品牌是'Intel' (1712)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 越来越多的功能 | 外壳材料 | 供应商器件包装 | 插入材料 | 后壳材料,电镀 | 第一种连接器安装类型 | 第二个连接器安装类型 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 终止次数 | 终端 | 温度系数 | 连接器类型 | 电阻 | 定位的数量 | 最高工作温度 | 最小工作温度 | 组成 | 颜色 | 应用 | 性别 | 功率(瓦特) | 电容量 | 紧固类型 | 额定电流 | 电压 - 供电 | 方向 | 屏蔽/屏蔽 | 入口保护 | 深度 | 样式 | 外壳完成 | 外壳尺寸-插入 | 功能 | 接头数量 | 失败率 | 引线间距 | 镀层 | 速度 | 内存大小 | 外壳尺寸,MIL | 引线样式 | 核心处理器 | 周边设备 | 连接方式 | 电缆开口 | 建筑学 | 第一个连接器 | 第二个连接器 | 主要属性 | 闪光大小 | 抽头/步数 | 独立延误次数 | 第一拍延迟 | 可用总延误 | 特征 | 触点增量 | 座位高度(最大) | 长度 | 厚度(最大) | 触点表面处理厚度 - 配套 | 材料可燃性等级 | 辐射硬化 | 评级结果 | |||||||||||||||||
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![]() | AGFB006R24C3E3V | Intel | 数据表 | 721 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Gold | Bulkhead, Front Side Nut, Jam Nut, Panel | - | - | Intel | Compliant | 576 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Bulk | Agilex F | Crimp | Crimp, Receptacle | 66 | 175 °C | -65 °C | Female | Threaded | Straight | 46.02 mm | 66 | Cadmium | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | 31.57 mm | 无 | 抗环境干扰 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB006R24C2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 576 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA012R24C3E3V | Intel | 数据表 | 801 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Non-Compliant | 744 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA027R25A3E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Non-Compliant | 624 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX040HH3F35E3XG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 374 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGIB022R31B2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 720 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB014R24C2I2V | Intel | 数据表 | 501 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 744 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA019R25A2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 480 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA012R24B1I1V | Intel | 数据表 | 657 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 768 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB019R25A2I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 480 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA022R31C2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 720 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGID023R18A2E1V | Intel | 数据表 | 512 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | Tray | 480 | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R24C2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 744 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA023R25A1I1V | Intel | 数据表 | 748 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8-uMAX/uSOP | Analog Devices Inc./Maxim Integrated | Tube | DS1100 | Obsolete | 480 | -40°C ~ 85°C | - | 4.75V ~ 5.25V | Nonprogrammable | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | 5 | 1 | 100ns | 500ns | 100 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFC019R25A2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 0402 (1005 Metric) | 0402 | KOA Speer Electronics, Inc. | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | RN73H1E | 活跃 | 480 | -55°C ~ 155°C | RN73H | 0.039 L x 0.020 W (1.00mm x 0.50mm) | ±0.5% | 2 | ±50ppm/°C | 10.1 Ohms | Metal Film | 0.063W, 1/16W | - | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | Automotive AEC-Q200, Moisture Resistant | 0.016 (0.40mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R31C2I3V | Intel | 数据表 | 817 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Free Hanging (In-Line) | Free Hanging (In-Line) | Female | Bulk | 50 Ohms | UFL-2HF | - | 活跃 | Female | 6 GHz | - | 1.13mm OD Coaxial Cable | Hirose Electric Co Ltd | 720 | -40°C ~ 90°C | U.FL | Gray | - | U.FL (UMCC) to U.FL (UMCC) | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | U.FL (UMCC) Plug, Right Angle | U.FL (UMCC) Plug, Right Angle | FPGA - 2.7M Logic Elements | - | - | 2.756 (70.00mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB012R24B2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Panel Mount, Through Hole | - | - | 不锈钢 | - | 氟硅弹性体 | - | 镍铁合金 | Gold | 768 | TE Connectivity Deutsch 连接器 | 600VAC, 850VDC | Bulk | Metal | D38999/25HE | 活跃 | -65°C ~ 200°C | MIL-DTL-38999 Series III, DTS | Solder | Receptacle, Female Sockets | 23 | Silver | Aviation, Communication Systems, Industrial | Threaded | - | D | Shielded | 抗环境干扰 | 化学镍 | 17-99 | 1.4GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MPU, FPGA | FPGA - 1.2M Logic Elements | - | 密封 | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB008R16A2E3E | Intel | 数据表 | 969 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 0805 (2012 Metric) | 0805 | KOA Speer Electronics, Inc. | Tape & Reel (TR) | RS73G2A | 活跃 | 384 | -55°C ~ 155°C | RS73 | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±1% | 2 | ±50ppm/°C | 4.22 MOhms | 厚膜 | 0.25W, 1/4W | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | Automotive AEC-Q200, Moisture Resistant | 0.024 (0.60mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R31C2E1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | TE Connectivity Deutsch 连接器 | Bag | DL66G12 | 活跃 | 720 | 0°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA008R16A2I2V | Intel | 数据表 | 666 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Molex | Bulk | 173114 | 活跃 | 384 | -40°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA023R25A3I3E | Intel | 数据表 | 981 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Molex | Bulk | 120122 | 活跃 | 480 | -40°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA019R25A2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | Radial, Disc | - | Vishay Beyschlag/Draloric/BC Components | Bulk | 活跃 | 440VAC | 480 | -40°C ~ 125°C | WYO | 0.256 Dia (6.50mm) | ±20% | Y5U (E) | Safety | 1000 pF | - | 0.197 (5.00mm) | 1.4GHz | 256KB | Straight | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | - | 0.374 (9.50mm) | - | X1, Y2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA027R31C3E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1206 (3216 Metric) | 1206 | KOA Speer Electronics, Inc. | Tape & Reel (TR) | RN732B | Obsolete | 720 | -55°C ~ 155°C | RN73 | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±1% | 2 | ±50ppm/°C | 111 Ohms | Thin Film | 0.125W, 1/8W | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | Moisture Resistant | 0.028 (0.70mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA012R24B2E3V | Intel | 数据表 | 819 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 768 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB022R25A3E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 624 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - |
AGFB006R24C3E3V
Intel
分类:Embedded - System On Chip (SoC)
33,348.815873
AGFB006R24C2I3E
Intel
分类:Embedded - System On Chip (SoC)
AGFA012R24C3E3V
Intel
分类:Embedded - System On Chip (SoC)
55,665.913282
AGFA027R25A3E3E
Intel
分类:Embedded - System On Chip (SoC)
1SX040HH3F35E3XG
Intel
分类:Embedded - System On Chip (SoC)
AGIB022R31B2E3E
Intel
分类:Embedded - System On Chip (SoC)
AGFB014R24C2I2V
Intel
分类:Embedded - System On Chip (SoC)
134,790.949146
AGFA019R25A2I3E
Intel
分类:Embedded - System On Chip (SoC)
AGFA012R24B1I1V
Intel
分类:Embedded - System On Chip (SoC)
104,263.016690
AGFB019R25A2I3V
Intel
分类:Embedded - System On Chip (SoC)
AGFA022R31C2I3E
Intel
分类:Embedded - System On Chip (SoC)
AGID023R18A2E1V
Intel
分类:Embedded - System On Chip (SoC)
247,837.885991
AGFB027R24C2E3V
Intel
分类:Embedded - System On Chip (SoC)
AGFA023R25A1I1V
Intel
分类:Embedded - System On Chip (SoC)
197,734.039091
AGFC019R25A2I3E
Intel
分类:Embedded - System On Chip (SoC)
AGFB027R31C2I3V
Intel
分类:Embedded - System On Chip (SoC)
224,602.727428
AGFB012R24B2E3V
Intel
分类:Embedded - System On Chip (SoC)
AGFB008R16A2E3E
Intel
分类:Embedded - System On Chip (SoC)
71,897.835508
AGFB027R31C2E1V
Intel
分类:Embedded - System On Chip (SoC)
AGFA008R16A2I2V
Intel
分类:Embedded - System On Chip (SoC)
86,115.647602
AGFA023R25A3I3E
Intel
分类:Embedded - System On Chip (SoC)
98,061.427992
AGFA019R25A2E3E
Intel
分类:Embedded - System On Chip (SoC)
AGFA027R31C3E3E
Intel
分类:Embedded - System On Chip (SoC)
AGFA012R24B2E3V
Intel
分类:Embedded - System On Chip (SoC)
57,933.300847
AGFB022R25A3E3E
Intel
分类:Embedded - System On Chip (SoC)
