N/A

-

表面贴装

100-TQFP

100-TQFP (14x14)

微芯片技术

Tray

活跃

-40°C ~ 105°C

Automotive, AEC-Q100

1.71V ~ 3.47V, 3.14V ~ 3.47V

I²C, SPI

12 b

2 Wire Capacitive

Internal

N/A

-

表面贴装

20-VFQFN Exposed Pad

20-VQFN (3x3)

微芯片技术

EV54M59A

GPIO, UART

+ 85 C

- 40 C

SMD/SMT

6 Input

6 Output

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

5.5 V

2 V

-40°C ~ 85°C

-

Buttons

2V ~ 5.5V

Digital

-

6

-

有

Touch Controller

Up to 6

N/A

-

N/A

-

N/A

-

N/A

-

N/A

-

N/A

-

N/A

-

N/A

-

N/A

-

表面贴装

88-UFBGA

88-UFBGA (6x6)

-40°C ~ 85°C

Tray

maXTouch?

活跃

1.71V ~ 3.47V, 3.14V ~ 3.47V

I2C, SPI

40 mA

2 Wire Capacitive

Internal

N/A

-

YES

56

Compliant

EAR99

8542.31.00.01

I2C

3.3

3.47

-40

85

汽车

UQFN

UQFN-56

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

UNSPECIFIED

-40 °C

85 °C

ATMXT224S-MAUR033

3.3 V

HVQCCN

SQUARE

Microchip Technology Inc

活跃

MICROCHIP TECHNOLOGY INC

5

卷带

活跃

QUAD

无铅

1

0.35 mm

compliant

56

S-XQCC-N56

3.47 V

INDUSTRIAL

2.7 V

模拟电路

0.6 mm

6 mm

6 mm

N/A

-

EAR99

8542.31.00.01

N/A

-

YES

32

有

CAP1014-1-EZK-TR

3.3 V

HVQCCN

SQUARE

Microchip Technology Inc

Obsolete

MICROCHIP TECHNOLOGY INC

5.6

QFN

Compliant

EAR99

无

无

表面贴装

1(Max)

5

5

32

QFN

QFN EP

No Lead

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

UNSPECIFIED

-40 °C

40

125 °C

卷带

e3

Obsolete

哑光锡

8542.39.00.01

QUAD

无铅

260

1

0.5 mm

unknown

32

S-XQCC-N32

不合格

3.6 V

AUTOMOTIVE

3 V

模拟电路

1 mm

5 mm

5 mm

N/A

-

YES

24

QFN

QFN EP

No Lead

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

UNSPECIFIED

未说明

100 °C

有

CAP1088-1-CP-TR

3.3 V

HVQCCN

SQUARE

Microchip Technology Inc

不推荐

MICROCHIP TECHNOLOGY INC

5.15

QFN

Compliant

EAR99

无

无

8

8 Key

无

无

SMBus/I2C|SMSC BC-Link|SPI

表面贴装

1(Max)

4

4

24

卷带

e3

NRND

Capacitive

哑光锡

8542.39.00.01

QUAD

无铅

未说明

1

0.5 mm

compliant

24

S-XQCC-N24

不合格

3.6 V

OTHER

3 V

模拟电路

1 mm

4 mm

4 mm

N/A

-

N/A

-

微芯片技术

活跃

Tape & Reel (TR)

*

N/A

-

表面贴装

16-VFQFN Exposed Pad

16-QFN (3x3)

微芯片技术

- 40 C

SMD/SMT

3 Input

3 Output

Tube

活跃

5.5 V

2 V

GPIO, UART

+ 85 C

-40°C ~ 85°C

-

Buttons

2V ~ 5.5V

Digital

-

3

-

有

Touch Controller

Up to 3

N/A

-

表面贴装

20-SSOP (0.209, 5.30mm Width)

20-SSOP

微芯片技术

EV54M59A

GPIO, UART

+ 85 C

- 40 C

SMD/SMT

6 Input

6 Output

Tube

活跃

5.5 V

2 V

-40°C ~ 85°C

-

Buttons

2V ~ 5.5V

Digital

-

6

-

有

Touch Controller

Up to 6

N/A

-

表面贴装

14-TSSOP (0.173, 4.40mm Width)

14-TSSOP

微芯片技术

- 40 C

SMD/SMT

3 Input

3 Output

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

5.5 V

2 V

GPIO, UART

+ 85 C

-40°C ~ 85°C

-

Buttons

2V ~ 5.5V

Digital

-

3

-

有

Touch Controller

Up to 3

N/A

-

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-VQFN (7x7)

微芯片技术

7 mm x 7 mm x 0.9 mm

+ 85 C

- 40 C

I2C, SPI

Tray

活跃

-40°C ~ 105°C (TA)

maXTouch®

3.3V

1 Channel

I²C

- 40 C to + 85 C

Capacitance-to-Digital Converter

-

2 Wire Capacitive

-

N/A

-

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-VQFN (7x7)

微芯片技术

7 mm x 7 mm x 0.9 mm

+ 105 C

- 40 C

I2C, SPI

活跃

Tape & Reel (TR)

-40°C ~ 85°C

maXTouch®

3.3V

1 Channel

I²C

- 40 C to + 105 C

Capacitance-to-Digital Converter

-

2 Wire Capacitive

-

N/A

-

N/A

-

N/A

-