_compliant

30

不合格

3.3V

INDUSTRIAL

Parallel

0.145mA

512KX8

3-STATE

8

0.01A

4194304 bit

15 ns

COMMON

3V

3.6V

3V

3.683mm

23.495mm

10.16mm

Non-RoHS Compliant

7024S20PF
7024S20PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

290mA

RAM, SDR, SRAM

2013

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

5V

QUAD

鸥翼

240

1

0.5mm

20

5V

COMMERCIAL

Parallel

8kB

2

20 ns

4KX16

3-STATE

24b

64 kb

0.005A

COMMON

Asynchronous

16b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

70T3589S166BF
70T3589S166BF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

208

450mA

RAM, SRAM

2009

e0

no

活跃

3 (168 Hours)

208

Tin/Lead (Sn63Pb37)

70°C

0°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

2.5V

BOTTOM

BALL

225

1

0.8mm

166MHz

20

COMMERCIAL

Parallel

2

12 ns

64KX36

3-STATE

32b

2.3 Mb

0.015A

COMMON

Synchronous

36b

2.6V

2.4V

15mm

15mm

1.4mm

符合RoHS标准

含铅

IDT71V424YL12PH
IDT71V424YL12PH
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TSOP

YES

44

RAM, SRAM - Asynchronous

2009

e3

yes

3 (168 Hours)

44

3A991.B.2.A

Matte Tin (Sn) - annealed

70°C

0°C

8542.32.00.41

3.3V

DUAL

鸥翼

260

1

0.8mm

unknown

30

R-PDSO-G44

不合格

3.3V

COMMERCIAL

Parallel

0.155mA

512KX8

3-STATE

8

0.01A

4194304 bit

12 ns

COMMON

3V

3.6V

3V

1.2mm

18.41mm

10.16mm

Non-RoHS Compliant

71342LA20PF8
71342LA20PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

64

240mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

64

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP

5V

QUAD

鸥翼

240

1

0.8mm

20

5V

COMMERCIAL

Parallel

4kB

2

20 ns

4KX8

3-STATE

24b

32 kb

0.0015A

COMMON

Asynchronous

8b

2V

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

71V416S12BEG8
71V416S12BEG8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

12 Weeks

表面贴装

TFBGA

48

180mA

RAM, SDR, SRAM - Asynchronous

2012

e1

yes

活跃

3 (168 Hours)

48

锡银铜

70°C

0°C

3.3V

BOTTOM

BALL

260

1

0.75mm

COMMERCIAL

Parallel

512kB

1

12 ns

3-STATE

18b

4 Mb

0.02A

COMMON

Asynchronous

16b

3V

3.6V

3V

9mm

9mm

1.2mm

符合RoHS标准

无铅

IDT71T75802S100PF8
IDT71T75802S100PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

100

RAM, SRAM

Tape & Reel (TR)

2015

e0

3 (168 Hours)

100

3A991.B.2.A

Tin/Lead (Sn85Pb15)

70°C

0°C

流水线结构

8542.32.00.41

2.5V

QUAD

鸥翼

240

1

0.65mm

not_compliant

100MHz

20

R-PQFP-G100

不合格

2.5V

COMMERCIAL

Parallel

SYNCHRONOUS

0.175mA

1MX18

3-STATE

18

0.04A

18874368 bit

5 ns

COMMON

2.38V

2.625V

2.375V

1.6mm

20mm

14mm

Non-RoHS Compliant

7005L20PF8
7005L20PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

TQFP

YES

64

RAM, SDR, SRAM

Tape & Reel

2005

e0

no

活跃

3 (168 Hours)

64

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP

5V

QUAD

鸥翼

240

1

0.8mm

20

5V

COMMERCIAL

Parallel

8kB

2

20 ns

8KX8

3-STATE

26b

64 kb

0.0015A

COMMON

2V

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

71V3556SA166BGG8
71V3556SA166BGG8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

BGA

119

350mA

RAM, SRAM

Tape & Reel

2006

e1

yes

活跃

3 (168 Hours)

119

Tin/Silver/Copper (Sn/Ag/Cu)

70°C

0°C

3.3V

BOTTOM

BALL

260

1

166MHz

30

COMMERCIAL

Parallel

1

3.5 ns

3-STATE

17b

4.5 Mb

0.04A

COMMON

Synchronous

36b

3.465V

3.135V

2.36mm

14mm

22mm

2.15mm

符合RoHS标准

无铅

70V9169L7PF
70V9169L7PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

280mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

3.3V

QUAD

鸥翼

240

1

0.5mm

45.45MHz

20

COMMERCIAL

Parallel

18kB

2

7 ns

16KX9

3-STATE

28b

144 kb

0.003A

COMMON

Synchronous

9b

3V

3.6V

3V

14mm

14mm

1.4mm

符合RoHS标准

含铅

7006L25PF
7006L25PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

64

220mA

RAM, SDR, SRAM

2008

e0

no

活跃

3 (168 Hours)

64

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

5V

QUAD

鸥翼

240

1

0.8mm

20

5V

COMMERCIAL

Parallel

16kB

2

25 ns

16KX8

3-STATE

28b

128 kb

0.0015A

COMMON

Asynchronous

8b

2V

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