品牌是'Intel' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | 厂商 | 系列 | JESD-609代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 温度等级 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑块数量 | 逻辑单元数 | 长度 | 宽度 | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | EP3C10U256I6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | LFBGA, BGA256,16X16,32 | 100 °C | -40 °C | PLASTIC/EPOXY | LFBGA | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.25 V | 1.15 V | 1.2 V | 有 | 接触制造商 | INTEL CORP | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B256 | 182 | 不合格 | 182 | 645 CLBS | 1.5 mm | 现场可编程门阵列 | 10320 | 14 mm | 14 mm | |||||||||||||
![]() | EP3SE260F780C4N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | INTEL CORP | 接触制造商 | 有 | PLASTIC | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 100 MHz | BGA, BGA780,28X28,40 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 480 | 不合格 | 488 | 现场可编程门阵列 | 255000 | |||||||||||||||||||||||
![]() | EP1C12F324C8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | 275 MHz | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | BGA, | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B324 | 不合格 | 12060 CLBS | 2.2 mm | 现场可编程门阵列 | 12060 | 19 mm | 19 mm | ||||||||||||||||
![]() | EP2C20F256I7 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | 1.25 V | 1.15 V | 1.2 V | 无 | 活跃 | INTEL CORP | FBGA-256 | PLASTIC/EPOXY | e0 | 锡铅 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 136 | 不合格 | 152 | 1196 CLBS | 1.55 mm | 现场可编程门阵列 | 1196 | 18752 | 17 mm | 17 mm | |||||||||||||
![]() | EP1C6F256C8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | BGA, | 275 MHz | 85 °C | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 不合格 | OTHER | 5980 CLBS | 2.2 mm | 现场可编程门阵列 | 5980 | 17 mm | 17 mm | ||||||||||||||
![]() | EP1C3T144I6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 405 MHz | 3 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | 22 X 22 MM, 0.50 MM PITCH, LEAD FREE, TQFP-144 | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G144 | 不合格 | 2910 CLBS | 1.6 mm | 现场可编程门阵列 | 2910 | 20 mm | 20 mm | ||||||||||||||||
![]() | 10AX016E4F29M3LG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 活跃 | 有 | INTEL CORP | 8542.39.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066H4F34I3VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | FBGA-1152 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 0.93 V | 0.82 V | 0.85 V | 有 | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 492 | INDUSTRIAL | 492 | 25168 CLBS | 3.35 mm | 现场可编程门阵列 | 25168 | 660000 | 35 mm | 35 mm | ||||||||||||||
![]() | EP1C3T100C7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 320 MHz | 3 | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | TFQFP, | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | 2910 CLBS | 1.2 mm | 现场可编程门阵列 | 2910 | 14 mm | 14 mm | ||||||||||||||||
![]() | EP1C4F400I7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 400 | 320 MHz | PLASTIC/EPOXY | BGA | BGA400,20X20,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | BGA, | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B400 | 不合格 | 4000 CLBS | 2.2 mm | 现场可编程门阵列 | 4000 | 21 mm | 21 mm | ||||||||||||||||
![]() | EP1C3T144C7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 320 MHz | 3 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | LFQFP, | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G144 | 不合格 | 2910 CLBS | 1.6 mm | 现场可编程门阵列 | 2910 | 20 mm | 20 mm | ||||||||||||||||
![]() | EP1C4F324I8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | 1.5 V | 1.425 V | 1.575 V | 网格排列 | SQUARE | BGA324,18X18,40 | BGA | PLASTIC/EPOXY | 275 MHz | 无 | 活跃 | INTEL CORP | 19 X 19 MM, 1.0 MM PITCH, LEAD FREE, FBGA-324 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B324 | 不合格 | 4000 CLBS | 2.2 mm | 现场可编程门阵列 | 4000 | 19 mm | 19 mm | ||||||||||||||||
![]() | EP20K200CP208I8 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | INTEL CORP | , | 活跃 | 8542.39.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||||
![]() | EP3C80F780I6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | BGA, BGA780,28X28,40 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 1.2 V | 1.15 V | 1.25 V | 有 | 活跃 | INTEL CORP | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 429 | 不合格 | 429 | 5079 CLBS | 2.4 mm | 现场可编程门阵列 | 81264 | 29 mm | 29 mm | |||||||||||||
