对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

表面安装

终端数量

厂商

系列

JESD-609代码

无铅代码

ECCN 代码

端子表面处理

附加功能

HTS代码

端子位置

终端形式

端子间距

Reach合规守则

引脚数量

JESD-30代码

输出的数量

资历状况

温度等级

传播延迟

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

输出功能

宏细胞数

JTAG BST

专用输入数量

系统内可编程

产品条款数量

长度

宽度

MDPLD910-20/B
MDPLD910-20/B
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Intel

Bulk

活跃

*

DPLD610-25
DPLD610-25
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

24

DIP

DIP, DIP24,.3

33.3 MHz

16

70 °C

CERAMIC, GLASS-SEALED

DIP

DIP24,.3

RECTANGULAR

IN-LINE

5.25 V

4.75 V

5 V

Obsolete

INTEL CORP

e0

锡铅

PAL WITH MACROCELLS; 16 MACROCELLS; 2 EXTERNAL CLOCKS; ASYNCHRONOUS CLOCKS

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

compliant

24

R-GDIP-T24

16

不合格

COMMERCIAL

25 ns

PAL-TYPE

20

4 DEDICATED INPUTS, 16 I/O

5.72 mm

UV PLD

MACROCELL

4

160

32.07 mm

7.62 mm

EPM2210F256I4
EPM2210F256I4
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

256

204

100 °C

-40 °C

PLASTIC

BGA

BGA256,16X16,40

SQUARE

网格排列

2.625 V

2.375 V

2.5 V

活跃

INTEL CORP

3

e0

3A991.D

锡铅

YES

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B256

204

不合格

9.1 ns

204

0 DEDICATED INPUTS, 204 I/O

闪存 PLD

MACROCELL

1700

YES

YES

17 mm

17 mm

EPM2210GF256I4
EPM2210GF256I4
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

256

204

100 °C

-40 °C

PLASTIC

BGA

BGA256,16X16,40

SQUARE

网格排列

1.89 V

1.71 V

1.8 V

活跃

INTEL CORP

3

e0

3A991.D

锡铅

YES

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B256

204

不合格

9.1 ns

204

0 DEDICATED INPUTS, 204 I/O

闪存 PLD

MACROCELL

1700

YES

YES

17 mm

17 mm

EPM570GT100I3N
EPM570GT100I3N
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

INTEL CORP

16 X 16 MM, 0.50 MM PITCH, LEAD FREE, TQFP-100

175.4 MHz

3

76

100 °C

-40 °C

PLASTIC/EPOXY

TFQFP

TQFP100,.63SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.89 V

1.71 V

1.8 V

活跃

e3

哑光锡

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G100

76

不合格

5.4 ns

76

0 DEDICATED INPUTS, 76 I/O

1.2 mm

闪存 PLD

MACROCELL

440

YES

YES

14 mm

14 mm

P85C220-10
P85C220-10
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

20

DIP

DIP, DIP20,.3

58.8 MHz

8

70 °C

PLASTIC/EPOXY

DIP

DIP20,.3

RECTANGULAR

IN-LINE

5.25 V

4.75 V

5 V

Obsolete

INTEL CORP

e0

锡铅

PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

compliant

20

R-PDIP-T20

8

不合格

COMMERCIAL

10 ns

PAL-TYPE

18

9 DEDICATED INPUTS, 8 I/O

5.08 mm

OT PLD

MACROCELL

9

72

25.55 mm

7.62 mm

EPM2210F256I3
EPM2210F256I3
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

