品牌是'Intel' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | Contact plating | 表面安装 | Number of pins | Housing material | 终端数量 | Clamping type | Connector pinout layout | Contacts pitch | Date Of Intro | Electrical mounting | Gross weight | Housing mounting | Kind of connector | Spatial orientation | Transport packaging size/quantity | Type of connector | Operating temperature | JESD-609代码 | Connector type | 端子表面处理 | 颜色 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | Current rating | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | Number of contacts | 温度等级 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | Operating temperature range | Rated current | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | Rated voltage | 个人资料 | 长度 | 宽度 | Plating thickness | Flammability rating | |||||||||||||||||
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![]() | EP1S20F1508C7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 无 | 活跃 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 85 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | OTHER | 现场可编程门阵列 | 1846 | 18460 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||
![]() | EP2S180F1020I5 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1020 | 无 | 活跃 | INTEL CORP | 3 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1020,32X32,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1020 | 734 | 不合格 | 742 | 现场可编程门阵列 | 179400 | ||||||||||||||||||||||||||||||||||||||||
![]() | EP1C4F400C7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 400 | 无 | Obsolete | INTEL CORP | BGA, | 320 MHz | PLASTIC/EPOXY | BGA | BGA400,20X20,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B400 | 不合格 | 4000 CLBS | 2.2 mm | 现场可编程门阵列 | 4000 | 21 mm | 21 mm | |||||||||||||||||||||||||||||||||||||||
![]() | EP1C6F256C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 无 | Obsolete | INTEL CORP | BGA, | 405 MHz | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 不合格 | 5980 CLBS | 2.2 mm | 现场可编程门阵列 | 5980 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||
![]() | EP3C5U256I6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 有 | 活跃 | INTEL CORP | LFBGA, BGA256,16X16,32 | 100 °C | -40 °C | PLASTIC/EPOXY | LFBGA | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.25 V | 1.15 V | 1.2 V | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B256 | 182 | 不合格 | 182 | 321 CLBS | 1.5 mm | 现场可编程门阵列 | 5136 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||
![]() | EP4SGX290KF43I2 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1760 | 活跃 | INTEL CORP | FBGA-1760 | 800 MHz | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1760,42X42,40 | SQUARE | 网格排列 | 0.93 V | 0.87 V | 0.9 V | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1760 | 880 | 880 | 11648 CLBS | 3.5 mm | 现场可编程门阵列 | 116480 | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||||||||||||||
![]() | 5AGXBA1D6F27C4N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | 有 | 活跃 | INTEL CORP | FBGA-672 | 85 °C | PLASTIC/EPOXY | HBGA | BGA672,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 1.13 V | 1.07 V | 1.1 V | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 416 | OTHER | 416 | 2830 CLBS | 2.7 mm | 现场可编程门阵列 | 2830 | 75000 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||
![]() | EP1C6F256I7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 无 | Obsolete | INTEL CORP | BGA, | 320 MHz | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 不合格 | 5980 CLBS | 2.2 mm | 现场可编程门阵列 | 5980 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||
![]() | 10AX115U4F45I3VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1932 | 有 | 活跃 | INTEL CORP | FBGA-1932 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1932,44X44,40 | SQUARE | 网格排列 | 0.93 V | 0.82 V | 0.9 V | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1932 | 480 | INDUSTRIAL | 480 | 42720 CLBS | 3.5 mm | 现场可编程门阵列 | 42720 | 1150000 | 45 mm | 45 mm | |||||||||||||||||||||||||||||||||||||
![]() | EP1C6T144C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 无 | Obsolete | INTEL CORP | LFQFP, | 405 MHz | 3 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G144 | 不合格 | 5980 CLBS | 1.6 mm | 现场可编程门阵列 | 5980 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||
![]() | 1SG280LU2F50E2VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | ceramic | 2397 | screw | 2018-08-08 | 24.23 | through hole in the housing | PLASTIC/EPOXY | BGA | BGA2397,49X49,40 | SQUARE | 网格排列 | 活跃 | INTEL CORP | 100 °C | 28.5*21*19/488 | Ceramic screw terminal block | white | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B2397 | 736 | 2x2 | 736 | 344125 CLBS | 3.881 mm | 现场可编程门阵列 | -40...+450 °C | 12 A | 344125 | 2753000 | 600 V | 50 mm | 50 mm | ||||||||||||||||||||||||||||||||
![]() | 5AGXBA5D4F31I3G | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 896 | 有 | 活跃 | INTEL CORP | FBGA-896 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA896,30X30,40 | SQUARE | 网格排列 | 1.18 V | 1.12 V | 1.15 V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B896 | 384 | INDUSTRIAL | 384 | 7170 CLBS | 2.7 mm | 现场可编程门阵列 | 7170 | 190000 | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||