![]() | 5SGXEA5H2F35I2 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | FBGA-1152 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 0.93 V | 0.87 V | 0.9 V | 无 | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 552 | 不合格 | INDUSTRIAL | 552 | 18500 CLBS | 3.6 mm | 现场可编程门阵列 | 18500 | 490000 | 35 mm | 35 mm | |||||||||||||
![]() | EP1C4F400I6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 400 | 405 MHz | PLASTIC/EPOXY | BGA | BGA400,20X20,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | INTEL CORP | 21 X 21 MM, 1.00 MM PITCH, LEAD FREE, FBGA-400 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B400 | 不合格 | 4000 CLBS | 2.2 mm | 现场可编程门阵列 | 4000 | 21 mm | 21 mm | ||||||||||||||||
![]() | EP2C50F484I7N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 活跃 | INTEL CORP | LEAD FREE, FBGA-484 | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 有 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 40 | S-PBGA-B484 | 278 | 不合格 | 294 | 3182 CLBS | 2.6 mm | 现场可编程门阵列 | 3182 | 50528 | 23 mm | 23 mm | |||||||||||
![]() | 10AS048H4F34E3VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | 100 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 0.93 V | 0.82 V | 0.85 V | 有 | 活跃 | INTEL CORP | FBGA-1152 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 492 | OTHER | 492 | 18359 CLBS | 3.35 mm | 现场可编程门阵列 | 18359 | 480000 | 35 mm | 35 mm | |||||||||||||||
![]() | EP1S25F1508C5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 85 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | OTHER | 现场可编程门阵列 | 2566 | 25660 | 40 mm | 40 mm | ||||||||||||||||
![]() | EP2C50F672I6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 有 | 活跃 | INTEL CORP | LEAD FREE, FBGA-672 | PLASTIC/EPOXY | e1 | 锡银铜 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 434 | 不合格 | 450 | 3182 CLBS | 2.6 mm | 现场可编程门阵列 | 3182 | 50528 | 27 mm | 27 mm | |||||||||||||
![]() | 5CGXFC5C7F23C6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 活跃 | INTEL CORP | ROHS COMPLIANT, FBGA-484 | 85 °C | PLASTIC/EPOXY | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 240 | OTHER | 240 | 2908 CLBS | 2 mm | 现场可编程门阵列 | 23 mm | 23 mm | ||||||||||||||||||
![]() | 10AS057N4F40I3VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | FBGA-1517 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 0.93 V | 0.82 V | 0.85 V | 有 | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | 588 | INDUSTRIAL | 588 | 21708 CLBS | 3.5 mm | 现场可编程门阵列 | 21708 | 570000 | 40 mm | 40 mm | ||||||||||||||
![]() | EP4SE820H40C2N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | 网格排列 | 活跃 | INTEL CORP | HBGA-1517 | 85 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | OTHER | 325220 CLBS | 3.8 mm | 现场可编程门阵列 | 325220 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||
![]() | 10AX066 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Intel | Bulk | 活跃 | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | 10CL016 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Intel | Bulk | 活跃 | - |
EP3C10U256I6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3SE260F780C4N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C12F324C8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C20F256I7
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C6F256C8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C3T144I6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX016E4F29M3LG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AS066H4F34I3VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C3T100C7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C4F400I7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C3T144C7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C4F324I8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP20K200CP208I8
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3C80F780I6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5SGXEA5H2F35I2
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C4F400I6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C50F484I7N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AS048H4F34E3VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S25F1508C5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C50F672I6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CGXFC5C7F23C6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AS057N4F40I3VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4SE820H40C2N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AX066
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
10CL016
Intel
分类:Embedded - FPGAs (Field Programmable Gate Array)