256

204

100 °C

-40 °C

PLASTIC

BGA

BGA256,16X16,40

SQUARE

网格排列

2.625 V

2.375 V

2.5 V

活跃

INTEL CORP

3

e0

3A991.D

锡铅

YES

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B256

204

不合格

7 ns

204

0 DEDICATED INPUTS, 204 I/O

闪存 PLD

MACROCELL

1700

YES

YES

17 mm

17 mm

TN85C220-66
TN85C220-66
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

20

-40 °C

PLASTIC/EPOXY

DIP

DIP20,.3

RECTANGULAR

IN-LINE

5 V

Obsolete

INTEL CORP

DIP, DIP20,.3

66 MHz

85 °C

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

compliant

R-PDIP-T20

8

不合格

INDUSTRIAL

12 ns

PAL-TYPE

18

MACROCELL

72

P85C224-66
P85C224-66
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

24

DIP

DIP, DIP24,.3

66 MHz

8

70 °C

PLASTIC/EPOXY

DIP

DIP24,.3

RECTANGULAR

IN-LINE

5.25 V

4.75 V

5 V

Obsolete

INTEL CORP

e0

锡铅

PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

compliant

24

R-PDIP-T24

8

不合格

COMMERCIAL

12 ns

PAL-TYPE

22

13 DEDICATED INPUTS, 8 I/O

4.32 mm

OT PLD

MACROCELL

13

72

31.61 mm

7.62 mm

EPM2210F324I4N
EPM2210F324I4N
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

324

19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324

172.4 MHz

272

100 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA324,18X18,40

SQUARE

网格排列

2.625 V

2.375 V

2.5 V

活跃

INTEL CORP

e1

3A991.D

锡银铜

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B324

272

不合格

9.1 ns

272

0 DEDICATED INPUTS, 272 I/O

2.2 mm

闪存 PLD

MACROCELL

1700

YES

YES

19 mm

19 mm

TN5C090-50
TN5C090-50
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

5 V

Obsolete

INTEL CORP

QCCJ, LDCC44,.7SQ

20 MHz

85 °C

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

QUAD

J BEND

1.27 mm

compliant

S-PQCC-J44

24

不合格

INDUSTRIAL

PAL-TYPE

36

MACROCELL

240

EPM5192GI-1
EPM5192GI-1
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

84

62.5 MHz

64

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

网格排列

5.5 V

4.5 V

5 V

活跃

INTEL CORP

WINDOWED, CERAMIC, PGA-84

e0

锡铅

8542.39.00.01

PERPENDICULAR

PIN/PEG

compliant

S-CPGA-P84

不合格

INDUSTRIAL

25 ns

PAL-TYPE

7 DEDICATED INPUTS, 64 I/O

UV PLD

MACROCELL

192

7

EPM7064STI100-6N
EPM7064STI100-6N
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

85 °C

-40 °C

PLASTIC/EPOXY

QFP

TQFP100,.63SQ

SQUARE

FLATPACK

5.25 V

4.75 V

活跃

INTEL CORP

131.5 MHz

68

e3

Matte Tin (Sn)

YES

8542.39.00.01

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G100

68

不合格

INDUSTRIAL

6 ns

72

0 DEDICATED INPUTS, 68 I/O

EE PLD

64

NO

YES

14 mm

14 mm

TN5C180-90
TN5C180-90
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

68

QCCJ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

5 V

Obsolete

INTEL CORP

QCCJ, LDCC68,1.0SQ

85 °C

-40 °C

PLASTIC/EPOXY

e0

锡铅

NO

8542.39.00.01

QUAD

J BEND

1.27 mm

compliant

S-PQCC-J68

不合格

INDUSTRIAL

90 ns

OT PLD

48

NO

NO

EPM240M100I4N
EPM240M100I4N
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

网格排列

SQUARE

BGA100,11X11,20

BGA

PLASTIC/EPOXY

-40 °C

100 °C

80

166.6 MHz

6 X 6 MM, 0.50 MM PITCH, LEAD FREE, MICRO, FBGA-100

INTEL CORP

活跃

2.625 V

2.375 V

2.5 V

e1

锡银铜

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

BOTTOM

BALL

0.5 mm

compliant

S-PBGA-B100

80

不合格

6.1 ns

80

0 DEDICATED INPUTS, 80 I/O

闪存 PLD

MACROCELL

192

YES

YES

6 mm

6 mm

P85C224-80
P85C224-80
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

24

IN-LINE

RECTANGULAR

DIP24,.3

DIP

PLASTIC/EPOXY

70 °C

8

80 MHz

DIP, DIP24,.3

DIP

INTEL CORP

Obsolete

5 V

4.75 V

5.25 V

e0

锡铅

PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

compliant

24

R-PDIP-T24

8

不合格

COMMERCIAL

12 ns

PAL-TYPE

22

13 DEDICATED INPUTS, 8 I/O

4.32 mm

OT PLD

MACROCELL

13

72

31.61 mm

7.62 mm

EPM9560GI280-15
EPM9560GI280-15
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