![]() | 5AGXBA5D4F31C5 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 896 | 无 | 活跃 | INTEL CORP | FBGA-896 | 622 MHz | 85 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B896 | OTHER | 2.7 mm | 现场可编程门阵列 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | 10M08DAU324I6G | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | gold-plated | YES | 36 | 324 | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.25 V | 1x36 | 2.54mm | THT | 1.73 g | 1.15 V | female | 1.2 V | socket | SQUARE | BGA324,18X18,32 | LFBGA | PLASTIC/EPOXY | -40 °C | 100 °C | UBGA-324 | INTEL CORP | 活跃 | straight | 有 | pin strips | -40...163°C | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 1.5A | 未说明 | S-PBGA-B324 | 250 | INDUSTRIAL | 250 | 500 CLBS | 1.55 mm | 现场可编程门阵列 | 500 | 8000 | 60V | beryllium copper | 15 mm | 15 mm | 0.254µm | UL94V-0 | |||||||||||||||||||
![]() | EP1SGX10CF672C7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | 无 | Obsolete | INTEL CORP | BGA, | 4.7 MHz | 85 °C | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 362 | 不合格 | OTHER | 362 | 1057 CLBS | 3.5 mm | 现场可编程门阵列 | 9.48 ns | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||
![]() | EP1C4F400I8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 400 | 无 | 活跃 | INTEL CORP | 21 X 21 MM, 1.00 MM PITCH, LEAD FREE, FBGA-400 | 275 MHz | PLASTIC/EPOXY | BGA | BGA400,20X20,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B400 | 不合格 | 4000 CLBS | 2.2 mm | 现场可编程门阵列 | 4000 | 21 mm | 21 mm | |||||||||||||||||||||||||||||||||||||||
![]() | EP1C4F324C8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | 无 | Obsolete | INTEL CORP | BGA, | 275 MHz | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B324 | 不合格 | 4000 CLBS | 2.2 mm | 现场可编程门阵列 | 4000 | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||
![]() | EP1S10F1508C5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 无 | 活跃 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 85 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | OTHER | 现场可编程门阵列 | 1057 | 10570 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||
![]() | EP2C70F896I6 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 896 | 活跃 | INTEL CORP | FBGA-896 | PLASTIC/EPOXY | BGA | BGA896,30X30,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 无 | e0 | 锡铅 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B896 | 606 | 不合格 | 622 | 4300 CLBS | 2.6 mm | 现场可编程门阵列 | 4300 | 68416 | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||
![]() | EP4SGX530KF43I2N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1760 | 活跃 | INTEL CORP | FBGA-1760 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1760,42X42,40 | SQUARE | 网格排列 | 0.93 V | 0.87 V | 0.9 V | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1760 | 880 | INDUSTRIAL | 880 | 21248 CLBS | 3.5 mm | 现场可编程门阵列 | 21248 | 531200 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||||||||||||||||
![]() | 5AGXMB5G4F35C4 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | 无 | 活跃 | INTEL CORP | FBGA-1152 | 670 MHz | 85 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 544 | OTHER | 544 | 15849 CLBS | 2.7 mm | 现场可编程门阵列 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||
![]() | 10M08DCU324C7G | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | 有 | 活跃 | INTEL CORP | UBGA-324 | 85 °C | PLASTIC/EPOXY | LFBGA | BGA324,18X18,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.25 V | 1.15 V | 1.2 V | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 未说明 | S-PBGA-B324 | 250 | 商业扩展 | 250 | 500 CLBS | 1.55 mm | 现场可编程门阵列 | 500 | 8000 | 15 mm | 15 mm | ||||||||||||||||||||||||||||||||||||
![]() | EP1C12F256C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 无 | Obsolete | INTEL CORP | BGA, | 405 MHz | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 不合格 | 12060 CLBS | 2.2 mm | 现场可编程门阵列 | 12060 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||
![]() | EP1C20F400I7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 400 | 无 | Obsolete | INTEL CORP | BGA, | 320 MHz | PLASTIC/EPOXY | BGA | BGA400,20X20,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B400 | 不合格 | 20060 CLBS | 2.2 mm | 现场可编程门阵列 | 20060 | 21 mm | 21 mm | |||||||||||||||||||||||||||||||||||||||
![]() | EP1M350B780C6 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 活跃 | INTEL CORP | 8542.39.00.01 | compliant |
EP1S20F1508C7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2S180F1020I5
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C4F400C7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C6F256C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3C5U256I6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4SGX290KF43I2
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5AGXBA1D6F27C4N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C6F256I7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX115U4F45I3VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C6T144C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
1SG280LU2F50E2VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5AGXBA5D4F31I3G
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5AGXBA5D4F31C5
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10M08DAU324I6G
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1SGX10CF672C7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C4F400I8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C4F324C8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S10F1508C5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C70F896I6
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4SGX530KF43I2N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5AGXMB5G4F35C4
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10M08DCU324C7G
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C12F256C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C20F400I7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1M350B780C6
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
