品牌是'Intel' (1712)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 越来越多的功能 | 外壳材料 | 供应商器件包装 | 插入材料 | 后壳材料,电镀 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | 连接器类型 | 定位的数量 | 颜色 | 应用 | HTS代码 | 紧固类型 | 额定电流 | 端子位置 | 方向 | 终端形式 | 屏蔽/屏蔽 | 峰值回流焊温度(摄氏度) | 入口保护 | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 外壳完成 | 外壳尺寸-插入 | JESD-30代码 | 输出的数量 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 速度 | 内存大小 | 外壳尺寸,MIL | 核心处理器 | 周边设备 | 连接方式 | 电缆开口 | 建筑学 | 输入数量 | 可编程逻辑类型 | 主要属性 | 逻辑单元数 | 闪光大小 | 特征 | 座位高度(最大) | 长度 | 宽度 | 触点表面处理厚度 - 配套 | 材料可燃性等级 | RoHS状态 | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | 10AS027E2F27E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-BBGA, FCBGA | YES | 240 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B672 | 240 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 现场可编程门阵列 | FPGA - 270K Logic Elements | 270000 | 3.25mm | 27mm | 27mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
![]() | 10AS022E3F27I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-BBGA, FCBGA | YES | 240 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B672 | 240 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 现场可编程门阵列 | FPGA - 220K Logic Elements | 220000 | 3.25mm | 27mm | 27mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032E2F27E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-BBGA, FCBGA | YES | 240 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B672 | 240 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 现场可编程门阵列 | FPGA - 320K Logic Elements | 320000 | 3.25mm | 27mm | 27mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
![]() | 10AS022E3F29E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 780-BBGA, FCBGA | YES | 288 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B780 | 288 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 现场可编程门阵列 | FPGA - 220K Logic Elements | 220000 | 3.35mm | 29mm | 29mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
![]() | 10AS016E3F27I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-BBGA, FCBGA | YES | 240 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B672 | 240 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 现场可编程门阵列 | FPGA - 160K Logic Elements | 160000 | 3.25mm | 27mm | 27mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027E2F27I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-BBGA, FCBGA | YES | 240 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B672 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 270K Logic Elements | 3.25mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027E1F27I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-BBGA, FCBGA | YES | 240 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B672 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 270K Logic Elements | 3.25mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS022E3F27E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-BBGA, FCBGA | YES | 240 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B672 | 240 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 现场可编程门阵列 | FPGA - 220K Logic Elements | 220000 | 3.25mm | 27mm | 27mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
![]() | 10AS022E3F29I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 780-BBGA, FCBGA | YES | 288 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B780 | 288 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 现场可编程门阵列 | FPGA - 220K Logic Elements | 220000 | 3.35mm | 29mm | 29mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032E1F27I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-BBGA, FCBGA | YES | 240 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B672 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 320K Logic Elements | 3.25mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032E1F27E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-BBGA, FCBGA | YES | 240 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B672 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 320K Logic Elements | 3.25mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXFB5H6F40C6N | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | MCU - 208, FPGA - 540 | 0°C~85°C TJ | Tray | Arria V SX | 活跃 | 3 (168 Hours) | 5ASXFB5 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 462K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K4F35I4SGES | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | 396 | -40°C~100°C TJ | Tray | Arria 10 SX | Obsolete | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 660K Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066H4F34I4SGES | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | 492 | -40°C~100°C TJ | Tray | Arria 10 SX | Obsolete | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 660K Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057K2F35E1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 1152-BBGA, FCBGA | 396 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 570K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA5U19I7LN | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 484-FBGA | MCU - 151, FPGA - 66 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | 活跃 | compliant | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 85K Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048H2F34E1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 1152-BBGA, FCBGA | 492 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 480K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB008R16A2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | 3707-600500-NBR | Name Brand Replacements™ | 384 | Tray | 活跃 | Intel | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA027R31C2I1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | 3336435 | cUL, UL | Rittal | 720 | Tray | 活跃 | Intel | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFC023R25A3E3E | Intel | 数据表 | 672 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Tray | 活跃 | Intel | 480 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB012R24C2I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Tray | 活跃 | Intel | 744 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA008R16A2E2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Free Hanging (In-Line) | - | - | Aluminum | - | - | - | Gold | 活跃 | MS27467E25B | Metal | Bulk | Amphenol Aerospace Operations | - | 384 | Copper Alloy | -65°C ~ 175°C | Military, MIL-DTL-38999 Series I, LJT | Crimp | Plug, Male Pins | 19 | 橄榄色 | Aviation, Military | 卡口锁 | - | A | Shielded | 抗环境干扰 | 橄榄色镉包镍 | 25-19 | 1.4GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MPU, FPGA | FPGA - 764K Logic Elements | - | 联接螺母 | 50.0µin (1.27µm) | - | ||||||||||||||||||||||||||||||||||
![]() | AGFA014R24B2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | 活跃 | 768 | Kamaya Inc. | Tape & Reel (TR) | 0°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB012R24B3E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Tray | 活跃 | Intel | 768 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGID019R18A1E1V | Intel | 数据表 | 553 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Tray | 活跃 | Intel | 480 | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - |
10AS027E2F27E1SG
Intel
分类:Embedded - System On Chip (SoC)
10AS022E3F27I1SG
Intel
分类:Embedded - System On Chip (SoC)
10AS032E2F27E1SG
Intel
分类:Embedded - System On Chip (SoC)
10AS022E3F29E1SG
Intel
分类:Embedded - System On Chip (SoC)
10AS016E3F27I1SG
Intel
分类:Embedded - System On Chip (SoC)
10AS027E2F27I1SG
Intel
分类:Embedded - System On Chip (SoC)
10AS027E1F27I1SG
Intel
分类:Embedded - System On Chip (SoC)
10AS022E3F27E1SG
Intel
分类:Embedded - System On Chip (SoC)
10AS022E3F29I1SG
Intel
分类:Embedded - System On Chip (SoC)
10AS032E1F27I1SG
Intel
分类:Embedded - System On Chip (SoC)
10AS032E1F27E1SG
Intel
分类:Embedded - System On Chip (SoC)
5ASXFB5H6F40C6N
Intel
分类:Embedded - System On Chip (SoC)
10AS066K4F35I4SGES
Intel
分类:Embedded - System On Chip (SoC)
10AS066H4F34I4SGES
Intel
分类:Embedded - System On Chip (SoC)
10AS057K2F35E1HG
Intel
分类:Embedded - System On Chip (SoC)
5CSEBA5U19I7LN
Intel
分类:Embedded - System On Chip (SoC)
10AS048H2F34E1HG
Intel
分类:Embedded - System On Chip (SoC)
AGFB008R16A2E3V
Intel
分类:Embedded - System On Chip (SoC)
AGFA027R31C2I1V
Intel
分类:Embedded - System On Chip (SoC)
AGFC023R25A3E3E
Intel
分类:Embedded - System On Chip (SoC)
90,926.649054
AGFB012R24C2I3V
Intel
分类:Embedded - System On Chip (SoC)
AGFA008R16A2E2V
Intel
分类:Embedded - System On Chip (SoC)
AGFA014R24B2E3V
Intel
分类:Embedded - System On Chip (SoC)
AGFB012R24B3E3E
Intel
分类:Embedded - System On Chip (SoC)
AGID019R18A1E1V
Intel
分类:Embedded - System On Chip (SoC)
237,517.605837
