品牌是'Intel' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 温度等级 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 长度 | 宽度 | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | EP3SE260F1517I2N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | 活跃 | INTEL CORP | BGA, BGA1517,39X39,40 | 100 MHz | 100 °C | -40 °C | PLASTIC | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 1.15 V | 1.05 V | 1.1 V | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | 976 | 不合格 | 976 | 10200 CLBS | 现场可编程门阵列 | 255000 | ||||||||||||||
![]() | 10AX027H4F34E3VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | INTEL CORP | FBGA-1152 | 100 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 0.93 V | 0.82 V | 0.9 V | 有 | 活跃 | 3A991 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 384 | OTHER | 384 | 10162 CLBS | 3.35 mm | 现场可编程门阵列 | 10162 | 270000 | 35 mm | 35 mm | |||||||||||||
![]() | 5SGXMA7H3F35I4 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | INTEL CORP | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 0.88 V | 0.82 V | 0.85 V | 无 | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 552 | 不合格 | 552 | 23472 CLBS | 现场可编程门阵列 | 622000 | ||||||||||||||||||
![]() | EP1SGX10CF672C7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | Obsolete | INTEL CORP | BGA, | 4.7 MHz | 85 °C | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 362 | 不合格 | OTHER | 362 | 1057 CLBS | 3.5 mm | 现场可编程门阵列 | 9.48 ns | 27 mm | 27 mm | |||||||||||
![]() | EP1M120B484C5 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 活跃 | INTEL CORP | , | 8542.39.00.01 | compliant | ||||||||||||||||||||||||||||||||||||||||
![]() | EP1S10F1508C5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 85 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | OTHER | 现场可编程门阵列 | 1057 | 10570 | 40 mm | 40 mm | |||||||||||||||
![]() | EP3SE260F780I3N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | PLASTIC | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 有 | 接触制造商 | INTEL CORP | BGA, BGA780,28X28,40 | 100 MHz | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 480 | 不合格 | 488 | 现场可编程门阵列 | 255000 | ||||||||||||||||||||||
![]() | EP1C4F400I8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 400 | INTEL CORP | 21 X 21 MM, 1.00 MM PITCH, LEAD FREE, FBGA-400 | 275 MHz | PLASTIC/EPOXY | BGA | BGA400,20X20,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B400 | 不合格 | 4000 CLBS | 2.2 mm | 现场可编程门阵列 | 4000 | 21 mm | 21 mm | |||||||||||||||
![]() | EP4S100G5H40C2N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | LEAD FREE, HBGA-1517 | 800 MHz | 85 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 0.98 V | 0.92 V | 0.95 V | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B | 654 | OTHER | 654 | 21248 CLBS | 3.8 mm | 现场可编程门阵列 | 212480 | 531200 | 42.5 mm | 42.5 mm | ||||||||||||||
![]() | EP2C15AF256I6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | LEAD FREE, FBGA-256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | 1.25 V | 1.15 V | 1.2 V | 有 | 活跃 | INTEL CORP | e1 | 锡银铜 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 144 | 不合格 | 152 | 1.55 mm | 现场可编程门阵列 | 14448 | 17 mm | 17 mm | ||||||||||||||
![]() | EP1S30F1508I5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 活跃 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | 现场可编程门阵列 | 3247 | 32470 | 40 mm | 40 mm | |||||||||||||||
![]() | EP1C20F324C7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | INTEL CORP | BGA, | 320 MHz | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B324 | 不合格 | 20060 CLBS | 2.2 mm | 现场可编程门阵列 | 20060 | 19 mm | 19 mm | |||||||||||||||
![]() | 5SEE9H40C2 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | INTEL CORP | HBGA-1517 | 85 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 0.93 V | 0.87 V | 0.9 V | 无 | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | 696 | 不合格 | OTHER | 696 | 31700 CLBS | 3.9 mm | 现场可编程门阵列 | 31700 | 840000 | 45 mm | 45 mm | |||||||||||||
![]() | 10M04SFM153I7G | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 153 | 活跃 | INTEL CORP | 8 X 8 MM, 0.50 MM PITCH, ROHS COMPLIANT, MBGA-153 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA153,15X15,20 | SQUARE | 网格排列 | 3.15 V | 2.85 V | 3 V | 有 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.5 mm | compliant | 未说明 | S-PBGA-B153 | 112 | 不合格 | 112 | 现场可编程门阵列 | 4000 | 8 mm | 8 mm | ||||||||||||||
![]() | EP2C8Q208I7 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | INTEL CORP | PLASTIC, PQFP-208 | 3 | 1.2 V | 1.15 V | 1.25 V | FLATPACK, FINE PITCH | SQUARE | QFP208,1.2SQ,20 | FQFP | PLASTIC/EPOXY | 无 | 活跃 | e0 | 锡铅 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G208 | 130 | 不合格 | 138 | 540 CLBS | 4.1 mm | 现场可编程门阵列 | 540 | 8256 | 28 mm | 28 mm | |||||||||||