280

INTEL CORP

CERAMIC, PGA-280

117.6 MHz

1

216

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

PGA

PGA280,19X19

SQUARE

网格排列

5.5 V

4.5 V

5 V

活跃

e0

3A991.D

锡铅

560 MACROCELLS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION - 3.3V OR 5V

8542.39.00.01

PERPENDICULAR

PIN/PEG

2.54 mm

compliant

S-CPGA-P280

不合格

INDUSTRIAL

16.6 ns

0 DEDICATED INPUTS, 216 I/O

5.08 mm

EE PLD

MACROCELL

560

YES

YES

49.78 mm

49.78 mm

EPM2210GF324I3N
EPM2210GF324I3N
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

324

19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324

172.4 MHz

272

100 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA324,18X18,40

SQUARE

网格排列

1.89 V

1.71 V

1.8 V

活跃

INTEL CORP

e1

3A991.D

锡银铜

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B324

272

不合格

7 ns

272

0 DEDICATED INPUTS, 272 I/O

2.2 mm

闪存 PLD

MACROCELL

1700

YES

YES

19 mm

19 mm

P85C224-7
P85C224-7
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

24

IN-LINE

RECTANGULAR

DIP24,.3

DIP

PLASTIC/EPOXY

70 °C

8

74 MHz

DIP, DIP24,.3

DIP

INTEL CORP

Obsolete

5 V

4.75 V

5.25 V

e0

锡铅

PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

compliant

24

R-PDIP-T24

8

不合格

COMMERCIAL

9 ns

PAL-TYPE

22

13 DEDICATED INPUTS, 8 I/O

4.32 mm

OT PLD

MACROCELL

13

72

31.61 mm

7.62 mm

P85C22V10-10
P85C22V10-10
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

24

DIP

DIP, DIP24,.3

95.2 MHz

10

70 °C

PLASTIC/EPOXY

DIP

DIP24,.3

RECTANGULAR

IN-LINE

5.25 V

4.75 V

5 V

Obsolete

INTEL CORP

e0

锡铅

PAL WITH MACROCELLS; 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

compliant

24

R-PDIP-T24

10

不合格

COMMERCIAL

10 ns

PAL-TYPE

22

11 DEDICATED INPUTS, 10 I/O

4.32 mm

OT PLD

MACROCELL

11

132

31.61 mm

7.62 mm

N85C220-100
N85C220-100
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

20

QLCC

QCCJ, LDCC20,.4SQ

100 MHz

8

70 °C

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

Obsolete

INTEL CORP

e0

锡铅

PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK

8542.39.00.01

QUAD

J BEND

1.27 mm

compliant

20

S-PQCC-J20

8

不合格

COMMERCIAL

9 ns

PAL-TYPE

18

9 DEDICATED INPUTS, 8 I/O

4.57 mm

OT PLD

MACROCELL

9

72

8.9662 mm

8.9662 mm

EPM570F100I3
EPM570F100I3
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

,

活跃

INTEL CORP

8542.39.00.01

compliant

EP20K400EBC652-1XN
EP20K400EBC652-1XN
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

652

85 °C

PLASTIC/EPOXY

BGA

BGA652,35X35,50

SQUARE

网格排列

1.89 V

1.71 V

1.8 V

Obsolete

INTEL CORP

BGA,

488

e1

3A991.D

锡银铜

8542.39.00.01

BOTTOM

BALL

1.27 mm

compliant

S-PBGA-B652

不合格

OTHER

1.57 ns

4 DEDICATED INPUTS, 488 I/O

3.5 mm

可加载 PLD

MACROCELL

4

45 mm

45 mm

EPM570F100C5
EPM570F100C5
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

活跃

,

INTEL CORP

8542.39.00.01

compliant

EP20K600CF1020C8
EP20K600CF1020C8
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

INTEL CORP

活跃

8542.39.00.01

compliant