![]() | EP3C80U484I8N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | Obsolete | INTEL CORP | FBGA, BGA484,22X22,32 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 1.25 V | 1.15 V | 1.2 V | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B484 | 295 | 不合格 | 295 | 5079 CLBS | 2.05 mm | 现场可编程门阵列 | 81264 | 19 mm | 19 mm | ||||||||||||
![]() | 10M04DFU324I7G | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | 活跃 | INTEL CORP | UBGA-324 | 100 °C | -40 °C | PLASTIC/EPOXY | LFBGA | BGA324,18X18,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.25 V | 1.15 V | 1.2 V | 有 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 未说明 | S-PBGA-B324 | 246 | 不合格 | INDUSTRIAL | 246 | 250 CLBS | 1.55 mm | 现场可编程门阵列 | 250 | 4000 | 15 mm | 15 mm | ||||||||||
![]() | EP1C20F324I8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | INTEL CORP | 19 X 19 MM, 1.0 MM PITCH, LEAD FREE, FBGA-324 | 275 MHz | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B324 | 不合格 | 20060 CLBS | 2.2 mm | 现场可编程门阵列 | 20060 | 19 mm | 19 mm | |||||||||||||||
![]() | EP4S100G5F45C2 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1932 | FBGA-1932 | 800 MHz | 85 °C | PLASTIC/EPOXY | BGA | BGA1932,44X44,40 | SQUARE | 网格排列 | 0.98 V | 0.92 V | 0.95 V | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B | 654 | OTHER | 654 | 21248 CLBS | 3.6 mm | 现场可编程门阵列 | 212480 | 531200 | 45 mm | 45 mm | ||||||||||||||
![]() | 10AS027H4F34I3VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | 活跃 | INTEL CORP | FBGA-1152 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 0.93 V | 0.82 V | 0.85 V | 有 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 384 | INDUSTRIAL | 384 | 10162 CLBS | 3.35 mm | 现场可编程门阵列 | 10162 | 270000 | 35 mm | 35 mm | |||||||||||||
![]() | 5CEBA4F23I7N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | ROHS COMPLIANT, FBGA-484 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 224 | 224 | 1848 CLBS | 2 mm | 现场可编程门阵列 | 23 mm | 23 mm | |||||||||||||||||
![]() | EP1S20F1508I7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 活跃 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | 现场可编程门阵列 | 1846 | 18460 | 40 mm | 40 mm | |||||||||||||||
![]() | EP1S25F1508I5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 活跃 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | 现场可编程门阵列 | 2566 | 25660 | 40 mm | 40 mm | |||||||||||||||
![]() | 5AGXBB3G4F35C5N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | INTEL CORP | FBGA-1152 | 85 °C | PLASTIC/EPOXY | HBGA | BGA1152,34X34,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 1.13 V | 1.07 V | 1.1 V | 有 | 活跃 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 704 | OTHER | 704 | 13688 CLBS | 2.7 mm | 现场可编程门阵列 | 13688 | 362000 | 35 mm | 35 mm | ||||||||||||
![]() | 1SG280LH3F55E2VGS1 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2018-08-08 | 活跃 | INTEL CORP | 8542.39.00.01 | compliant | 现场可编程门阵列 |
EP3SE260F1517I2N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX027H4F34E3VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5SGXMA7H3F35I4
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1SGX10CF672C7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1M120B484C5
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S10F1508C5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3SE260F780I3N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C4F400I8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4S100G5H40C2N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C15AF256I6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S30F1508I5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C20F324C7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5SEE9H40C2
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10M04SFM153I7G
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C8Q208I7
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3C80U484I8N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10M04DFU324I7G
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C20F324I8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4S100G5F45C2
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AS027H4F34I3VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CEBA4F23I7N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S20F1508I7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S25F1508I5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5AGXBB3G4F35C5N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
1SG280LH3F55E2VGS1
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
